NL27WZ04DFT2G-L22348 [ONSEMI]
Dual Inverter;
| 型号： | NL27WZ04DFT2G-L22348 |
| 厂家： | 
ONSEMI |
| 描述： | Dual Inverter 栅 栅极 |
| 文件： | 总6页 (文件大小：76K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NL27WZ04
Dual Inverter
The NL27WZ04 is a high performance dual inverter operating from
a 1.65 V to 5.5 V supply. High impedance TTL compatible inputs
significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance.
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Features
• Extremely High Speed: t 2.0 ns (typical) at V = 5 V
PD
CC
MARKING
DIAGRAMS
• Designed for 1.65 V to 5.5 V V Operation
CC
• Over Voltage Tolerant Inputs and Outputs
6
• LVTTL Compatible − Interface Capability with 5 V TTL Logic
with V = 3 V
CC
SC−88/SC70−6/SOT−363
M5 M G
DF SUFFIX
CASE 419B
1
G
• LVCMOS Compatible
1
• 24 mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current Substantially Reduces System
Power Requirements
• Replacement for NC7W04
TSOP−6
DT SUFFIX
CASE 318G
M5 M G
• Chip Complexity: FET = 72; Equivalent Gate = 18
G
1
• Pb−Free Packages are Available
1
M5 = Device Code
M
G
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position and underbar
may vary depending upon manufacturing location.
6
5
4
OUT Y1
1
2
IN A1
GND
V
CC
PIN ASSIGNMENT
1
2
3
4
5
6
IN A1
GND
3
OUT Y2
IN A2
IN A2
OUT Y2
Figure 1. Pinout (Top View)
V
CC
OUT Y1
1
IN A1
IN A2
OUT Y1
OUT Y2
FUNCTION TABLE
1
A Input
Y Output
L
H
L
Figure 2. Logic Symbol
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
February, 2007 − Rev.6
NL27WZ04/D
NL27WZ04
MAXIMUM RATINGS
Characteristics
Symbol
Value
Unit
V
DC Supply Voltage
V
CC
−0.5 to +7.0
DC Input Voltage
V
I
−0.5 ≤ V ≤ +7.0
V
I
DC Output Voltage
Output in HIGH or LOW State (Note 1)
V < GND
V
−0.5 ≤ V ≤ 7.0
V
O
O
DC Input Diode Current
I
IK
−50
−50
mA
mA
mA
mA
mA
°C
I
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
Power Dissipation in Still Air
Thermal Resistance
V
O
< GND
I
OK
I
O
50
I
100
CC
I
100
GND
T
STG
−65 to +150
200
SC−88, TSOP−6 (Note 2)
SC−88, TSOP−6 (Note 2)
P
mW
°C/W
°C
D
q
333
JA
Lead temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
ESD Withstand Voltage
T
260
L
T
+150
°C
J
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
V
ESD
> 2000
> 200
N/A
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. I absolute maximum rating must be observed.
O
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
3. Tested to EIA/JESD22−A114−A
4. Tested to EIA/JESD22−A115−A
5. Tested to JESD22−C101−A
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
Operating
Data Retention Only
V
CC
1.65
1.5
5.5
5.5
V
Input Voltage
V
0
0
5.5
5.5
V
V
I
Output Voltage
(HIGH or LOW State)
V
O
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
T
−40
+85
°C
A
V
V
V
= 2.5 V 0.2 V
=3.0 V 0.3 V
=5.0 V 0.5 V
Dt/DV
0
0
0
20
10
5
ns/V
CC
CC
CC
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2
NL27WZ04
DC ELECTRICAL CHARACTERISTICS
V
CC
T
A
= 25°C
−40°C ≤ T ≤ 85°C
A
Parameter
Condition
Symbol
(V)
1.65−1.95
2.3 to 5.5
1.65−1.95
2.3 to 5.5
1.65 to 5.5
1.65
Min
Typ
Max
Min
Max
Unit
0.75 V
0.75 V
High−Level Input Voltage
V
IH
V
CC
CC
0.7 V
0.7 V
CC
CC
0.25 V
0.25 V
Low−Level Input Voltage
V
IL
V
V
CC
CC
0.3 V
0.3 V
CC
CC
High−Level Output
Voltage
I
= −100 mA
V
OH
V
− 0.1
V
CC
V
− 0.1
OH
CC
CC
I
= −3 mA
= −8 mA
1.29
1.52
2.1
2.4
2.7
2.5
4.0
1.29
OH
V
= V
IL
IN
I
2.3
1.9
2.2
2.4
2.3
3.8
1.9
2.2
2.4
2.3
3.8
OH
I
= −12 mA
= −16 mA
= −24 mA
= −32 mA
= 100 mA
2.7
OH
I
3.0
OH
I
3.0
OH
I
4.5
OH
Low−Level Output
Voltage
I
V
OL
1.65 to 5.5
1.65
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
1
0.1
0.24
0.3
V
OL
I
= 3 mA
= 8 mA
0.08
0.20
0.22
0.28
0.38
0.42
OL
V
IN
= V
IH
I
2.3
OL
I
= 12 mA
= 16 mA
= 24 mA
= 32 mA
2.7
0.4
OL
I
3.0
0.4
OL
I
3.0
0.55
0.55
1.0
OL
I
4.5
OL
Input Leakage Current
V
V
= V or GND
I
IN
0 to 5.5
0
mA
mA
IN
CC
Power Off−Output
Leakage Current
V
OUT
= 5.5 V
I
10
OFF
Quiescent Supply
Current
= V or GND
I
1.65 to 5.5
1
10
mA
IN
CC
CC
AC ELECTRICAL CHARACTERISTICS t = t = 2.5 ns; C = 50 pF; R = 500 W
R
F
L
L
T
A
= 25°C
−40°C ≤ T ≤ 85°C
A
V
CC
Symbol
Min
1.8
1.8
Typ Max
Min
1.8
1.8
Max
11.0
8.4
(V)
1.65
1.8
Parameter
Condition
Unit
Propagation Delay
(Figure 3 and 4)
t
2.3
4.4
3.0
2.2
2.9
1..8
2.3
9.2
7.6
5.1
3.4
4.5
2.8
3.6
ns
R = 1 MW, C = 15 pF
PLH
L
L
t
PHL
R = 1 MW, C = 15 pF
L
L
R = 1 MW, C = 15 pF
2.5 0.2
3.3 0.3
1.2
0.8
1.2
0.5
0.8
1.2
0.8
1.2
0.5
0.8
5.6
3.8
5.0
3.1
4.0
L
L
R = 1 MW, C = 15 pF
L
L
R = 500 W, C = 50 pF
L
L
R = 1 MW, C = 15 pF
5.0 0.5
L
L
R = 500 W, C = 50 pF
L
L
CAPACITIVE CHARACTERISTICS
Parameter
Symbol
Condition
= 5.5 V, V = 0 V or V
CC
Typical
Unit
pF
Input Capacitance
C
V
CC
2.5
IN
I
Power Dissipation
Capacitance (Note 6)
C
10 MHz, V = 3.3 V, V = 0 V or V
CC
9
11
pF
PD
CC
I
10 MHz, V = 5.5 V, V = 0 V or V
CC
I
CC
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
power consumption; P = C ꢀ V
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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3
NL27WZ04
V
CC
A
Y
50%
GND
t
t
PHL
PLH
50% V
CC
PROPAGATION DELAYS
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns
F
W
Figure 3. Switching Waveforms
V
CC
PULSE
GENERATOR
DUT
R
T
C
R
L
L
R = Z
of pulse generator (typically 50 W)
T
OUT
Figure 4. Test Circuit
ORDERING INFORMATION
†
Device
Package
Shipping
NL27WZ04DFT2
SC−88/SC70−6/SOT−363
NL27WZ04DFT2G
SC−88/SC70−6/SOT−363
(Pb−Free)
3000 / Tape & Reel
NL27WZ04DTT1
TSOP−6
TSOP−6
(Pb−Free)
NL27WZ04DTT1G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ04
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
e
MILLIMETERS
DIM MIN NOM MAX
0.80
INCHES
NOM MAX
1.10 0.031 0.037 0.043
0.10 0.000 0.002 0.004
0.008 REF
MIN
6
1
5
2
4
3
A
0.95
0.05
A1 0.00
H
−E−
E
A3
0.20 REF
0.21
0.14
2.00
1.25
0.65 BSC
0.20
2.10
b
C
D
E
e
0.10
0.10
1.80
1.15
0.30 0.004 0.008 0.012
0.25 0.004 0.005 0.010
2.20 0.070 0.078 0.086
1.35 0.045 0.049 0.053
0.026 BSC
b 6 PL
L
0.10
2.00
0.30 0.004 0.008 0.012
2.20 0.078 0.082 0.086
H
E
M
M
0.2 (0.008)
E
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
NL27WZ04
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE S
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
6
5
2
4
E
H
E
1
3
b
MILLIMETERS
INCHES
NOM
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
−
DIM
A
A1
b
c
D
E
e
L
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
NOM
1.00
0.06
0.38
0.18
3.00
1.50
0.95
0.40
2.75
−
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
e
q
c
A
0.05 (0.002)
L
A1
H
E
q
SOLDERING FOOTPRINT*
2.4
0.094
0.95
0.037
1.9
0.075
0.95
0.037
0.7
0.028
1.0
mm
inches
0.039
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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NL27WZ04/D
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