NGTB60N65FL2WG [ONSEMI]

IGBT,650V,60A,场截止 2 IGBT;
NGTB60N65FL2WG
型号: NGTB60N65FL2WG
厂家: ONSEMI    ONSEMI
描述:

IGBT,650V,60A,场截止 2 IGBT

局域网 双极性晶体管 功率控制
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中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
IGBT - Field Stop II  
NGTB60N65FL2WG  
This Insulated Gate Bipolar Transistor (IGBT) features a robust and  
cost effective Field Stop (FS) Trench construction, and provides  
superior performance in demanding switching applications, offering  
both low on state voltage and minimal switching loss.  
60 A, 650 V  
VCEsat = 1.64 V  
Eoff = 0.66 mJ  
C
Features  
Extremely Efficient Trench with Field Stop Technology  
G
T  
= 175°C  
Jmax  
Soft Fast Reverse Recovery Diode  
Optimized for High Speed Switching  
5 ms ShortCircuit Capability  
These are PbFree Devices  
E
Typical Applications  
Solar Inverters  
Uninterruptible Power Supplies (UPS)  
Welding  
G
C
E
TO247  
CASE 340AM  
ABSOLUTE MAXIMUM RATINGS  
Rating  
Collectoremitter Voltage  
Collector Current  
Symbol  
V
Value  
Unit  
V
MARKING DIAGRAM  
650  
CES  
I
C
A
@ T = 25°C  
100  
60  
C
@ T = 100°C  
C
Diode Forward Current  
I
F
A
60N65FL2  
AYWWG  
@ T = 25°C  
100  
60  
C
@ T = 100°C  
C
Diode Pulsed Current  
I
240  
240  
5
A
A
FM  
T
Limited by T Max  
PULSE  
J
Pulsed Collector Current, T  
I
pulse  
CM  
Limited by T  
Jmax  
Shortcircuit Withstand Time  
t
ms  
SC  
60N65FL2 = Specific Device Code  
V
J
= 15 V, V = 400 V,  
GE  
CE  
A
Y
= Assembly Location  
= Year  
T +150°C  
Gateemitter Voltage  
V
GE  
20  
30  
V
WW  
G
= Work Week  
= PbFree Package  
Transient Gateemitter Voltage  
(T  
PULSE  
= 5 ms, D < 0.10)  
Power Dissipation  
P
W
D
ORDERING INFORMATION  
@ T = 25°C  
595  
265  
C
@ T = 100°C  
C
Device  
NGTB60N65FL2WG  
Package  
Shipping  
30 Units / Rail  
Operating Junction Temperature  
Range  
T
55 to +175  
°C  
J
TO247  
(PbFree)  
Storage Temperature Range  
T
55 to +175  
°C  
°C  
stg  
Lead temperature for soldering, 1/8″  
from case for 5 seconds  
T
SLD  
260  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
October, 2021 Rev. 2  
NGTB60N65FL2W/D  
NGTB60N65FL2WG  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Value  
0.28  
0.62  
40  
Unit  
°C/W  
°C/W  
°C/W  
Thermal resistance junctiontocase, for IGBT  
Thermal resistance junctiontocase, for Diode  
Thermal resistance junctiontoambient  
R
q
JC  
R
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
STATIC CHARACTERISTIC  
Collectoremitter breakdown voltage,  
gateemitter shortcircuited  
V
= 0 V, I = 500 mA  
V
(BR)CES  
650  
V
V
GE  
C
Collectoremitter saturation voltage  
V
= 15 V, I = 60 A  
V
CEsat  
1.50  
1.64  
2.00  
2.00  
GE  
C
V
GE  
= 15 V, I = 60 A, T = 175°C  
C
J
Gateemitter threshold voltage  
V
V
= V , I = 350 mA  
V
4.5  
5.5  
6.5  
V
GE  
CE  
C
GE(th)  
Collectoremitter cutoff current, gate−  
emitter shortcircuited  
= 0 V, V = 650 V  
I
5.0  
0.1  
mA  
GE  
CE  
CES  
V
GE  
= 0 V, V = 650 V, T 175°C  
CE  
J =  
Gate leakage current, collectoremitter  
shortcircuited  
V
= 20 V , V = 0 V  
I
200  
nA  
pF  
GE  
CE  
GES  
DYNAMIC CHARACTERISTIC  
Input capacitance  
C
7193  
311  
202  
318  
65  
ies  
Output capacitance  
C
oes  
V
= 20 V, V = 0 V, f = 1 MHz  
GE  
CE  
Reverse transfer capacitance  
Gate charge total  
C
res  
Q
nC  
ns  
g
Gate to emitter charge  
Gate to collector charge  
Q
Q
V
CE  
= 480 V, I = 60 A, V = 15 V  
ge  
gc  
C
GE  
163  
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
Turnon delay time  
Rise time  
t
117  
53  
d(on)  
t
r
Turnoff delay time  
t
265  
75  
T = 25°C  
d(off)  
J
V
= 400 V, I = 60 A  
CC  
C
Fall time  
t
f
R = 10 W  
GE  
g
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
Turnon delay time  
Rise time  
V
= 0 V/ 15 V  
E
E
1.59  
0.66  
2.25  
113  
55  
mJ  
ns  
on  
off  
E
ts  
t
t
d(on)  
t
r
Turnoff delay time  
277  
1.0  
T = 150°C  
d(off)  
J
V
= 400 V, I = 60 A  
C
CC  
Fall time  
t
f
R = 10 W  
GE  
g
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
V
= 0 V/ 15 V  
E
E
2.0  
mJ  
on  
off  
1.1  
E
ts  
3.1  
DIODE CHARACTERISTIC  
Forward voltage  
V
= 0 V, I = 60 A  
V
F
1.50  
2.13  
2.26  
2.80  
V
GE  
F
V
GE  
= 0 V, I = 60 A, T = 175°C  
F
J
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
t
96  
0.39  
6.8  
ns  
mC  
A
rr  
T = 25°C  
J
Q
I = 60 A, V = 400 V  
rr  
F
R
di /dt = 200 A/ms  
F
I
rrm  
t
rr  
177  
1.53  
13  
ns  
mC  
A
T = 175°C  
J
Q
I = 60 A, V = 400 V  
rr  
F
R
di /dt = 200 A/ms  
F
I
rrm  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
NGTB60N65FL2WG  
TYPICAL CHARACTERISTICS  
200  
180  
160  
140  
120  
100  
80  
200  
180  
V
= 20 V  
to 15 V  
V
= 20 V  
to 13 V  
GE  
GE  
T = 25°C  
J
13 V  
160  
140  
120  
100  
80  
T = 150°C  
J
11 V  
11 V  
10 V  
9 V  
10 V  
9 V  
60  
60  
40  
40  
8 V  
7 V  
8 V  
7 V  
20  
0
20  
0
0
1
2
3
4
5
6
7
8
0
0
0
1
2
3
4
5
6
7
8
V
, COLLECTOREMITTER VOLTAGE (V)  
V
, COLLECTOREMITTER VOLTAGE (V)  
CE  
CE  
Figure 1. Output Characteristics  
Figure 2. Output Characteristics  
160  
200  
180  
160  
140  
120  
100  
80  
V
GE  
= 20 V  
to 13 V  
T = 55°C  
J
140  
120  
100  
80  
11 V  
10 V  
60  
60  
40  
T = 150°C  
J
7 V  
40  
9 V  
8 V  
20  
0
20  
0
T = 25°C  
J
0
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
9
10 11 12 13  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
V
GE  
, GATEEMITTER VOLTAGE (V)  
Figure 3. Output Characteristics  
Figure 4. Typical Transfer Characteristics  
2.25  
2.00  
1.75  
1.50  
100,000  
10,000  
1000  
T = 25°C  
J
C
ies  
I = 60 A  
F
I = 50 A  
F
C
oes  
100  
C
res  
I = 25 A  
F
1.25  
1.00  
10  
1
75 50 25  
0
25 50 75 100 125 150 175 200  
10 20 30  
40 50  
60 70 80 90 100  
T , JUNCTION TEMPERATURE (°C)  
J
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
Figure 5. VF vs. TJ  
Figure 6. Typical Capacitance  
www.onsemi.com  
3
NGTB60N65FL2WG  
TYPICAL CHARACTERISTICS  
70  
60  
26  
23  
20  
17  
14  
T
CE  
= 480 V  
50  
40  
30  
20  
11  
8
V
CE  
= 480 V  
= 15 V  
= 60 A  
T = 150°C  
5
J
V
GE  
10  
0
I
C
2
T = 25°C  
J
1  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0
50  
100  
150  
200  
250  
300  
V , FORWARD VOLTAGE (V)  
F
Q , GATE CHARGE (nC)  
G
Figure 7. Diode Forward Characteristics  
Figure 8. Typical Gate Charge  
2.5  
2.0  
1.5  
1.0  
1000  
100  
10  
E
t
on  
d(off)  
t
d(on)  
t
t
f
E
r
off  
V
V
= 400 V  
= 15 V  
= 60 A  
CE  
V
V
= 400 V  
= 15 V  
CE  
GE  
0.5  
0
GE  
I
C
I
C
= 60 A  
Rg = 10 W  
Rg = 10 W  
80 100 120 140 160 180  
T , JUNCTION TEMPERATURE (°C)  
0
20  
40  
60  
80 100 120 140 160 180  
0
20  
40  
60  
T , JUNCTION TEMPERATURE (°C)  
J
J
Figure 9. Switching Loss vs. Temperature  
Figure 10. Switching Time vs. Temperature  
6
5
4
3
2
1
0
1000  
V
V
= 400 V  
= 15 V  
CE  
GE  
T = 150°C  
J
t
t
d(off)  
E
on  
Rg = 10 W  
t
f
100  
10  
d(on)  
E
off  
t
r
V
V
= 400 V  
= 15 V  
CE  
GE  
T = 150°C  
J
Rg = 10 W  
15 25  
35  
45  
55  
65  
75  
85  
95 105  
15 25  
35  
45  
55  
65  
75  
85  
95 105  
I , COLLECTOR CURRENT (A)  
C
I , COLLECTOR CURRENT (A)  
C
Figure 11. Switching Loss vs. IC  
Figure 12. Switching Time vs. IC  
www.onsemi.com  
4
NGTB60N65FL2WG  
TYPICAL CHARACTERISTICS  
10,000  
14  
12  
V
V
= 400 V  
= 15 V  
CE  
V
V
= 400 V  
= 15 V  
CE  
GE  
GE  
T = 150°C  
J
t
t
T = 150°C  
d(off)  
J
I
C
= 60 A  
10  
8
I
C
= 60 A  
1000  
d(on)  
E
on  
t
r
6
t
f
100  
10  
4
E
off  
2
0
5
15  
25  
35  
45  
55  
65  
75  
85  
5
15  
25  
35  
45  
55  
65  
75  
85  
Rg, GATE RESISTOR (W)  
Rg, GATE RESISTOR (W)  
Figure 13. Switching Loss vs. Rg  
Figure 14. Switching Time vs. Rg  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
1000  
V
= 15 V  
GE  
T = 150°C  
J
I
C
= 60 A  
E
E
t
t
on  
d(off)  
Rg = 10 W  
d(on)  
100  
10  
t
f
off  
t
r
V
= 15 V  
GE  
T = 150°C  
J
I
C
= 60 A  
0.5  
0
Rg = 10 W  
150 200 250 300 350 400 450 500 550 600  
, COLLECTOREMITTER VOLTAGE (V)  
150 200 250 300 350 400 450 500 550 600  
, COLLECTOREMITTER VOLTAGE (V)  
V
V
CE  
CE  
Figure 15. Switching Loss vs. VCE  
Figure 16. Switching Time vs. VCE  
1000  
100  
10  
1000  
100  
50 ms  
dc operation  
100 ms  
Single Nonrepetitive  
10  
1
1 ms  
Pulse T = 25°C  
C
1
Curves must be derated  
linearly with increase  
in temperature  
V
GE  
= 15 V, T = 150°C  
C
0.1  
1
10  
100  
1000  
1
10  
100  
1000  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
Figure 18. Reverse Bias Safe Operating Area  
Figure 17. Safe Operating Area  
www.onsemi.com  
5
NGTB60N65FL2WG  
TYPICAL CHARACTERISTICS  
175  
150  
125  
100  
75  
3.0  
2.5  
2.0  
1.5  
1.0  
T = 175°C, I = 60 A  
J
F
T = 175°C, I = 60 A  
J
F
T = 25°C, I = 60 A  
J
F
T = 25°C, I = 60 A  
J
F
50  
0.5  
0
25  
0
100  
300  
500  
700  
900  
1100  
100  
300  
500  
700  
900  
1100  
di /dt, DIODE CURRENT SLOPE (A/m)  
F
di /dt, DIODE CURRENT SLOPE (A/m)  
F
Figure 19. trr vs. diF/dt (VR = 400 V)  
Figure 20. Qrr vs. diF/dt (VR = 400 V)  
40  
2.50  
2.25  
2.00  
1.75  
1.50  
I = 60 A  
F
35  
30  
25  
20  
15  
10  
T = 175°C, I = 60 A  
J
F
I = 50 A  
F
I = 25 A  
F
T = 25°C, I = 60 A  
J
F
1.25  
1.00  
5
0
100  
300  
500  
700  
900  
1100  
75 50 25  
0
25 50 75 100 125 150 175 200  
di /dt, DIODE CURRENT SLOPE (A/m)  
F
T , JUNCTION TEMPERATURE (°C)  
J
Figure 21. Irm vs. diF/dt (VR = 400 V)  
Figure 22. VF vs. TJ  
www.onsemi.com  
6
NGTB60N65FL2WG  
TYPICAL CHARACTERISTICS  
1
0.1  
R
= 0.282  
q
JC  
50% Duty Cycle  
20%  
10%  
5%  
R
C
R
C
R
Junction  
Case  
1
1
2
2
n
n
R (°C/W) C (J/°C)  
i
i
0.0270  
0.0243  
0.0225  
0.0554  
0.1121  
0.0409  
0.0037  
0.0130  
0.0445  
0.0571  
0.0892  
0.7725  
0.01  
2%  
C
0.001  
Duty Factor = t /t  
1
2
Peak T = P  
x Z  
+ T  
JC C  
q
J
DM  
Single Pulse  
0.0001  
0.000001  
0.00001  
0.0001  
0.001  
ONPULSE WIDTH (s)  
0.01  
0.1  
1
Figure 23. IGBT Transient Thermal Impedance  
1
50% Duty Cycle  
R
= 0.622  
q
JC  
20%  
0.1  
10%  
5%  
R (°C/W) C (J/°C)  
i
i
R
C
R
C
R
Junction  
Case  
1
1
2
n
0.006394 0.000156  
0.007900 0.001266  
0.008527 0.003708  
2%  
0.025491  
0.022800  
0.121738  
0.363338  
0.003923  
0.013870  
0.008214  
0.275226  
0.01  
C
2
n
Single Pulse  
Duty Factor = t /t  
1
2
Peak T = P  
x Z  
+ T  
JC C  
q
J
DM  
0.001  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
ONPULSE WIDTH (s)  
Figure 24. Diode Transient Thermal Impedance  
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7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO247  
CASE 340AM  
ISSUE C  
DATE 07 SEP 2021  
GENERIC  
MARKING DIAGRAMS*  
XXXXXXXXX  
AYWWG  
XXXXXXXXX  
XXXXXXXXX  
AYWWG  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON77284F  
TO247  
PAGE 1 OF 1  
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