NL27WZ07DBVT1G [ONSEMI]
双缓冲器，开漏;
| 型号： | NL27WZ07DBVT1G |
| 厂家： | 
ONSEMI |
| 描述： | 双缓冲器，开漏 栅 光电二极管 逻辑集成电路 触发器 栅极 |
| 文件： | 总6页 (文件大小：64K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NL27WZ07
Dual Buffer with Open Drain
Outputs
The NL27WZ07 is a high performance dual buffer with open drain
outputs operating from a 1.65 to 5.5 V supply.
The internal circuit is composed of multiple stages, including an open
drain output which provides the capability to set output switching level.
This allows the NL27WZ07 to be used to interface 5 V circuits to circuits
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of any voltage between V and 7.0 V using an external resistor and
MARKING
CC
power supply.
DIAGRAMS
Features
SC−88
DF SUFFIX
CASE 419B
• Extremely High Speed: t 2.3 ns (typical) at V = 5.0 V
PD
CC
M7d
• Designed for 1.65 V to 5.5 V V Operation, CMOS compatible
CC
• Over Voltage Tolerant Inputs
• LVTTL Compatible − Interface Capability with 5.0 V TTL Logic
Pin 1
with V = 3.0 V
CC
d = Date Code
• LVCMOS Compatible
• 24 mA Output Sink Capability
• Near Zero Static Supply Current Substantially Reduces System
TSOP−6
DT SUFFIX
CASE 318G
M7d
Power Requirements
• Chip Complexity: FET = 72; Equivalent Gate = 18
• Pb−Free Packages are Available
Pin 1
d = Date Code
PIN ASSIGNMENT
IN A1
GND
IN A2
1
2
3
6
5
4
OUT Y1
1
2
3
4
IN A1
GND
IN A2
OUT Y2
V
CC
5
6
V
CC
OUT Y1
OUT Y2
FUNCTION TABLE
A Input
Y Output
Figure 1. Pinout (Top View)
L
L
Z
H
1
1
IN A1
IN A2
OUT Y1
OUT Y2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
April, 2004 − Rev. 7
NL27WZ07/D
NL27WZ07
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V
V
V
V
DC Supply Voltage
*0.5 to )7.0
CC
I
DC Input Voltage
*0.5 ≤ V ≤ )7.0
V
I
DC Output Voltage
Output in Z or LOW State (Note 1)
V < GND
*0.5 ≤ V ≤ 7.0
V
O
O
I
I
I
I
I
DC Input Diode Current
*50
mA
mA
mA
mA
mA
°C
IK
I
DC Output Diode Current
DC Output Sink Current
V
< GND
O
*50
OK
O
$50
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Power Dissipation in Still Air
Thermal Resistance
$100
CC
GND
$100
T
*65 to )150
STG
P
SC−88, TSOP−6
SC−88, TSOP−6
200
mW
°C/W
°C
D
q
333
260
JA
T
T
Lead Temperature, 1 mm from case for 10 s
Junction Temperature under Bias
L
)150
°C
J
I
Latch−Up Performance
Moisture Sensitivity
Flammability Rating
ESD Classification
Above V and Below GND at 85°C (Note 5)
$500
mA
Latch−Up
CC
MSL
Level 1
F
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
R
V
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
N/A
ESD
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. I absolute maximum rating must be observed.
O
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
Supply Voltage
Operating
Data Retention Only
1.65
1.5
5.5
5.5
V
V
V
Input Voltage
0
0
5.5
5.5
V
V
I
Output Voltage
(Z or LOW State)
O
T
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
*40
)85
°C
A
Dt/DV
V
V
V
= 2.5 V $0.2 V
=3.0 V $0.3 V
=5.0 V $0.5 V
0
0
0
20
10
5
ns/V
CC
CC
CC
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2
NL27WZ07
DC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
*40°C ≤T ≤ 85°C
A
V
CC
(V)
Min
Typ
Max
Min
Max
Symbol
Parameter
Condition
Unit
V
IH
High−Level Input Voltage
1.65 to 1.95 0.75 V
0.75 V
0.75 V
V
CC
CC
CC
CC
2.3 to 5.5
0.75 V
V
Low−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
0.3 V
0.3 V
0.3 V
0.3 V
V
mA
V
IL
CC
CC
CC
CC
I
Z−State Output Leakage
Current
V
= V
IL
CC
2.3 to 5.5
$5.0
$10.0
LKG
IN
V
= V or GND
OUT
V
OL
Low−Level Output Voltage
I
= 100 mA
1.65 to 5.5
1.65
2.3
0.0
0.1
0.24
0.3
0.1
0.24
0.3
OL
V
IN
= V
IL
I
= 4 mA
= 8 mA
0.08
0.20
0.22
0.28
0.38
0.42
OL
I
OL
I
= 12 mA
= 16 mA
= 24 mA
= 32 mA
2.7
0.4
0.4
OL
I
3.0
0.4
0.4
OL
I
3.0
0.55
0.55
$0.1
0.55
0.55
$1.0
OL
I
4.5
OL
I
I
I
Input Leakage Current
V
IN
or V
= V or
0 to 5.5
mA
mA
mA
IN
OUT
CC
GND
Power Off−Output
Leakage Current
V
= 5.5 V
0
1
1
10
10
OFF
CC
OUT
Quiescent Supply Current
V
= V or GND
5.5
IN
CC
AC ELECTRICAL CHARACTERISTICS t = t = 2.5 ns; C = 50 pF; R = 500 W
R
F
L
L
T
A
= 25°C
*40°C ≤T ≤ 85°C
A
Min
1.8
1.2
0.8
0.5
1.8
1.2
0.8
0.5
Typ
5.3
3.7
2.9
2.3
5.3
2.8
2.1
1.4
Max
11.5
5.8
Min
1.8
1.2
0.8
0.5
1.8
1.2
0.8
0.5
Max
12.0
6.4
Symbol
Parameter
Condition
V
(V)
Unit
CC
t
Propagation Delay
(Figure 3 and 4)
R
R = 5000 W, C = 15 pF
1.8 $ 0.15
2.5 $ 0.2
3.3 $ 0.3
5.0 $ 0.5
1.8 $ 0.15
2.5 $ 0.2
3.3 $ 0.3
5.0 $ 0.5
ns
PZL
L =
1
L
R
R = 500 W, C = 50 pF
1 L
L =
4.4
4.8
3.5
3.9
t
Propagation Delay
(Figure 3 and 4)
R
R = 5000 W, C = 15 pF
11.5
5.8
12.0
6.4
ns
PLZ
L =
1
L
R
R = 500 W, C = 50 pF
1 L
L =
4.4
4.8
3.5
3.9
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Output Capacitance
Power Dissipation Capacitance (Note 6)
Condition
Typical
2.5
Unit
C
V
V
= 5.5 V, V = 0 V or V
pF
pF
pF
IN
CC
I
CC
CC
C
C
= 5.5 V, V = 0 V or V
4.0
OUT
PD
CC
I
10 MHz, V = 5.5 V, V = 0 V or V
CC
4.0
CC
I
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
power consumption; P = C ꢀ V
) = C ꢀ V ꢀ f ) I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
ꢀ f ) I ꢀ V
.
D
PD
CC
in
CC
CC
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3
NL27WZ07
V
CC
A
Y
50%
GND
t
t
PLZ
PZL
HIGH
IMPEDANCE
50% V
CC
V
OL
)0.3 V
Figure 3. Switching Waveforms
V
CC
R
1
V
CC
2
PULSE
GENERATOR
DUT
R
T
C
R
L
L
R = Z
of pulse generator (typically 50 W)
T
OUT
Figure 4. Test Circuit
ORDERING INFORMATION
Device Nomenclature
No. of
Logic
Circuit
Indicator
Temp
Range
Identifier
Tape &
Reel
Suffix
Gates
per
Package
Package Type
(Name/SOT#/
Common Name)
Device
Function
Package
Suffix
†
Technology
Device
Shipping
NL27WZ07DFT2
NL
2
7
WZ
07
DF
T2
SC−88 / SOT−363
/ SC−70
178 mm (7”)
3000 Unit
NL27WZ07DFT2G
NL
2
7
WZ
07
DF
T2
SC−88 / SOT−363
/ SC−70
178 mm (7”)
3000 Unit
(Pb−Free)
NL27WZ07DTT1
NL
NL
2
2
7
7
WZ
WZ
07
07
DT
DT
T1
T1
TSOP−6 / SOT−23
/ SC−59
178 mm (7”)
3000 Unit
NL27WZ07DTT1G
TSOP−6 / SOT−23
/ SC−59
178 mm (7”)
3000 Unit
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ07
PACKAGE DIMENSIONS
SC−88 (SOT−363)
DF SUFFIX
CASE 419B−02
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
A
G
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
A
B
C
D
G
H
J
K
N
S
0.071 0.087
0.045 0.053
0.031 0.043
0.004 0.012
0.026 BSC
−−− 0.004
0.004 0.010
0.004 0.012
0.008 REF
6
1
5
4
3
S
−B−
0.65 BSC
−−−
0.10
0.10
0.10
0.25
0.30
2
0.20 REF
0.079 0.087
2.00
2.20
D 6 PL
M
M
B
0.2 (0.008)
N
J
C
H
K
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
NL27WZ07
PACKAGE DIMENSIONS
TSOP−6
DT SUFFIX
CASE 318G−02
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
L
6
5
2
4
B
S
1
3
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
D
G
A
B
C
D
G
H
J
K
L
M
S
2.90
1.30
0.90
0.25
0.85
3.10 0.1142 0.1220
1.70 0.0512 0.0669
1.10 0.0354 0.0433
0.50 0.0098 0.0197
1.05 0.0335 0.0413
M
J
0.013 0.100 0.0005 0.0040
C
0.05 (0.002)
0.10
0.20
1.25
0
0.26 0.0040 0.0102
0.60 0.0079 0.0236
1.55 0.0493 0.0610
K
H
10
0
10
_
_
_
_
2.50
3.00 0.0985 0.1181
SOLDERING FOOTPRINT*
2.4
0.094
0.95
0.037
1.9
0.075
0.95
0.037
0.7
0.028
1.0
0.039
mm
inches
ǒ
Ǔ
SCALE 10:1
Figure 5. TSOP−6
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
NL27WZ07/D
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