NL27WZ16DBVT1G [ONSEMI]
双缓冲器;型号: | NL27WZ16DBVT1G |
厂家: | ONSEMI |
描述: | 双缓冲器 栅 逻辑集成电路 栅极 |
文件: | 总6页 (文件大小:76K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NL27WZ16
Dual Buffer
The NL27WZ16 is a high performance dual buffer operating from a
1.65 to 5.5 V supply. At V = 3 V, high impedance TTL compatible
CC
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance.
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Features
• Extremely High Speed: t 2.0 ns (typical) at V = 5 V
PD
CC
• Designed for 1.65 V to 5.5 V V Operation
MARKING
DIAGRAMS
CC
• Over Voltage Tolerant Inputs
• LVTTL Compatible − Interface Capability With 5 V TTL Logic
SC−88/SC−70−6/SOT−363
DF SUFFIX
with V = 3 V
CC
MR M G
• LVCMOS Compatible
G
CASE 419B
1
• 24 mA Balanced Output Sink and Source Capability
1
• Near Zero Static Supply Current Substantially Reduces System
Power Requirements
• Chip Complexity: FET = 72; Equivalent Gate = 18
• Pb−Free Packages are Available
TSOP−6
DT SUFFIX
CASE 318G
MR M G
G
1
1
MR = Device Code
M
G
= Date Code*
= Pb−Free Package
6
5
4
OUT Y1
1
2
IN A1
GND
(Note: Microdot may be in either location)
*Date Code orientation and/or position and underbar
may vary depending upon manufacturing location.
V
CC
3
OUT Y2
IN A2
PIN ASSIGNMENT
Figure 1. Pinout (Top View)
1
2
3
4
5
6
IN A1
GND
IN A2
OUT Y2
V
CC
1
1
IN A1
IN A2
OUT Y1
OUT Y2
OUT Y1
FUNCTION TABLE
Figure 2. Logic Symbol
A Input
Y Output
L
L
H
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
February, 2007 − Rev. 5
NL27WZ16/D
NL27WZ16
MAXIMUM RATINGS
Characteristics
Symbol
Value
Unit
V
DC Supply Voltage
V
CC
*0.5 to )7.0
DC Input Voltage
V
I
*0.5 ≤ V ≤ )7.0
V
I
DC Output Voltage
Output in Z or LOW State (Note 1)
V
O
*0.5 ≤ V ≤ 7.0
V
O
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Power Dissipation in Still Air
Thermal Resistance
V < GND
I
*50
*50
mA
mA
mA
mA
mA
°C
I
IK
V
O
< GND
I
OK
I
$50
O
I
$100
$100
*65 to )150
200
CC
I
GND
T
STG
SC−88, TSOP−6
SC−88, TSOP−6
P
mW
°C/W
°C
D
q
333
JA
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
ESD Withstand Voltage
T
260
L
T
)150
°C
J
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
V
ESD
> 2000
> 200
N/A
V
Latchup Performance
Above V and Below GND at 85°C (Note 5)
I
$500
mA
CC
Latchup
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. I absolute maximum rating must be observed.
O
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
Operating
Data Retention Only
V
CC
1.65
1.5
5.5
5.5
V
Input Voltage
V
0
0
5.5
5.5
V
V
I
Output Voltage
(High or LOW State)
V
O
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
T
*40
)85
°C
A
V
V
= 1.8 V $0.15 V
Dt/DV
0
0
0
0
20
20
10
5
ns/V
CC
= 2.5 V $0.2 V
=3.0 V $0.3 V
=5.0 V $0.5 V
CC
V
V
CC
CC
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2
NL27WZ16
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
*405C v T v 855C
A
V
(V)
CC
Min
Max
Min
Max
Unit
V
Parameter
Condition
Symbol
High−Level Input
Voltage
V
IH
1.65 to 1.95 0.75 V
0.75 V
0.7 V
CC
CC
CC
CC
2.3 to 5.5
0.7 V
Low−Level Input
Voltage
V
IL
1.65 to 1.95
2.3 to 5.5
0.25 V
0.3 V
0.25 V
0.3 V
CC
CC
CC
CC
V
High−Level Output
Voltage
V
OH
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
I
= −100 mA
OH
V
V
IN
= V
IH
I
= −4 mA
= −8 mA
= −16 mA
= −24 mA
= −32 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.80
2.68
4.20
1.29
1.9
2.4
2.3
3.8
OH
I
OH
V
V
I
OH
I
OH
I
OH
Low−Level Output
Voltage
V
OL
1.65
1.8
2.3
3.0
4.5
0.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
I
OL
= 100 mA
V
IN
= V
IL
I
= 4 mA
= 8 mA
= 16 mA
= 24 mA
= 32 mA
1.65
2.3
3.0
3.0
4.5
0.08
0.10
0.15
0.22
0.22
0.24
0.30
0.40
0.55
0.55
0.24
0.30
0.40
0.55
0.55
OL
I
OL
V
I
OL
I
OL
I
OL
Input Leakage Current 0 V v V v 5.5 V
I
IN
0 to 5.5
$1.0
$1.0
IN
mA
Power Off Leakage
Current
V
V
or V
= 5.5 V
I
OFF
0.0
1.0
10
IN
OUT
mA
mA
Quiescent Supply
Current
= 5.5 V, GND
I
1.65 to 5.5
1.0
10
IN
CC
AC ELECTRICAL CHARACTERISTICS t = t = 2.5 ns; C = 50 pF; R = 500 W
R
F
L
L
T
A
= 25°C
Typ
8.0
*40°C ≤ T ≤ 85°C
A
Min
1.8
1.0
0.8
1.2
0.5
0.8
Max
9.6
5.2
3.6
4.6
2.9
3.8
Min
1.8
1.0
0.8
1.2
0.5
0.8
Max
10.2
5.8
Parameter
Condition
R = 1 MW, C = 15 pF
Symbol
V
(V)
Unit
CC
1.8 $ 0.15
2.5 $ 0.2
Propagation Delay
(Figure 3 and 4)
t
t
ns
L
L
PLH
PHL
R = 1 MW, C = 15 pF
3.0
L
L
R = 1 MW, C = 15 pF
2.3
4.0
L
L
3.3 $ 0.3
5.0 $ 0.5
R = 500 W, C = 50 pF
3.0
5.1
L
L
R = 1 MW, C = 15 pF
1.8
3.2
L
L
R = 500 W, C = 50 pF
2.4
4.2
L
L
CAPACITIVE CHARACTERISTICS
Parameter
Condition
= 5.5 V, V = 0 V or V
Symbol
Typical
Unit
pF
Input Capacitance
V
CC
C
7.0
I
CC
IN
Power Dissipation Capacitance (Note 6)
10 MHz, V = 3.3 V, V = 0 V or V
C
9
11
pF
CC
I
CC
CC
PD
10 MHz, V = 5.5 V, V = 0 V or V
CC
I
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
power consumption; P = C ꢀ V
) = C ꢀ V ꢀ f ) I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
ꢀ f ) I ꢀ V
.
D
PD
CC
in
CC
CC
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3
NL27WZ16
V
CC
A
Y
50%
GND
t
t
PHL
PLH
50% V
CC
PROPAGATION DELAYS
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns
F
W
Figure 3. Switching Waveforms
V
CC
PULSE
GENERATOR
DUT
R
T
C
R
L
L
R = Z
of pulse generator (typically 50 W)
T
OUT
Figure 4. Test Circuit
ORDERING INFORMATION
†
Device
Package
Shipping
NL27WZ16DFT2
SC−88/SC−70/SOT−363
NL27WZ16DFT2G
SC−88/SC−70/SOT−363
(Pb−Free)
3000 /Tape & Reel
NL27WZ16DTT1
TSOP−6
TSOP−6
(Pb−Free)
NL27WZ16DTT1G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ16
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
e
MILLIMETERS
DIM MIN NOM MAX
0.80
INCHES
NOM MAX
1.10 0.031 0.037 0.043
0.10 0.000 0.002 0.004
0.008 REF
MIN
6
1
5
2
4
3
A
0.95
0.05
A1 0.00
H
−E−
E
A3
0.20 REF
0.21
0.14
2.00
1.25
0.65 BSC
0.20
2.10
b
C
D
E
e
0.10
0.10
1.80
1.15
0.30 0.004 0.008 0.012
0.25 0.004 0.005 0.010
2.20 0.070 0.078 0.086
1.35 0.045 0.049 0.053
0.026 BSC
b 6 PL
L
0.10
2.00
0.30 0.004 0.008 0.012
2.20 0.078 0.082 0.086
H
E
M
M
0.2 (0.008)
E
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
NL27WZ16
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE S
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
6
5
2
4
E
H
E
1
3
b
MILLIMETERS
INCHES
NOM
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
−
DIM
A
A1
b
c
D
E
e
L
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
NOM
1.00
0.06
0.38
0.18
3.00
1.50
0.95
0.40
2.75
−
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
e
q
c
A
0.05 (0.002)
L
A1
H
E
q
SOLDERING FOOTPRINT*
2.4
0.094
0.95
0.037
1.9
0.075
0.95
0.037
0.7
0.028
1.0
mm
inches
0.039
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NL27WZ16/D
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