NL27WZ126US [ONSEMI]
Dual Buffer with 3−State Outputs; 双缓冲器,具有三态输出型号: | NL27WZ126US |
厂家: | ONSEMI |
描述: | Dual Buffer with 3−State Outputs |
文件: | 总6页 (文件大小:73K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NL27WZ126
Dual Buffer with 3−State
Outputs
The NL27WZ126 is a high performance dual noninverting buffer
operating from a 1.65 V to 5.5 V supply.
Features
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• Extremely High Speed: t 2.6 ns (typical) at V = 5.0 V
PD
CC
MARKING
DIAGRAM
• Designed for 1.65 V to 5.5 V V Operation
CC
• Over Voltage Tolerant Inputs and Outputs
8
• LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with V = 3.0 V
CC
US8
US SUFFIX
CASE 493
M2 M G
• LVCMOS Compatible
8
G
• 24 mA Balanced Output Sink and Source Capability
1
• Near Zero Static Supply Current Substantially Reduces System
Power Requirements
1
• 3−State OE Input is Active−High
M2
M
G
= Device Code
= Date Code*
= Pb−Free Package
• Replacement for NC7WZ126
• Chip Complexity = 72 FETs
• Pb−Free Package is Available
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
PIN ASSIGNMENT
8
7
6
OE
A
V
CC
1
2
1
Pin
Function
1
OE
OE
1
2
2
3
4
5
6
7
8
A
Y
1
2
Y
1
Y
2
3
4
GND
A
2
Y
1
5
A
2
GND
OE
2
V
CC
Figure 1. Pinout (Top View)
FUNCTION TABLE
Input
Output
A
1
OE
H
A
Y
n
n
n
1
Y
Y
1
OE
EN
1
H
H
A
2
H
L
L
Z
2
OE
2
L
X
Figure 2. Logic Symbol
X = Don’t Care
n = 1, 2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 6
NL27WZ126/D
NL27WZ126
MAXIMUM RATINGS
Symbol
Parameter
Value
*0.5 to )7.0
*0.5 to )7.0
*0.5 to )7.0
*50
Unit
V
V
V
V
DC Supply Voltage
CC
I
DC Input Voltage
V
DC Output Voltage
V
O
I
I
I
I
I
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
V < GND
mA
mA
mA
mA
mA
°C
IK
I
V
< GND
O
*50
OK
O
$50
$100
CC
GND
$100
T
T
T
q
*65 to )150
260
STG
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance (Note 1)
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
°C
L
J
)150
°C
250
°C/W
mW
JA
P
250
D
MSL
Level 1
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
> 2000
> 200
N/A
V
Charged Device Model (Note 4)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
Supply Voltage
Operating
Data Retention Only
1.65
1.5
5.5
5.5
V
V
Input Voltage
(Note 5)
0
0
5.5
5.5
V
V
I
V
O
Output Voltage
(HIGH or LOW State)
T
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
*40
)85
°C
A
Dt/DV
V
CC
V
CC
V
CC
= 2.5 V $0.2 V
= 3.0 V $0.3 V
= 5.0 V $0.5 V
0
0
0
20
10
5
ns/V
5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
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2
NL27WZ126
DC ELECTRICAL CHARACTERISTICS
V
T
= 255C
Typ
*405C v T v 855C
CC
A
A
Symbol
Parameter
Condition
(V)
Min
0.7 V
Max
Min
Max
Unit
V
V
IH
High−Level Input Voltage
Low−Level Input Voltage
High−Level Output Voltage
1.65 to 5.5
1.65 to 5.5
0.7 V
CC
CC
V
IL
0.3 V
0.3 V
CC
V
CC
V
OH
I
= 100 mA
I = −8 mA
OH
1.65 to 5.5
1.65
2.7
V
CC
− 0.1
1.9
2.2
2.4
2.3
3.8
V
V − 0.1
CC
V
OH
CC
V
IN
= V
2.1
2.4
2.7
2.5
4.0
1.9
IH
I
= −12 mA
= −16 mA
= −24 mA
= −32 mA
2.2
2.4
2.3
3.8
OH
I
3.0
3.0
4.5
OH
I
OH
I
OH
V
OL
Low−Level Output Voltage
= V or V
I
= 100 mA
I = 8 mA
OL
1.65 to 5.5
1.65
2.7
0.1
0.3
0.4
0.4
0.55
0.1
0.3
0.4
0.4
0.55
V
OL
V
0.20
0.22
0.28
0.38
0.42
IN
IH
IL
I
OL
= 12 mA
= 16 mA
= 24 mA
= 32 mA
I
OL
3.0
3.0
4.5
I
OL
I
OL
0.55
0.55
I
Input Leakage Current
V
= V or GND
0 to 5.5
0
$0.1
$1.0
mA
mA
IN
IN
CC
I
Power Off−Output
Leakage Current
V
OUT
= 5.5 V
1
10
OFF
I
Quiescent Supply Current
3−State Output Leakage
V
V
= V or GND
5.5
1
10
mA
mA
CC
IN
CC
I
= V or V
1.65 to 5.5
$0.5
$5
OZ
IN
IL
IH
0 V v V
v 5.5 V
OUT
AC ELECTRICAL CHARACTERISTICS (t = t = 3.0 ns)
R
F
V
T
A
= 255C
*405C v T v 855C
CC
A
Symbol
Parameter
Condition
C = 15 pF
(V)
Min
Typ Max
Min
Max
Unit
t
Propagation Delay
AN to YN
(Figures 3 and 4,
Table 1)
1.8 $ 0.15
2.5 $ 0.2
2.0
1.0
12
7.5
2.0
1.0
13
8
ns
R = 1 MW
PLH
L
L
t
PHL
R = 1 MW
C = 15 pF 3.3 $ 0.3
0.8
1.2
0.5
0.8
5.2
5.7
4.5
5.0
1.0
0.8
0.8
1.2
0.5
0.8
5.5
6.0
4.8
5.3
1.0
0.8
L
L
R = 500 W
C = 50 pF
L
L
R = 1 MW
C = 15 pF 5.0 $ 0.5
L
L
R = 500 W
C = 50 pF
L
L
t
t
Output to Output Skew
(Note 6)
3.3 $ 0.3
ns
ns
R = 500 W
C = 50 pF
L
OSLH
L
OSHL
R = 500 W
C = 50 pF 5.0 $ 0.5
L
L
t
Output Enable Time
(Figures 5, 6 and 7,
Table 1)
1.8 $ 0.15
2.5 $ 0.2
3.0
1.8
14
8.5
3.0
1.8
15
9.0
R = 250 W
C = 50 pF
L
PZH
L
t
PZL
3.3 $ 0.3
5.0 $ 0.5
1.2
0.8
6.2
5.5
1.2
0.8
6.5
5.8
t
Output Enable Time
(Figures 5, 6 and 7,
Table 1)
R and R1= 500 W C = 50 pF 1.8 $ 0.15
2.5
1.5
12
8.0
2.5
1.5
13
8.5
ns
PHZ
L
L
2.5 $ 0.2
3.3 $ 0.3
5.0 $ 0.5
t
PLZ
0.8
0.3
5.7
4.7
0.8
0.3
6.0
5.0
6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
This specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
guaranteed by design.
) or LOW−to−HIGH (t
); parameter
OSHL
OSLH
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3
NL27WZ126
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
2.5
Unit
pF
C
Input Capacitance
Output Capacitance
V
V
= 5.5 V, V = 0 V or V
I
IN
CC
CC
CC
C
= 5.5 V, V = 0 V or V
2.5
pF
OUT
CC
I
C
Power Dissipation Capacitance
(Note 7)
10 MHz, V = 3.3 V, V = 0 V or V
9
pF
PD
CC
I
CC
10 MHz, V = 5.5 V, V = 0 V or V
11
CC
I
CC
7. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
power consumption; P = C ꢀ V
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
t = 3 ns
f
t = 3 ns
f
OE = GND
V
CC
90%
mi
90%
INPUT
OUTPUT
INPUT
A and B
V
V
mi
10%
10%
C *
L
R
L
GND
t
t
PHL
PLH
V
V
OH
V
mo
V
mo
OUTPUT Y
*Includes all probe and jig capacitance.
A 1 MHz square input wave is recommended for
OL
propagation delay tests.
Figure 3. Switching Waveform
Figure 4. tPLH or tPHL
2.7 V
V
mi
V
mi
OE
0 V
t
t
PHZ
PZH
V
CC
V
− 0.3 V
OH
V
V
On
mo
≈ 0 V
t
t
PLZ
PZL
≈ 3.0 V
+ 0.3 V
On
mo
V
OL
GND
Figure 5. AC Output Enable and Disable Waveform
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4
NL27WZ126
Table 1. Output Enable and Disable Times
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 nsv
V
CC
3.3 V $ 0.3 V
1.5 V
2.7 V
1.5 V
1.5 V
2.5 V $ 0.2 V
Symbol
V
mi
V
2
CC/
V
mo
1.5 V
V
CC/
2
2 V
CC
INPUT
INPUT
R = 500 W
1
V
CC
OUTPUT
R = 500 W
OUTPUT
R = 250 W
C = 50 pF
L
C = 50 pF
L
L
L
A 1 MHz square input wave is recommended for
propagation delay tests.
A 1 MHz square input wave is recommended for
propagation delay tests.
Figure 6. tPZL or tPLZ
Figure 7. tPZH or tPHZ
DEVICE ORDERING INFORMATION
Device Nomenclature
Temp
Logic
No. of
Device Order
Number
Device
Function
Package
Suffix
Package
Type
Tape and
Reel Size
Circuit
Gates per
Range
†
Indicator Package Identifier
Technology
WZ
NL27WZ126US
NL
NL
2
2
7
7
126
126
US
US8
178 mm, 3000 Units
178 mm, 3000 Units
NL27WZ126USG
WZ
USG
US8
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NL27WZ126
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE B
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
A
J
8
5
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
DETAIL E
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
B
L
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED 0.0508 (0.0002 “).
1
4
R
S
G
P
U
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
MIN
1.90
2.20
0.60
0.17
0.20
0.50 BSC
0.40 REF
0.10
MAX
2.10
2.40
0.90
0.25
0.35
MIN
MAX
0.083
0.094
0.035
0.010
0.014
C
0.075
0.087
0.024
0.007
0.008
0.020 BSC
0.016 REF
0.004
H
−T−
SEATING
PLANE
0.10 (0.004)
T
K
N
D
R 0.10 TYP
M
M
0.10 (0.004)
T
X Y
0.18
0.10
3.20
6
0.007
0.004
0.126
6
V
0.00
3.00
0
0.000
0.118
0
_
_
_
_
5
10
5
10
_
_
_
_
0.23
0.23
0.37
0.60
0.34
0.33
0.47
0.80
0.010
0.009
0.015
0.024
0.013
0.013
0.019
0.031
F
R
S
U
V
DETAIL E
0.12 BSC
0.005 BSC
SOLDERING FOOTPRINT*
3.8
0.15
1.8
0.07
0.50
0.0197
0.30
0.012
1.0
0.0394
mm
inches
ǒ
Ǔ
SCALE 8:1
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
NL27WZ126/D
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