NL17SG00 [ONSEMI]
Single 2-Input NAND Gate;
| 型号： | NL17SG00 |
| 厂家： | 
ONSEMI |
| 描述： | Single 2-Input NAND Gate 栅 |
| 文件： | 总9页 (文件大小：117K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NL17SG00
Single 2-Input NAND Gate
The NL17SG00 MiniGatet is an advanced high−speed CMOS
2−input NAND gate in ultra−small footprint.
The NL17SG00 input structures provides protection when voltages
up to 4.6 V are applied.
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Features
• Wide Operating V Range: 0.9 V to 3.6 V
CC
MARKING
DIAGRAMS
• High Speed: t = 2.5 ns (Typ) at V = 3.0 V, C = 15 pF
PD
CC
L
• Low Power Dissipation: I = 0.5 mA (Max) at T = 25°C
CC
A
SOT−953
CASE 527AE
• 4.6 V Overvoltage Tolerant (OVT) Input Pins
• Ultra−Small Packages
T M
1
• These are Pb−Free and Halide−Free Devices
UDFN6
1.0 x 1.0
CASE 517BX
M
1
V
UDFN6
1.45 x 1.0
CASE 517AQ
IN A
1
2
3
6
5
CC
3M
IN A
GND
IN B
1
2
3
5
4
V
CC
5
NC
IN B
SC−88A
DF SUFFIX
CASE 419A
AW M G
G
1
OUT Y
OUT Y
M
= Date Code*
GND
4
G
= Pb−Free Package
(Note: Microdot may be in either location)
SOT−953
UDFN6
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
5
4
IN B
IN A
V
1
2
CC
SOT−953 SC−88A
UDFN6
1
2
3
4
IN A
GND
IN B
IN B
IN A
IN A
IN B
GND
OUT Y
GND
OUT Y
NC
OUT Y
OUT Y
GND
3
5
6
V
CC
V
CC
V
CC
SC−88A
FUNCTION TABLE
Figure 1. Pinout (Top View)
Input
Output
A
B
L
Y
H
H
H
L
L
L
H
L
H
H
H
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
March, 2014 − Rev. 4
NL17SG00/D
NL17SG00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
DC Input Voltage
DC Output Voltage
−0.5 to +5.5
−0.5 to +4.6
V
IN
V
V
OUT
Output at High or Low State
Power−Down Mode (V = 0 V)
−0.5 to V +0.5
V
CC
−0.5 to +4.6
CC
I
DC Input Diode Current
V
< GND
< GND
−20
mA
mA
mA
mA
mA
°C
IK
IN
OUT
I
DC Output Diode Current
V
−20
OK
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
20
OUT
I
20
CC
I
20
−65 to +150
260
GND
T
STG
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
°C
L
T
+150
°C
J
MSL
Level 1
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
>1500
>100
V
I
Latchup Performance Above V and Below GND at 125°C (Note 4)
100
mA
LATCHUP
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
0.9
0.0
Max
3.6
Unit
V
V
CC
Positive DC Supply Voltage
Digital Input Voltage
Output Voltage
V
IN
3.6
V
V
OUT
Output at High or Low State
Power−Down Mode (V = 0 V)
0.0
0.0
V
CC
V
3.6
+125
10
CC
T
A
Operating Temperature Range
Input Transition Rise or Fail Rate
−55
0
°C
Dt / DV
V
CC
= 3.3 V 0.3 V
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NL17SG00
DC ELECTRICAL CHARACTERISTICS
T
=
A
T
A
= 255C
-555C to +1255C
Min
Max
Min
Max
Unit
Symbol
Parameter
Conditions
V
CC
(V)
V
High-Level Input
Voltage
0.9
V
V
CC
V
IH
CC
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
0.7xV
0.7xV
CC
CC
0.65xV
0.65xV
1.7
0.65xV
0.65xV
1.7
CC
CC
CC
CC
2.0
2.0
V
Low-Level Input
Voltage
GND
0.3xV
GND
V
V
V
IL
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
0.3xV
CC
CC
0.35xV
0.35xV
0.7
0.35xV
0.35xV
0.7
CC
CC
CC
CC
0.8
0.8
V
OH
High-Level
V
=
or
IL
0.75
0.75xV
0.75xV
0.75
0.75xV
0.75xV
I
= −20 mA
IN
OH
V
IH
Output Voltage
I
I
I
I
I
= -0.3 mA
= -1.7 mA
= -3.0 mA
= -4.0 mA
= -8.0 mA
= 20 mA
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
OH
OH
OH
OH
CC
CC
CC
CC
V
Vcc-0.45
2.0
Vcc-0.45
2.0
2.48
2.48
OH
V
OL
Low-Level
V
IN
=
or
IL
0.1
0.25xV
0.25xV
0.45
0.1
0.25xV
0.25xV
0.45
I
OL
V
IH
Output Voltage
I
I
I
I
I
= 0.3 mA
= 1.7 mA
= 3.0 mA
= 4.0 mA
= 8.0 mA
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0 to 3.6
OL
OL
OL
OL
OL
CC
CC
CC
CC
V
0.4
0.4
0.4
0.4
I
IN
Input Leakage
Current
0 ≤ V ≤ 3.6 V
$0.1
$1.0
mA
mA
IN
I
Quiescent
V
= V or GND
3.6
0.5
10.0
CC
IN
CC
Supply Current
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NL17SG00
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns)
r
f
T
=
A
T
A
= 255 C
-555C to +1255C
Symbol
Parameter
Test Condition
V
CC
(V)
Min
Typ
11.0
8.6
5.9
4.5
2.9
2.2
13.75
9.0
6.5
5.0
3.2
2.5
17.0
11.2
8.6
5.0
4.4
3.5
3
Max
13.7
10.8
9.6
Min
Max
19.6
17.1
11.3
7.5
Unit
t
t
,
Propagation Delay,
A or B to Y
C = 10 pF,
R = 1 MW
L
0.9
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns
PLH
L
PHL
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
7.0
4.4
4.9
3.5
4.1
C = 15 pF,
R = 1 MW
L
16.7
11.2
10.5
7.7
20.0
17.4
12.6
8.0
ns
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
4.9
5.6
3.8
4.4
C = 30 pF,
R = 1 MW
L
21.0
14.8
10.3
7.5
24.4
20.5
17.9
10.8
6.8
ns
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0 to 3.6
6.4
4.9
5.4
C
Input Capacitance
-
-
pF
pF
IN
C
Power Dissipation
Capacitance (Note 5)
PD
f = 10 MHz
0.9 to 3.6
-
4
-
-
-
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
power consumption; P = C ꢀ V
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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4
NL17SG00
V
CC
50%
50%
A or B
GND
t
PLH
t
PHL
Y
50% V
CC
Figure 2. Switching Waveforms
V
CC
OUTPUT
INPUT
C
L*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended
for propagation delay tests.
Figure 3. Test Circuit
ORDERING INFORMATION
Device
†
Package
Shipping
NL17SG00P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
NL17SG00DFT2G
SC−88A
(Pb−Free)
NL17SG00AMUTCG*
NL17SG00CMUTCG*
UDFN6 1.45x1 mm
(Pb−Free)
UDFN6 1x1 mm
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*In Development.
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5
NL17SG00
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
NOTES:
X
Y
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
A
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5
4
3
PIN ONE
INDICATOR
H
E
E
1
2
MILLIMETERS
DIM MIN
NOM
0.37
0.15
0.12
1.00
MAX
0.40
0.20
0.17
1.05
0.85
A
b
0.34
0.10
0.07
0.95
0.75
C
TOP VIEW
e
C
D
SIDE VIEW
E
0.80
e
0.35 BSC
HE
0.95
1.00
1.05
0.175 REF
0.10
−−−
L
L2
L3
5X
L
0.05
−−−
0.15
0.15
5X
5X
L3
L2
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
b
0.08 X
Y
PACKAGE
OUTLINE
BOTTOM VIEW
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NL17SG00
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
NOTES:
A B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
REFERENCE
E
2X
0.10
C
MILLIMETERS
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.13 REF
2X
0.10
C
TOP VIEW
0.12
0.22
A3
D
E
e
L
1.00 BSC
1.00 BSC
0.35 BSC
0.05
C
C
A
0.25
0.30
0.35
0.40
L1
0.05
A1
SEATING
PLANE
C
SIDE VIEW
e
RECOMMENDED
SOLDERING FOOTPRINT*
5X
6X
5X L
0.48
0.22
3
1
L1
1.18
6
4
6X b
1
0.35
M
M
0.10
0.05
C A B
0.53
PKG
PITCH
OUTLINE
NOTE 3
C
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
NL17SG00
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
REFERENCE
OPTIONAL
E
MILLIMETERS
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
TOP VIEW
0.30
0.10
C
D
1.45 BSC
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
MOUNTING FOOTPRINT
6X
A1
6X
SEATING
PLANE
A2
C
SIDE VIEW
e
0.30
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
1
0.53
0.50
PITCH
DIMENSIONS: MILLIMETERS
6
4
6X b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10 C A B
NOTE 3
C
0.05
BOTTOM VIEW
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8
NL17SG00
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
A
ISSUE L
NOTES:
G
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
1
2
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
M
M
B
D 5 PL
0.2 (0.008)
0.026 BSC
0.65 BSC
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
N
K
N
S
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NL17SG00/D
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