NL17SZ332 [ONSEMI]

Single 3-Input OR Gate;
NL17SZ332
型号: NL17SZ332
厂家: ONSEMI    ONSEMI
描述:

Single 3-Input OR Gate

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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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Single 3-Input OR Gate  
NL17SZ332  
The NL17SZ332 is a single 3input OR Gate in tiny footprint  
packages.  
Features  
Designed for 1.65 V to 5.5 V V Operation  
CC  
www.onsemi.com  
2.4 ns t at V = 5 V (Typ)  
PD  
CC  
Inputs/Outputs Overvoltage Tolerant up to 5.5 V  
MARKING  
DIAGRAMS  
I  
Supports Partial Power Down Protection  
Source/Sink 24 mA at 3.0 V  
OFF  
Chip Complexity < 100 FETs  
This Device is PbFree, Halogen Free/BFR Free and is RoHS  
Compliant  
SC74  
CASE 318F05  
XXM  
1
A
B
1  
UDFN6  
1.45 x 1.0  
CASE 517AQ  
Y
XM  
1
C
Figure 1. Logic Symbol  
UDFN6  
1.0 x 1.0  
X M  
1
CASE 517BX  
X, XX = Specific Device Code  
M
= Date Code  
G
= PbFree Package  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 6 of this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
September, 2020 Rev. 1  
NL17SZ332/D  
NL17SZ332  
1
2
3
6
5
4
A
GND  
B
1
2
3
6
5
4
C
A
GND  
B
C
V
V
Y
CC  
CC  
Y
SC74  
UDFN6  
Figure 2. Pinout (Top View)  
PIN ASSIGNMENT  
FUNCTION TABLE (Y = A + B + C)  
Pin  
1
Function  
Input  
Output  
A
GND  
B
A
H
X
X
L
B
X
H
X
L
C
Y
H
H
H
L
2
X
X
H
L
3
4
Y
5
V
CC  
6
C
H = HIGH Logic Level  
L = LOW Logic Level  
X = Either LOW or HIGH Logic Level  
www.onsemi.com  
2
NL17SZ332  
MAXIMUM RATINGS  
Symbol  
Characteristics  
Value  
Unit  
V
V
CC  
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
0.5 to +6.5  
0.5 to +6.5  
V
IN  
V
V
OUT  
ActiveMode (High or Low State)  
TriState Mode (Note 1)  
0.5 to V + 0.5  
V
CC  
0.5 to +6.5  
0.5 to +6.5  
PowerDown Mode (V = 0 V)  
CC  
I
DC Input Diode Current  
V
< GND  
< GND  
50  
50  
mA  
mA  
mA  
mA  
°C  
IK  
IN  
I
DC Output Diode Current  
V
OUT  
OK  
I
DC Output Source/Sink Current  
DC Supply Current per Supply Pin or Ground Pin  
Storage Temperature Range  
50  
OUT  
I
or I  
GND  
STG  
100  
CC  
T
65 to +150  
260  
T
Lead Temperature, 1 mm from Case for 10 secs  
Junction Temperature Under Bias  
Thermal Resistance (Note 2)  
°C  
L
T
+150  
°C  
J
q
SC74  
UDFN6  
320  
154  
°C/W  
JA  
P
D
Power Dissipation in Still Air  
SC74  
UDFN6  
390  
812  
mW  
MSL  
Moisture Sensitivity  
Level 1  
V
F
R
Flammability Rating  
Oxygen Index: 28 to 34  
UL 94 V0 @ 0.125 in  
V
ESD  
ESD Withstand Voltage (Note 3)  
Human Body Model  
Charged Device Model  
2000  
1000  
I
Latchup Performance (Note 4)  
$100  
mA  
Latchup  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Applicable to devices with outputs that may be tristated.  
2. Measured with minimum pad spacing on an FR4 board, using 10mmby1inch, 2 ounce copper trace no air flow per JESD517.  
3. HBM tested to ANSI/ESDA/JEDEC JS0012017. CDM tested to EIA/JESD22C101F. JEDEC recommends that ESD qualification to  
EIA/JESD22A115A (Machine Model) be discontinued per JEDEC/JEP172A.  
4. Tested to EIA/JESD78 Class II.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Characteristics  
Min  
1.65  
0
Max  
5.5  
Unit  
V
V
CC  
Positive DC Supply Voltage  
DC Input Voltage  
V
IN  
5.5  
V
V
OUT  
DC Output Voltage  
ActiveMode (High or Low State)  
TriState Mode (Note 1)  
0
0
0
V
CC  
5.5  
5.5  
PowerDown Mode (V = 0 V)  
CC  
T
Operating Temperature Range  
Input Rise and Fall Time  
55  
+125  
°C  
A
t , t  
r
V = 1.65 V to 1.95 V  
CC  
0
0
0
0
20  
20  
10  
5
ns/V  
f
V
CC  
V
CC  
V
CC  
= 2.3 V to 2.7 V  
= 3.0 V to 3.6 V  
= 4.5 V to 5.5 V  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
www.onsemi.com  
3
 
NL17SZ332  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 255C  
Typ  
555C 3 T 3 1255C  
A
V
(V)  
CC  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Condition  
Units  
1.65 to 1.95 0.65 V  
0.65 V  
V
HighLevel Input  
V
CC  
CC  
CC  
IH  
Voltage  
2.3 to 5.5  
1.65 to 1.95  
2.3 to 5.5  
0.70 V  
0.70 V  
CC  
0.35 V  
0.35 V  
V
LowLevel Input  
Voltage  
V
V
CC  
CC  
IL  
0.30 V  
0.30 V  
CC  
CC  
V
OH  
HighLevel Output  
Voltage  
V
= V or V  
IH IL  
IN  
I
= 100 mA  
= 4 mA  
1.65 to 5.5  
1.65  
2.3  
V
CC  
0.1  
V
CC  
V 0.1  
CC  
1.29  
OH  
OH  
I
1.29  
1.4  
2.1  
2.7  
2.5  
4.0  
I
= 8 mA  
1.9  
2.4  
2.3  
3.8  
1.9  
2.4  
2.3  
3.8  
OH  
I
= 16 mA  
= 24 mA  
= 32 mA  
3.0  
OH  
I
3.0  
4.5  
OH  
I
OH  
V
OL  
LowLevel Output  
Voltage  
V
= V or V  
V
IN  
IH  
IL  
I
= 100 mA  
= 4 mA  
1.65 to 5.5  
1.65  
2.3  
0.08  
0.2  
0.28  
0.38  
0.42  
0.1  
0.24  
0.3  
0.4  
0.55  
0.55  
0.1  
0.24  
0.3  
0.4  
0.55  
0.55  
OL  
OL  
I
I
OL  
= 8 mA  
OL  
I
= 16 mA  
= 24 mA  
= 32 mA  
3.0  
I
3.0  
4.5  
OL  
I
OL  
I
Input Leakage Current  
V
= 5.5 V or GND  
= 5.5 V or  
1.65 to 5.5  
0
0.1  
1.0  
1.0  
10  
mA  
mA  
IN  
IN  
I
Power Off Leakage  
Current  
V
V
OFF  
IN  
OUT  
= 5.5 V  
I
Quiescent Supply  
Current  
V
IN  
= V or GND  
5.5  
1.0  
10  
mA  
CC  
CC  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
AC ELECTRICAL CHARACTERISTICS  
T
= 255C  
555C 3 T 3 1255C  
A
A
V
(V)  
CC  
Min Typ Max  
Min  
Max  
19.0  
11.5  
8.0  
Symbol  
Parameter  
Condition  
Units  
t
Propagation Delay, A to Y  
(Figures 3 and 4)  
1.65 to 1.95  
2.3 to 2.7  
3.0 to 3.6  
6.5 18.5  
ns  
R = 1 MW, C = 15 pF  
PLH,  
PHL  
L
L
t
R = 1 MW, C = 15 pF  
3.0  
2.4  
1.9  
3.0  
2.4  
11.0  
7.5  
5.5  
8.5  
7.0  
L
L
R = 1 MW, C = 15 pF  
L
L
R = 500 W, C = 50 pF  
6.0  
L
L
4.5 to 5.5  
9.0  
R = 1 MW, C = 15 pF  
L
L
R = 500 W, C = 50 pF  
7.5  
L
L
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
Typical  
2.5  
Units  
pF  
C
V
= 5.5 V, V = 0 V or V  
CC IN  
IN  
CC  
CC  
C
Output Capacitance  
V
CC  
= 5.5 V, V = 0 V or V  
2.5  
pF  
OUT  
IN  
C
Power Dissipation Capacitance  
(Note 5)  
10 MHz, V = 3.3 V, V = 0 V or V  
9
11  
pF  
PD  
CC  
IN  
CC  
CC  
10 MHz, V = 5.5 V, V = 0 V or V  
CC  
IN  
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
) = C V f + I . C is used to determine the noload dynamic  
CC(OPR  
PD CC in CC PD  
2
power consumption; P = C V  
f + I V  
.
D
PD  
CC  
in  
CC  
CC  
www.onsemi.com  
4
 
NL17SZ332  
OPEN  
Test  
Switch  
C , pF  
L
R , W R , W  
L 1  
2 x V  
DUT  
GND  
Position  
CC  
t
/ t  
Open  
See AC Characteristics Table  
PLH PHL  
R
1
L
t
/ t  
2 x V  
50  
50  
500  
500  
500  
500  
PLZ PZL  
CC  
t
/ t  
GND  
OUTPUT  
PHZ PZH  
X = Don’t Care  
R
R
T
C *  
L
C includes probe and jig capacitance  
L
R is Z  
of pulse generator (typically 50 W)  
T
OUT  
f = 1 MHz  
Figure 3. Test Circuit  
V
CC  
t = 3 ns  
r
t = 3 ns  
f
V
CC  
90%  
90%  
INPUT  
V
mi  
V
mi  
V
mi  
V
mi  
INPUT  
GND  
~V  
10%  
10%  
GND  
t
t
PLZ  
PZL  
t
t
PLH  
PHL  
CC  
V
OH  
V
OUTPUT  
OUTPUT  
mo  
V
V
V
V
OUTPUT  
OUTPUT  
mo  
mo  
V
OL  
+ V  
OL  
Y
V
V
V
OL  
t
t
PHZ  
PZH  
t
t
PLH  
PHL  
V
OH  
Y
OH  
V
OH  
V  
V
mo  
mo  
mo  
V
OL  
~0 V  
Figure 4. Switching Waveforms  
V , V  
mo  
t
, t  
t
, t , t , t  
PZL PLZ PZH PHZ  
V
CC  
, V  
V
mi  
, V  
V , V  
Y
PLH PHL  
1.65 to 1.95  
2.3 to 2.7  
3.0 to 3.6  
4.5 to 5.5  
V
CC  
V
CC  
V
CC  
V
CC  
/ 2  
/ 2  
/ 2  
/ 2  
V
CC  
V
CC  
V
CC  
V
CC  
/ 2  
/ 2  
/ 2  
/ 2  
V
CC  
V
CC  
V
CC  
V
CC  
/ 2  
/ 2  
/ 2  
/ 2  
0.15  
0.15  
0.3  
0.3  
www.onsemi.com  
5
NL17SZ332  
DEVICE ORDERING INFORMATION  
Pin 1 Orientation  
(See below)  
Device  
Packages  
Specific Device Code  
Shipping  
NL17SZ332DBVT1G  
SC74  
AE  
6
Q4  
Q4  
3000 / Tape & Reel  
3000 / Tape & Reel  
NL17SZ332MU1TCG  
(In Development)  
UDFN6, 1.45x1.0, 0.5P  
NL17SZ332MU3TCG  
(In Development)  
UDFN6, 1.0x1.0, 0.35P  
6
Q4  
3000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP  
Capable.  
Pin 1 Orientation in Tape and Reel  
www.onsemi.com  
6
NL17SZ332  
PACKAGE DIMENSIONS  
SC74  
CASE 318F05  
ISSUE N  
D
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH  
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
6
5
2
4
4. 318F01, 02, 03, 04 OBSOLETE. NEW STANDARD 318F05.  
E
H
E
1
3
MILLIMETERS  
INCHES  
NOM  
0.039  
0.002  
0.015  
0.007  
0.118  
0.059  
0.037  
0.016  
0.108  
DIM  
A
A1  
b
c
D
E
e
L
MIN  
0.90  
0.01  
0.25  
0.10  
2.90  
1.30  
0.85  
0.20  
2.50  
0°  
NOM  
1.00  
0.06  
0.37  
0.18  
3.00  
1.50  
0.95  
0.40  
2.75  
MAX  
MIN  
0.035  
0.001  
0.010  
0.004  
0.114  
0.051  
0.034  
0.008  
0.099  
0°  
MAX  
0.043  
0.004  
0.020  
0.010  
0.122  
0.067  
0.041  
0.024  
0.118  
10°  
1.10  
0.10  
0.50  
0.26  
3.10  
1.70  
1.05  
0.60  
3.00  
10°  
b
e
q
c
A
0.05 (0.002)  
H
E
q
L
A1  
SOLDERING FOOTPRINT*  
2.4  
0.094  
0.95  
0.037  
1.9  
0.074  
0.95  
0.037  
0.7  
0.028  
1.0  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
0.039  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
7
NL17SZ332  
PACKAGE DIMENSIONS  
UDFN6, 1.45x1.0, 0.5P  
CASE 517AQ  
ISSUE O  
A
B
D
L
L
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
L1  
DETAIL A  
PIN ONE  
OPTIONAL  
E
MILLIMETERS  
REFERENCE  
CONSTRUCTIONS  
DIM MIN  
0.45  
A1 0.00  
MAX  
0.55  
0.05  
A
0.10  
C
EXPOSED Cu  
MOLD CMPD  
A2  
b
0.07 REF  
0.20  
1.45 BSC  
TOP VIEW  
0.30  
0.10  
C
D
E
e
1.00 BSC  
0.50 BSC  
DETAIL B  
L
L1  
0.30  
−−−  
0.40  
0.15  
DETAIL B  
OPTIONAL  
0.05  
0.05  
C
C
CONSTRUCTIONS  
A
MOUNTING FOOTPRINT  
6X  
A1  
6X  
SEATING  
PLANE  
A2  
C
0.30  
SIDE VIEW  
e
PACKAGE  
OUTLINE  
6X L  
1.24  
3
1
DETAIL A  
6X  
0.53  
1
0.50  
PITCH  
DIMENSIONS: MILLIMETERS  
6
4
6X b  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
0.10 C A B  
NOTE 3  
C
0.05  
BOTTOM VIEW  
www.onsemi.com  
8
NL17SZ332  
PACKAGE DIMENSIONS  
UDFN6, 1x1, 0.35P  
CASE 517BX  
ISSUE O  
L1  
NOTES:  
L
A B  
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.20 MM FROM TERMINAL TIP.  
4. PACKAGE DIMENSIONS EXCLUSIVE OF  
BURRS AND MOLD FLASH.  
PIN ONE  
L3  
REFERENCE  
E
DETAIL A  
ALTERNATE TERMINAL  
CONSTRUCTION  
2X  
0.08  
C
MILLIMETERS  
DIM MIN  
MAX  
0.65  
0.05  
A
A1  
A3  
b
0.50  
0.00  
0.13 REF  
2X  
0.08  
C
TOP VIEW  
EXPOSED Cu  
MOLD CMPD  
0.17  
0.23  
DETAIL B  
0.05  
C
C
D
E
e
L
L1  
L3  
1.00 BSC  
1.00 BSC  
0.35  
A3  
DETAIL B  
A
0.20  
−−−  
0.26  
0.40  
0.15  
0.33  
ALTERNATE  
CONSTRUCTION  
0.05  
A1  
SEATING  
PLANE  
C
SIDE VIEW  
e
RECOMMENDED  
SOLDERING FOOTPRINT*  
DETAIL A  
6X  
0.52  
6X L  
6X  
0.25  
3
1
1.20  
PACKAGE  
OUTLINE  
1
6
4
6X b  
0.35  
M
0.07  
0.05  
C A  
B
PITCH  
M
C
NOTE 3  
BOTTOM VIEW  
DIMENSION: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
9
NL17SZ332  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
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