NL17SZ00 [ONSEMI]
Single 2-Input NAND Gate; 单路2输入与非门
| 型号： | NL17SZ00 |
| 厂家： | 
ONSEMI |
| 描述： | Single 2-Input NAND Gate |
| 文件： | 总6页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NL17SZ00
Single 2−Input NAND Gate
The NL17SZ00 is a single 2−input NAND Gate in two tiny footprint
packages. The device performs much as LCX multi−gate products in
speed and drive.
Features
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• Tiny SOT−353 and SOT−553 Packages
• 2.7 ns T at 5 V (typ)
• Source/Sink 24 mA at 3.0 V
MARKING
DIAGRAMS
PD
5
• Over−Voltage Tolerant Inputs
5
• Pin For Pin with NC7SZ00P5X, TC7SZ00FU and TC7SZ00AFE
• Chip Complexity: FETs = 20
d
L1
1
SOT−353/SC70−5/SC−88A
DF SUFFIX
1
• Designed for 1.65 V to 5.5 V V Operation
CC
CASE 419A
• Pb−Free Packages are Available
d = Date Code
5
5
L1 D
1
1
SOT−553
XV5 SUFFIX
CASE 463B
5
4
B
A
V
Y
1
2
CC
L1 = Device Marking
= One Digit Date Code
D
GND
3
PIN ASSIGNMENT
Pin
Function
1
A
B
Figure 1. Pinout (Top View)
2
3
4
5
GND
Y
A
B
&
Y
V
CC
Figure 2. Logic Symbol
FUNCTION TABLE
Output
Input
Y = AB
A
L
B
L
Y
H
H
H
L
L
H
L
H
H
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
January, 2005 − Rev. 4
NL17SZ00/D
NL17SZ00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
*0.5 to )7.0
*0.5 to )7.0
V
IN
DC Input Voltage
V
V
OUT
DC Output Voltage
*0.5 to to V + 0.5
V
CC
I
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
*50
*50
mA
mA
mA
mA
°C
IK
I
OK
I
$50
OUT
I
$100
CC
T
*65 to )150
260
STG
T
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
°C
L
)150
°C
J
q
SOT−353 (Note 1)
SOT−553
350
496
°C/W
JA
P
D
Power Dissipation in Still Air at 85°C
SOT−353
SOT−553
186
135
mW
MSL
Moisture Sensitivity
Flammability Rating
ESD Classification
Level 1
F
R
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
ESD
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Class Z
Class A
N/A
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
1.65
0
Max
5.5
Unit
V
V
CC
DC Supply Voltage
V
IN
DC Input Voltage
5.5
V
V
OUT
DC Output Voltage
0
V
CC
+ 0.5
V
T
Operating Temperature Range
Input Rise and Fall Time
*40
)85
°C
ns/V
A
t , t
r
V
CC
V
CC
= 3.0 V $0.3 V
= 5.0 V $0.5 V
0
0
100
20
f
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2
NL17SZ00
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
*405C v T v 855C
A
V
CC
Min
Max
Min
Max
(V)
Symbol
Parameter
Condition
Unit
V
IH
High−Level Input Voltage
1.65 to 1.95 0.75 V
0.75 V
0.7 V
V
CC
CC
CC
CC
2.3 to 5.5
0.7 V
V
Low−Level Input Voltage
High−Level Output Voltage
1.65 to 1.95
2.3 to 5.5
0.25 V
0.3 V
0.25 V
0.3 V
V
V
IL
CC
CC
CC
CC
V
OH
I
= 100 mA
= −3 mA
= −8 mA
1.65 to 5.5
1.65
2.3
V
CC
− 0.1
V
V
CC
− 0.1
OH
CC
I
OH
V
IN
= V or V
IH
1.55
1.65
2.1
2.4
2.7
2.5
4.0
1.55
IL
I
OH
1.9
2.2
2.4
2.3
3.8
1.9
2.2
2.4
2.3
3.8
I
= −12 mA
= −16 mA
= −24 mA
= −32 mA
OH
2.7
I
OH
3.0
I
OH
I
OH
3.0
4.5
V
OL
Low−Level Output Voltage
= V or V
I
= 100 mA
1.65 to 5.5
1.65
2.3
0.1
0.24
0.3
0.1
0.24
0.3
V
OL
I
= 3 mA
= 8 mA
OL
V
0.08
0.20
0.22
0.28
0.38
0.42
IN
IH
OH
I
OL
I
= 12 mA
= 16 mA
= 24 mA
= 32 mA
OL
2.7
0.4
0.4
I
OL
3.0
0.4
0.4
I
OL
I
OL
3.0
0.55
0.55
0.55
0.55
4.5
I
Input Leakage Current
V
V
= V or GND
0 to 5.5
5.5
$0.1
$1.0
mA
mA
IN
IN
CC
I
Quiescent Supply Current
= V or GND
1
10
CC
IN
CC
AC ELECTRICAL CHARACTERISTICS t = t = 3.0 ns
R
F
T
A
= 255C
*405C v T v 855C
A
V
CC
Min
Typ
5.4
4.5
3.0
2.4
2.4
2.0
2.4
Max
11.4
9.5
6.5
4.5
5.0
3.9
4.3
Min
2.0
2.0
0.8
0.5
1.5
0.5
0.8
Max
(V)
1.65
1.8
Symbol
Parameter
Condition
R = 1 MW, C = 15 pF
Unit
t
t
Propagation Delay
(Figure 3 and 4)
2.0
2.0
0.8
0.5
1.5
0.5
0.8
12
ns
PLH
L
L
PHL
R = 1 MW, C = 15 pF
10.0
7.0
4.7
5.2
4.1
4.5
L
L
R = 1 MW, C = 15 pF
2.5 to 0.2
L
L
R = 1 MW, C = 15 pF
3.3 $ 0.3
L
L
R = 500 W, C = 50 pF
L
L
R = 1 MW, C = 15 pF
5.0 $ 0.5
L
L
R = 500 W, C = 50 pF
L
L
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
= 5.5 V, V = 0 V or V
Typical
u4
Unit
pF
C
Input Capacitance
V
CC
IN
I
CC
C
Power Dissipation Capacitance
(Note 5)
10 MHz, V = 3.3 V, V = 0 V or V
25
pF
PD
CC
I
CC
CC
10 MHz, V = 5.5 V, V = 0 V or V
30
CC
I
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption; P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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3
NL17SZ00
t = 3 ns
f
t = 3 ns
f
V
CC
V
CC
90%
50%
90%
50%
INPUT
A and B
10%
10%
OUTPUT
GND
INPUT
R
C
L
L
t
t
PHL
PLH
V
V
OH
OUTPUT Y
50%
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
OL
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Temp
Logic
No. of
Tape and
Device
Function
Package
Suffix
Circuit
Gates per
Range
Reel
Suffix
Device Order
Number
Package
Type
Tape and
Reel Size
†
Indicator Package Identifier
Technology
NL17SZ00DFT2
NL17SZ00DFT2G
NL17SZ00XV5T2
NL
NL
NL
1
1
1
7
7
7
SZ
00
00
00
DF
T2
T2
T2
SOT−353/
SC70−5/
SC−88A
178 mm,
3000 Units
SZ
SZ
DF
SOT−353/
SC70−5/
SC−88A
178 mm,
3000 Units
XV5
SOT−553*
178 mm
4000 units
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*All Devices in Package SOT553 are Inherently Pb−Free.
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4
NL17SZ00
PACKAGE DIMENSIONS
SOT−353
DF SUFFIX
5−LEAD PACKAGE
CASE 419A−02
ISSUE G
NOTES:
A
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
G
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
0.2 (0.008)
B
D 5 PL
−−−
0.004
0.004
0.004
0.010
0.012
−−−
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
NL17SZ00
PACKAGE DIMENSIONS
SOT−553
XV5 SUFFIX
5−LEAD PACKAGE
CASE 463B−01
ISSUE A
NOTES:
A
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
C
−X−
K
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
5
4
3
B
−Y−
S
1
2
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.067
0.051
0.024
0.011
A
B
C
D
G
J
1.50
1.10
0.50
0.17
1.70 0.059
1.30 0.043
0.60 0.020
0.27 0.007
D 5 PL
J
G
M
0.08 (0.003)
X Y
0.50 BSC
0.020 BSC
0.08
0.10
1.50
0.18 0.003
0.30 0.004
1.70 0.059
0.007
0.012
0.067
K
S
STYLE 1:
STYLE 2:
PIN 1. BASE 1
2. EMITTER 1/2
3. BASE 2
4. COLLECTOR 2
5. COLLECTOR 1
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
NL17SZ00/D
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