NL27WZ16DFT2G-L22348 [ONSEMI]
Dual Buffer;
| 型号： | NL27WZ16DFT2G-L22348 |
| 厂家： | 
ONSEMI |
| 描述： | Dual Buffer 栅 栅极 |
| 文件： | 总6页 (文件大小：116K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NL27WZ16
Dual Buffer
The NL27WZ16 is a high performance dual buffer operating from a
1.65 to 5.5 V supply. At V = 3 V, high impedance TTL compatible
CC
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance.
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Features
• Extremely High Speed: t 2.0 ns (typical) at V = 5 V
PD
CC
MARKING
DIAGRAMS
• Designed for 1.65 V to 5.5 V V Operation
CC
• Over Voltage Tolerant Inputs
• LVTTL Compatible − Interface Capability With 5 V TTL Logic
SC−88/SC−70−6/SOT−363
DF SUFFIX
with V = 3 V
MR M G
CC
G
1
• LVCMOS Compatible
• 24 mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current Substantially Reduces System
Power Requirements
• Chip Complexity: FET = 72; Equivalent Gate = 18
• These Devices are Pb−Free and are RoHS Compliant
CASE 419B
1
TSOP−6
DT SUFFIX
CASE 318G
MR M G
G
1
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
1
MR = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
IN A1
GND
IN A2
1
2
3
6
5
4
OUT Y1
V
CC
PIN ASSIGNMENT
Pin
1
Function
IN A1
OUT Y2
2
GND
3
IN A2
Figure 1. Pinout (Top View)
4
OUT Y2
5
V
CC
6
OUT Y1
1
1
IN A1
IN A2
OUT Y1
OUT Y2
FUNCTION TABLE
A Input
Y Output
L
L
Figure 2. Logic Symbol
H
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
May, 2012 − Rev. 9
NL27WZ16/D
NL27WZ16
MAXIMUM RATINGS
Symbol
Characteristics
Value
Units
V
DC Supply Voltage
DC Input Voltage
DC Output Voltage
−0.5 to +7.0
V
V
V
CC
V
−0.5 ≤ V ≤ +7.0
I
I
V
−0.5 ≤ V ≤ +7.0
O
O
Output in Z or LOW State (Note 1)
I
DC Input Diode Current
−50
−50
mA
mA
IK
V < GND
I
I
DC Output Diode Current
OK
V
O
< GND
I
DC Output Sink Current
50
100
mA
mA
mA
°C
O
I
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
CC
I
100
GND
T
−65 to +150
STG
P
D
Power Dissipation in Still Air
SC−88, TSOP−6
mW
200
q
Thermal Resistance
°C/W
JA
SC−88, TSOP−6
333
260
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
°C
°C
V
L
J
T
+150
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
I
Latchup Performance
mA
Latchup
Above V and Below GND at 85°C (Note 5)
500
CC
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. I absolute maximum rating must be observed.
O
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Units
V
CC
Supply Voltage
Operating
Data Retention Only
V
1.65
1.5
5.5
5.5
V
Input Voltage
0
0
5.5
5.5
V
V
I
V
O
Output Voltage (High or LOW State)
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
T
A
−55
+125
°C
Dt/DV
ns/V
V
CC
V
CC
V
CC
V
CC
= 1.8 V 0.15 V
= 2.5 V 0.2 V
= 3.0 V 0.3 V
= 5.0 V 0.5 V
0
0
0
0
20
20
10
5
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2
NL27WZ16
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
−555C 3 T 3 1255C
A
V
(V)
CC
Min
Max
Min
Max
Units
Symbol
Parameter
Condition
V
IH
High−Level Input
Voltage
1.65 to 1.95 0.75 V
0.75 V
CC
CC
CC
CC
2.3 to 5.5
0.7 V
0.7 V
V
V
V
V
Low−Level Input
1.65 to 1.95
2.3 to 5.5
0.25 V
0.25 V
IL
CC
CC
CC
CC
Voltage
0.3 V
0.3 V
V
OH
High−Level Output
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
I
= −100 mA
OH
Voltage
V
IN
= V
IH
I
= −4 mA
= −8 mA
= −16 mA
= −24 mA
= −32 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.80
2.68
4.20
1.29
1.9
2.4
2.3
3.8
OH
I
OH
V
V
I
OH
I
OH
I
OH
V
OL
Low−Level Output
1.65
1.8
2.3
3.0
4.5
0.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
I
OL
= 100 mA
Voltage
V
IN
= V
IL
I
OL
= 4 mA
= 8 mA
= 16 mA
= 24 mA
= 32 mA
1.65
2.3
3.0
3.0
4.5
0.08
0.10
0.15
0.22
0.22
0.24
0.30
0.40
0.55
0.55
0.24
0.30
0.40
0.55
0.55
OL
I
V
I
OL
I
OL
I
OL
I
IN
Input Leakage Current
V
IN
= 5.5 V or GND
0 to 5.5
0.1
1.0
mA
I
Power Off Leakage
Current
V
V
= 5.5 V or
OUT
0
1
10
OFF
IN
= 5.5 V
mA
mA
I
Quiescent Supply
Current
V
IN
= 5.5 V or GND
5.5
1
10
CC
AC ELECTRICAL CHARACTERISTICS t = t = 2.5 ns; C = 50 pF; R = 500 W
R
F
L
L
T
A
= 25°C
−55°C 3 T 3 125°C
A
Min
1.8
1.0
0.8
1.2
0.5
0.8
Typ
8.0
3.0
2.3
3.0
1.8
2.4
Max
9.6
5.2
3.6
4.6
2.9
3.8
Min
1.8
1.0
0.8
1.2
0.5
0.8
Max
10.2
5.8
Symbol
Parameter
Condition
V
(V)
Units
CC
t
Propagation Delay
(Figure 3 and 4)
1.8 0.15
2.5 0.2
ns
R = 1 MW, C = 15 pF
PLH
L
L
t
PHL
R = 1 MW, C = 15 pF
L
L
R = 1 MW, C = 15 pF
4.0
L
L
3.3 0.3
5.0 0.5
R = 500 W, C = 50 pF
5.1
L
L
R = 1 MW, C = 15 pF
3.2
L
L
R = 500 W, C = 50 pF
4.2
L
L
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Power Dissipation Capacitance (Note 6)
Condition
= 5.5 V, V = 0 V or V
CC
Typical
Units
pF
C
IN
V
CC
7.0
I
C
PD
10 MHz, V = 3.3 V, V = 0 V or V
9
11
pF
CC
I
CC
CC
10 MHz, V = 5.5 V, V = 0 V or V
CC
I
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
) = C ꢀ V ꢀ f ) I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption; P = C ꢀ V
ꢀ f ) I ꢀ V
.
D
PD
CC
in
CC
CC
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3
NL27WZ16
V
CC
A
Y
50%
GND
t
t
PHL
PLH
50% V
CC
PROPAGATION DELAYS
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns
F
W
Figure 3. Switching Waveforms
V
CC
PULSE
GENERATOR
DUT
R
T
C
L
R
L
R = Z
of pulse generator (typically 50 W)
T
OUT
Figure 4. Test Circuit
Package
ORDERING INFORMATION
†
Device
Shipping
NL27WZ16DFT2G
SC−88/SC−70/SOT−363
(Pb−Free)
3000 /Tape & Reel
3000 /Tape & Reel
3000 /Tape & Reel
NLV27WZ16DFT2G*
NL27WZ16DTT1G
SC−88/SC−70/SOT−363
(Pb−Free)
TSOP−6
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
NL27WZ16
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
e
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
MILLIMETERS
DIM MIN NOM MAX MIN
0.80
INCHES
NOM MAX
1.10 0.031 0.037 0.043
0.10 0.000 0.002 0.004
0.008 REF
6
1
5
2
4
3
A
0.95
0.05
A1 0.00
H
E
−E−
A3
0.20 REF
0.21
0.14
2.00
1.25
0.65 BSC
0.20
2.10
b
C
D
E
e
0.10
0.10
1.80
1.15
0.30 0.004 0.008 0.012
0.25 0.004 0.005 0.010
2.20 0.070 0.078 0.086
1.35 0.045 0.049 0.053
0.026 BSC
0.30 0.004 0.008 0.012
2.20 0.078 0.082 0.086
b 6 PL
L
0.10
2.00
H
E
M
M
0.2 (0.008)
E
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
NL27WZ16
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
H
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
6
1
5
2
4
L2
GAUGE
PLANE
E1
E
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
3
L
MILLIMETERS
SEATING
PLANE
M
C
NOTE 5
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
NOM
1.00
MAX
1.10
0.10
0.50
0.26
3.10
3.00
1.70
1.05
0.60
b
DETAIL Z
e
0.06
0.38
0.18
3.00
c
2.75
A
0.05
1.50
0.95
L
0.40
A1
L2
M
0.25 BSC
−
DETAIL Z
0°
10°
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
0.95
3.20
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NL27WZ16/D
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