NL27WZ08USG [ONSEMI]

Dual 2−Input AND Gate; 双路2输入与门


型号：	NL27WZ08USG
厂家：	ONSEMI
描述：	Dual 2−Input AND Gate 双路2输入与门栅极触发器逻辑集成电路光电二极管 PC
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NL27WZ08

Dual 2−Input AND Gate

The NL27WZ08 is a high performance dual 2−input AND Gate

operating from a 1.65 V to 5.5 V supply.

Features

• Extremely High Speed: t 2.5 ns (typical) at V = 5 V

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• Designed for 1.65 V to 5.5 V V Operation

• Over Voltage Tolerant Inputs

MARKING

DIAGRAM

• LVTTL Compatible − Interface Capability With 5 V TTL Logic with

= 5 V

• LVCMOS Compatible

• 24 mA Balanced Output Sink and Source Capability

US8

L2 M G

• Near Zero Static Supply Current Substantially Reduces System

US SUFFIX

CASE 493

Power Requirements

• Replacement for NC7WZ08

• Chip Complexity: FET = 124

• Pb−Free Package is Available

= Device Code

= Date Code*

= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending upon

manufacturing location.

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

IEEE/IEC

GND

Figure 1. Pinout

Figure 2. Logic Symbol

PIN ASSIGNMENT

FUNCTION TABLE

Y = AB

Function

Inputs

Output

GND

H = HIGH Logic Level

L = LOW Logic Level

Publication Order Number:

April, 2006 − Rev. 4

NL27WZ08/D

NL27WZ08

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

*0.5 to )7.0

DC Input Voltage

DC Output Voltage

*0.5 to V + 0.5

DC Input Diode Current

DC Output Diode Current

DC Output Sink Current

DC Supply Current per Supply Pin

DC Ground Current per Ground Pin

Storage Temperature Range

V < GND

*50

°C

< GND

*50

$50

$100

GND

$100

*65 to )150

STG

Lead Temperature, 1 mm from Case for 10 Seconds

Junction Temperature under Bias

Thermal Resistance

260

°C

)150

°C

(Note 1)

250

°C/W

Power Dissipation in Still Air at 85°C

Moisture Sensitivity

MSL

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

ESD

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

> 2000

> 200

N/A

Latch−Up Performance

Above V and Below GND at 85°C (Note 5)

$500

Latch−Up

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

Supply Voltage

Operating

Data Retention Only

1.65

1.5

5.5

Input Voltage

(Note 6)

5.5

Output Voltage

(HIGH or LOW State)

Operating Free−Air Temperature

Input Transition Rise or Fall Rate

*40

)85

°C

Dt/DV

= 2.5 V $0.2 V

= 3.0 V $0.3 V

= 5.0 V $0.5 V

ns/V

6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.

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NL27WZ08

DC ELECTRICAL CHARACTERISTICS

= 255C

Typ

*405C v T v 855C

(V)

Min

Max

Min

Max

Symbol

Parameter

Condition

Unit

High−Level Input Voltage

1.65

2.3 to 5.5

0.75 V

0.7 V

0.75 V

0.7 V

Low−Level Input Voltage

High−Level Output Voltage

1.65

2.3 to 5.5

0.25 V

0.3 V

0.25

0.3 V

= 100 mA

= −3 mA

= −8 mA

= −12 mA

= −16 mA

= −24 mA

= −32 mA

1.65 to 5.5

165

− 0.1

1.29

− 0.1

1.5

= V or V

1.5

2.1

2.4

2.7

2.5

4.0

2.3

2.7

3.0

1.9

2.2

2.4

2.3

3.8

1.9

2.2

2.4

2.3

3.8

4.5

Low−Level Output Voltage

= V or V

= 100 mA

= 3 mA

= 8 mA

= 12 mA

= 16 mA

= 24 mA

= 32 mA

1.65 to 5.5

0.1

0.24

0.3

0.4

0.55

0.1

0.24

0.3

0.4

0.55

0.08

0.20

0.22

0.28

0.38

0.42

2.3

2.7

3.0

4.5

Input Leakage Current

= V or GND

0 to 5.5

5.5

$0.1

$1.0

Quiescent Supply Current

= V or GND

1.0

AC ELECTRICAL CHARACTERISTICS t = t = 3.0 ns

= 255C

*405C v T v 855C

Min

Typ

5.7

3.5

Max

10.5

5.8

Min

2.0

Max

11.0

6.2

(V)

Symbol

Parameter

Condition

R = 1 MW, C = 15 pF

Unit

Propagation Delay

(Figure 3 and 4)

1.8 $ 0.15

2.5 $ 0.2

3.3 $ 0.3

2.0

1.0

PLH

PHL

R = 1 MW, C = 15 pF

0.8

1.2

2.6

3.2

3.9

4.8

0.8

1.2

4.3

5.2

R = 500 W, C = 50 pF

R = 1 MW, C = 15 pF

5.0 $ 0.5

0.5

0.8

1.9

2.5

3.1

3.7

0.5

0.8

3.3

4.0

R = 500 W, C = 50 pF

CAPACITIVE CHARACTERISTICS

Symbol

Parameter

Condition

= 5.5 V, V = 0 V or V

Typical

Unit

Input Capacitance

Power Dissipation Capacitance

(Note 7)

10 MHz, V = 3.3 V, V = 0 V or V

10 MHz, V = 5.5 V, V = 0 V or V

7. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: I

₎= C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic

CC(OPR

PD CC in CC PD

power consumption; P = C ꢀ V

ꢀ f + I ꢀ V

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NL27WZ08

t = 3 ns

90%

50%

90%

50%

INPUT

A and B

10%

GND

PHL

PLH

OUTPUT Y

50%

A 1−MHz square input wave is recommended for

propagation delay tests.

Figure 3. Switching Waveform

Figure 4. Test Circuit

DEVICE ORDERING INFORMATION

Device Order Number

NL27WZ08US

†

Package Type

Tape and Reel Size

US8

178 mm, 3000 Unit / Tape & Reel

NL27WZ08USG

US8

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

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NL27WZ08

PACKAGE DIMENSIONS

US8

US SUFFIX

CASE 493−02

ISSUE B

−X−

−Y−

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR.

MOLD FLASH. PROTRUSION AND GATE

BURR SHALL NOT EXCEED 0.140 MM

(0.0055”) PER SIDE.

DETAIL E

4. DIMENSION “B” DOES NOT INCLUDE

INTER−LEAD FLASH OR PROTRUSION.

INTER−LEAD FLASH AND PROTRUSION

SHALL NOT E3XCEED 0.140 (0.0055”) PER

SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076−0.0203 MM.

(300−800 “).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED 0.0508 (0.0002 “).

MILLIMETERS

INCHES

DIM

MIN

1.90

2.20

0.60

0.17

0.20

0.50 BSC

0.40 REF

0.10

MAX

2.10

2.40

0.90

0.25

0.35

MIN

MAX

0.083

0.094

0.035

0.010

0.014

0.075

0.087

0.024

0.007

0.008

0.020 BSC

0.016 REF

0.004

−T−

SEATING

PLANE

0.10 (0.004)

R 0.10 TYP

0.10 (0.004)

X Y

0.18

0.10

3.20

0.007

0.004

0.126

0.00

3.00

0.000

0.118

0.23

0.37

0.60

0.34

0.33

0.47

0.80

0.010

0.009

0.015

0.024

0.013

0.019

0.031

DETAIL E

0.12 BSC

0.005 BSC

SOLDERING FOOTPRINT*

3.8

0.15

1.8

0.07

0.50

0.0197

0.30

0.012

1.0

0.0394

inches

SCALE 8:1

*For additional information on our Pb−Free strategy

and soldering details, please download the

ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer

purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

Literature Distribution Center for ON Semiconductor

P.O. Box 61312, Phoenix, Arizona 85082−1312 USA

Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada

Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

For additional information, please contact your

local Sales Representative.

NL27WZ08/D

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