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NL27WZ125MU1TCG [ONSEMI]

Bus Driver;
NL27WZ125MU1TCG
型号： NL27WZ125MU1TCG
厂家： ONSEMI    ONSEMI
描述：

Bus Driver

驱动 光电二极管 逻辑集成电路
文件： 总12页 (文件大小：183K)
中文：  中文翻译
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NL27WZ125  
Dual Buffer with 3-State  
Outputs  
The NL27WZ125 is a high performance dual noninverting buffer  
operating from a 1.65 V to 5.5 V supply.  
Features  
www.onsemi.com  
• Designed for 1.65 V to 5.5 V V Operation  
CC  
MARKING  
DIAGRAMS  
• 2.7 ns t at V = 5 V (typ)  
PD  
CC  
• Inputs/Outputs Overvoltage Tolerant up to 5.5 V  
• I  
Supports Partial Power Down Protection  
• Source/Sink 24 mA at 3.0 V  
OFF  
XX M  
G
US8  
US SUFFIX  
CASE 493  
• Available in US8, UDFN8 and UQFN8 Packages  
• Chip Complexity < 100 FETs  
• NLV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q100  
Qualified and PPAP Capable  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
UDFN8, 1.45x1.0  
MU3 SUFFIX  
CASE 517BZ  
X M  
1
UDFN8, 1.95x1.0  
MU1 SUFFIX  
X M  
XM  
A
OE  
1
1
CASE 517CA  
1
1
Y
Y
1
EN  
A
OE  
2
2
2
UQFN8, 1.4x1.2  
MQ2 SUFFIX  
CASE 523AS  
1
Figure 1. Logic Symbol  
1
UQFN8, 1.6x1.6  
MQ1 SUFFIX  
CASE 523AN  
XX MG  
8
1
X, XX = Specific Device Code  
M
= Date Code*  
G
= Pb−Free Package  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 7 of this data sheet.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
January, 2019 − Rev. 11  
NL27WZ125/D  
NL27WZ125  
OE  
7
Y
A
2
1
6
2
5
1
2
3
4
8
OE  
A
V
CC  
1
1
2
OE  
A
1
2
8
7
V
CC  
1
V
GND  
4
CC  
OE  
7
6
5
OE  
1
2
2
8
Y
3
4
6
5
Y
2
1
2
Y
Y
1
2
1
OE  
2
3
Y
A
1
1
2
GND  
A
GND  
A
UQFN8  
US8  
UDFN8  
Figure 2. Pinout  
PIN ASSIGNMENT  
FUNCTION TABLE  
Y = AB  
Pin  
Function  
OE  
Input  
Output  
1
1
OE  
L
B
L
Y
n
n
2
3
4
5
6
7
8
A
Y
1
L
2
L
H
X
H
Z
GND  
H
A
2
Y
2
X = Don’t Care  
n = 1, 2  
OE  
2
V
CC  
www.onsemi.com  
2
NL27WZ125  
MAXIMUM RATINGS  
Symbol  
Characteristics  
Value  
Unit  
V
V
CC  
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
−0.5 to +6.5  
−0.5 to +6.5  
V
V
IN  
Active−Mode (High or Low State)  
Tri−State Mode (Note 1)  
−0.5 to V + 0.5  
V
CC  
−0.5 to +6.5  
−0.5 to +6.5  
Power−Down Mode (V = 0 V)  
CC  
I
DC Input Diode Current  
V
< GND  
< GND  
−50  
−50  
mA  
mA  
mA  
mA  
°C  
IK  
IN  
I
DC Output Diode Current  
V
OUT  
OK  
I
DC Output Source/Sink Current  
DC Supply Current per Supply Pin or Ground Pin  
Storage Temperature Range  
50  
OUT  
I
or I  
100  
CC  
GND  
T
−65 to +150  
260  
STG  
T
Lead Temperature, 1 mm from Case for 10 secs  
Junction Temperature Under Bias  
Thermal Resistance (Note 2)  
°C  
L
T
+150  
°C  
J
q
US8  
UQFN8  
UDFN8  
250  
208  
111  
°C/W  
JA  
P
D
Power Dissipation in Still Air  
US8  
UDFN8  
UQFN8  
250  
601  
1127  
mW  
MSL  
Moisture Sensitivity  
Level 1  
−
−
V
F
R
Flammability Rating  
Oxygen Index: 28 to 34  
UL 94 V−0 @ 0.125 in  
V
ESD  
ESD Withstand Voltage (Note 3)  
Human Body Model  
Charged Device Model  
2000  
1000  
I
Latchup Performance (Note 4)  
$100  
mA  
Latchup  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Applicable to devices with outputs that may be tri−stated.  
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow.  
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to  
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.  
4. Tested to EIA/JESD78 Class II.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Characteristics  
Min  
1.65  
0
Max  
5.5  
Unit  
V
V
CC  
Positive DC Supply Voltage  
DC Input Voltage  
V
IN  
5.5  
V
V
OUT  
DC Output Voltage  
Active−Mode (High or Low State)  
Tri−State Mode (Note 1)  
0
0
0
V
CC  
5.5  
5.5  
Power−Down Mode (V = 0 V)  
CC  
T
Operating Temperature Range  
Input Rise and Fall Time  
−55  
+125  
°C  
A
t , t  
r
V = 1.65 V to 1.95 V  
CC  
0
0
0
0
20  
20  
10  
5
ns/V  
f
V
CC  
V
CC  
V
CC  
= 2.3 V to 2.7 V  
= 3.0 V to 3.6 V  
= 4.5 V to 5.5 V  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
www.onsemi.com  
3
 
NL27WZ125  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 255C  
Typ  
−555C 3 T 3 1255C  
A
V
(V)  
CC  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Condition  
Units  
1.65 to 1.95 0.65 V  
−
−
−
−
−
−
0.65 V  
−
−
V
High−Level Input  
V
CC  
CC  
CC  
IH  
Voltage  
2.3 to 5.5  
1.65 to 1.95  
2.3 to 5.5  
0.70 V  
0.70 V  
CC  
−
−
0.35 V  
−
−
0.35 V  
V
Low−Level Input  
Voltage  
V
V
CC  
CC  
IL  
0.30 V  
0.30 V  
CC  
CC  
V
OH  
High−Level Output  
Voltage  
V
= V or V  
IH IL  
IN  
I
= −100 mA  
= −4 mA  
1.65 to 5.5  
1.65  
2.3  
V
CC  
− 0.1  
V
−
−
−
−
−
−
−
V − 0.1  
CC  
1.29  
−
−
−
−
−
−
−
OH  
OH  
CC  
I
1.29  
1.4  
I
= −8 mA  
1.9  
2.2  
2.4  
2.3  
3.8  
1.9  
2.2  
2.4  
2.3  
3.8  
OH  
2.1  
2.4  
2.7  
2.5  
4.0  
I
= −12 mA  
= −16 mA  
= −24 mA  
= −32 mA  
2.7  
OH  
I
3.0  
OH  
I
3.0  
OH  
I
4.5  
OH  
V
OL  
Low−Level Output  
Voltage  
V
= V or V  
V
IN  
IH  
IL  
I
= 100 mA  
= 4 mA  
1.65 to 5.5  
1.65  
2.3  
−
−
−
−
−
−
−
0.1  
0.24  
0.3  
0.4  
0.4  
0.55  
0.55  
−
−
−
−
−
−
−
0.1  
0.24  
0.3  
0.4  
0.4  
0.55  
0.55  
OL  
OL  
I
0.08  
0.2  
0.22  
0.28  
0.38  
0.42  
I
OL  
= 8 mA  
OL  
I
= 12 mA  
= 16 mA  
= 24 mA  
= 32 mA  
2.7  
I
3.0  
OL  
I
3.0  
OL  
I
4.5  
OL  
I
Input Leakage Current  
V
= 5.5 V or  
1.65 to 5.5  
−
−
−
−
−
−
−
−
0.1  
1.0  
1.0  
0.5  
−
−
−
−
1.0  
10  
10  
5
mA  
mA  
mA  
mA  
IN  
IN  
GND  
I
Power Off Leakage  
Current  
V
V
= 5.5 V or  
= 5.5 V  
0
OFF  
IN  
OUT  
I
Quiescent Supply  
Current  
V
IN  
= V or GND  
5.5  
CC  
CC  
I
3−State Output Leakage  
V
IN  
= V or V  
2.3 to 5.5  
OZ  
IL  
OUT  
IH  
0 V ≤ V  
≤ 5.5 V  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
4
NL27WZ125  
AC ELECTRICAL CHARACTERISTICS (t = t = 3.0 ns)  
R
F
T
A
= 255C  
Typ  
6.0  
−555C 3 T 3 1255C  
A
V
(V)  
CC  
Min  
−
Max  
12.0  
7.5  
5.2  
5.7  
4.5  
5.0  
1.0  
0.8  
14.0  
8.5  
6.2  
5.5  
12.0  
8.0  
5.7  
4.7  
Min  
Max  
13.0  
8.0  
5.5  
6.0  
4.8  
5.3  
1.0  
0.8  
15.0  
9.0  
6.5  
5.8  
13.0  
8.5  
6.0  
5.0  
Symbol  
Parameter  
Condition  
Units  
t
t
Propagation Delay  
1.8 0.15 CL = 15 pF, RL = 1 MW  
−
ns  
PLH  
PHL  
R1 = Open  
2.5 0.2  
−
3.5  
−
3.3 0.3  
5.0 0.5  
−
2.6  
−
−
2.0  
−
3.3 0.3  
5.0 0.5  
3.3 0.3  
5.0 0.5  
1.8 0.15  
2.5 0.2  
3.3 0.3  
5.0 0.5  
1.8 0.15  
2.5 0.2  
3.3 0.3  
5.0 0.5  
CL = 50 pF, RL = 500 W  
R1 = Open  
−
3.0  
−
−
2.4  
−
t
t
Output to Output Skew  
Output Enable Time  
RL = 500 W, CL = 50 pF  
−
0.08  
0.05  
6.5  
−
ns  
ns  
OSLH  
OSHL  
−
−
t
−
−
PZH  
t
PZL  
−
3.7  
−
−
2.8  
−
−
2.1  
−
t
Output Enable Time  
−
4.2  
−
ns  
PHZ  
PLZ  
t
−
3.1  
−
−
2.6  
−
−
2.6  
−
CAPACITIVE CHARACTERISTICS (t = t = 3.0 ns)  
R
F
Symbol  
Parameter  
Input Capacitance  
Output Capacitance  
Condition  
Typical  
2.5  
Units  
pF  
C
V
V
= 5.5 V, V = 0 V or V  
IN  
IN  
CC  
CC  
CC  
C
= 5.5 V, V = 0 V or V  
2.5  
pF  
OUT  
CC  
IN  
C
Power Dissipation Capacitance  
(Note 5)  
10 MHz, V = 3.3 V, V = 0 V or V  
9
11  
pF  
PD  
CC  
IN  
CC  
CC  
10 MHz, V = 5.5 V, V = 0 V or V  
CC  
IN  
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic  
CC(OPR  
PD CC in CC PD  
2
power consumption; P = C ꢀ V  
ꢀ f + I ꢀ V  
.
D
PD  
CC  
in  
CC  
CC  
www.onsemi.com  
5
 
NL27WZ125  
OPEN  
Test  
Switch  
C , pF  
L
R , W R , W  
L 1  
2 x V  
DUT  
GND  
Position  
CC  
t
/ t  
Open  
See AC Characteristics Table  
PLH PHL  
R
1
L
t
/ t  
2 x V  
50  
50  
500  
500  
500  
500  
PLZ PZL  
CC  
t
/ t  
GND  
OUTPUT  
PHZ PZH  
X = Don’t Care  
R
R
T
C *  
L
C includes probe and jig capacitance  
L
R is Z  
of pulse generator (typically 50 W)  
T
OUT  
f = 1 MHz  
Figure 3. Test Circuit  
V
CC  
t = 3 ns  
r
t = 3 ns  
f
V
CC  
90%  
90%  
INPUT  
V
mi  
V
mi  
V
mi  
V
mi  
INPUT  
GND  
~V  
10%  
10%  
GND  
t
t
PLZ  
PZL  
t
t
PLH  
PHL  
CC  
V
OH  
V
OUTPUT  
OUTPUT  
mo  
V
V
V
V
OUTPUT  
OUTPUT  
mo  
mo  
V
OL  
+ V  
OL  
Y
V
V
V
OL  
t
t
PHZ  
PZH  
t
t
PLH  
PHL  
V
OH  
Y
OH  
V
OH  
− V  
V
mo  
mo  
mo  
V
OL  
~0 V  
Figure 4. Switching Waveforms  
V , V  
mo  
t
, t  
t
, t , t , t  
PZL PLZ PZH PHZ  
V
CC  
, V  
V
mi  
, V  
V , V  
Y
PLH PHL  
1.65 to 1.95  
2.3 to 2.7  
3.0 to 3.6  
4.5 to 5.5  
V
CC  
V
CC  
V
CC  
V
CC  
/2  
/2  
/2  
/2  
(V − V )/2  
V
CC  
V
CC  
V
CC  
V
CC  
/2  
/2  
/2  
/2  
0.15  
0.15  
0.3  
OH  
OL  
(V − V )/2  
OH  
OL  
(V − V )/2  
OH  
OL  
(V − V )/2  
0.3  
OH  
OL  
www.onsemi.com  
6
NL27WZ125  
DEVICE ORDERING INFORMATION  
Pin 1 Orientation  
(See below)  
†
Device  
Packages  
Specific Device Code  
Shipping  
NL27WZ125USG  
US8  
US8  
M0  
Q4  
Q4  
3000 / Tape & Reel  
3000 / Tape & Reel  
NLV27WZ125USG*  
(In Development)  
TBD  
NL27WZ125MQ1TCG  
(In Development)  
UQFN8, 1.6 x 1.6, 0.5P  
UDFN8, 1.95 x 1.0, 0.5P  
UDFN8, 1.45 x 1.0, 0.5P  
UQFN8, 1.4 x 1.2, 0.5P  
SM8  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
NL27WZ125MU1TCG  
(In Development)  
NL27WZ125MU3TCG  
(In Development)  
NL27WZ125MQ2TCG  
(In Development)  
NL27WZ125  
(In Development)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP  
Capable.  
Pin 1 Orientation in Tape and Reel  
www.onsemi.com  
7
NL27WZ125  
PACKAGE DIMENSIONS  
US8  
US SUFFIX  
CASE 493−02  
ISSUE B  
−X−  
NOTES:  
A
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
8
5
J
−Y−  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION “A” DOES NOT INCLUDE MOLD  
FLASH, PROTRUSION OR GATE BURR.  
MOLD FLASH. PROTRUSION AND GATE  
BURR SHALL NOT EXCEED 0.140 MM  
(0.0055”) PER SIDE.  
4. DIMENSION “B” DOES NOT INCLUDE  
INTER−LEAD FLASH OR PROTRUSION.  
INTER−LEAD FLASH AND PROTRUSION  
SHALL NOT E3XCEED 0.140 (0.0055”) PER  
SIDE.  
DETAIL E  
B
L
5. LEAD FINISH IS SOLDER PLATING WITH  
THICKNESS OF 0.0076−0.0203 MM.  
(300−800 “).  
6. ALL TOLERANCE UNLESS OTHERWISE  
SPECIFIED 0.0508 (0.0002 “).  
1
4
R
G
S
U
P
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
MIN  
1.90  
2.20  
0.60  
0.17  
0.20  
0.50 BSC  
0.40 REF  
0.10  
MAX  
2.10  
2.40  
0.90  
0.25  
0.35  
MIN  
MAX  
0.083  
0.094  
0.035  
0.010  
0.014  
C
0.075  
0.087  
0.024  
0.007  
0.008  
0.020 BSC  
0.016 REF  
H
−T−  
0.10 (0.004)  
T
K
SEATING  
D
N
PLANE  
R 0.10 TYP  
M
0.10 (0.004)  
T
X Y  
0.18  
0.10  
3.20  
6
0.004  
0.007  
0.004  
0.126  
6
V
0.00  
3.00  
0
0.000  
0.118  
0
M
_
_
_
_
5
10  
5
10  
_
_
_
_
0.23  
0.23  
0.37  
0.60  
0.34  
0.33  
0.47  
0.80  
0.010  
0.009  
0.015  
0.024  
0.013  
0.013  
0.019  
0.031  
F
DETAIL E  
U
V
0.12 BSC  
0.005 BSC  
SOLDERING FOOTPRINT*  
3.8  
0.015  
1.8  
0.07  
0.50  
0.0197  
0.30  
0.012  
1.0  
0.0394  
mm  
inches  
ǒ
Ǔ
SCALE 8:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
8
NL27WZ125  
PACKAGE DIMENSIONS  
UDFN8, 1.45x1, 0.35P  
CASE 517BZ  
ISSUE O  
NOTES:  
A B  
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.20 MM FROM TERMINAL TIP.  
4. PACKAGE DIMENSIONS EXCLUSIVE OF  
BURRS AND MOLD FLASH.  
PIN ONE  
REFERENCE  
E
2X  
0.10  
C
MILLIMETERS  
DIM MIN  
MAX  
0.55  
0.05  
A
A1  
A3  
b
0.45  
0.00  
0.13 REF  
2X  
0.10  
C
TOP VIEW  
SIDE VIEW  
0.15  
0.25  
A3  
0.05  
C
C
D
1.45 BSC  
E
e
1.00 BSC  
0.35 BSC  
A
L
L1  
0.25  
0.30  
0.35  
0.40  
0.05  
A1  
RECOMMENDED  
SEATING  
PLANE  
C
SOLDERING FOOTPRINT*  
7X  
8X  
0.48  
0.22  
e/2  
e
7X L  
4
1
8
L1  
1.18  
1
5
0.53  
0.35  
8X b  
PKG  
PITCH  
M
OUTLINE  
0.10  
C
C
A B  
DIMENSIONS: MILLIMETERS  
M
NOTE 3  
0.05  
BOTTOM VIEW  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
9
NL27WZ125  
PACKAGE DIMENSIONS  
UDFN8, 1.95x1, 0.5P  
CASE 517CA  
ISSUE O  
NOTES:  
A B  
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.20 MM FROM TERMINAL TIP.  
4. PACKAGE DIMENSIONS EXCLUSIVE OF  
BURRS AND MOLD FLASH.  
PIN ONE  
REFERENCE  
E
2X  
0.10  
C
MILLIMETERS  
DIM MIN  
MAX  
0.55  
0.05  
A
A1  
A3  
b
0.45  
0.00  
0.13 REF  
2X  
0.10  
C
TOP VIEW  
SIDE VIEW  
0.15  
0.25  
A3  
0.05  
C
C
D
1.95 BSC  
E
e
1.00 BSC  
0.50 BSC  
A
L
L1  
0.25  
0.30  
0.35  
0.40  
0.05  
A1  
SEATING  
PLANE  
RECOMMENDED  
C
SOLDERING FOOTPRINT*  
07.4X9  
8X  
0.30  
e/2  
e
4
7X L  
1
L1  
1.24  
8
5
1
8X b  
0.54  
0.50  
PITCH  
PKG  
M
M
OUTLINE  
0.10  
0.05  
C
C
A B  
DIMENSIONS: MILLIMETERS  
NOTE 3  
BOTTOM VIEW  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
10  
NL27WZ125  
PACKAGE DIMENSIONS  
UQFN8, 1.4x1.2, 0.4P  
CASE 523AS  
ISSUE A  
NOTES:  
L
L
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.25 mm FROM THE TERMINAL TIP.  
L1  
PIN ONE  
REFERENCE  
DETAIL A  
E
MILLIMETERS  
2X  
ALTERNATE  
0.10  
0.10  
C
CONSTRUCTIONS  
DIM MIN  
0.45  
A1 0.00  
MAX  
0.55  
0.05  
A
2X  
C
TOP VIEW  
EXPOSED Cu  
MOLD CMPD  
A3  
b
0.13 REF  
0.15  
0.25  
D
E
e
L
1.40 BSC  
1.20 BSC  
0.40 BSC  
A
DETAIL B  
(A3)  
DETAIL B  
0.05  
0.05  
C
C
0.20  
−−−  
0.40  
0.15  
0.50  
ALTERNATE  
L1  
L2 0.30  
CONSTRUCTION  
8X  
A1  
SOLDERING FOOTPRINT*  
SEATING  
PLANE  
C
SIDE VIEW  
1.61  
0.55  
L
L2  
2
4
DETAIL A  
1
7X  
0.45  
1
1.40  
8
6
e
6X b  
M
M
0.10  
0.05  
C
C
A B  
0.40  
NOTE 3  
BOTTOM VIEW  
PITCH  
8X  
0.25  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
11  
NL27WZ125  
PACKAGE DIMENSIONS  
UQFN8, 1.6x1.6, 0.5P  
CASE 523AN  
ISSUE O  
NOTES:  
A
B
D
MOLD CMPD  
EXPOSED Cu  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
PIN ONE  
A3  
REFERENCE  
E
2X  
MILLIMETERS  
A1  
0.10  
C
DETAIL B  
DIM MIN  
0.45  
A1 0.00  
MAX  
0.60  
0.05  
OPTIONAL  
A
2X  
CONSTRUCTION  
0.10  
C
A3  
b
D
0.13 REF  
0.15  
0.25  
TOP VIEW  
1.60 BSC  
L1  
L3  
E
e
1.60 BSC  
0.50 BSC  
A
(A3)  
DETAIL B  
L
L1  
0.35  
−−−  
0.45  
0.15  
0.05  
C
C
L3 0.25  
0.35  
b
(0.15)  
0.05  
SOLDERING FOOTPRINT*  
(0.10)  
SIDE VIEW  
SEATING  
PLANE  
DETAIL A  
C
A1  
OPTIONAL  
1.70  
0.50  
PITCH  
CONSTRUCTION  
8X  
1
L3  
8X L  
e
5
3
1
0.35  
1.70  
7
8
DETAIL A  
8X b  
7X  
0.25  
8X  
0.10  
0.05  
C A B  
0.53  
NOTE 3  
C
BOTTOM VIEW  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
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literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
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NL27WZ125/D  
◊

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