NLA16T245_技术文档

NLA16T245

16-Bit (Dual 8-Bit)

Configurable Dual-Supply

Translating Transceiver

with 3-State Outputs

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The NLA16T245 is a 16−bit (dual 8−bit) configurable dual−supply

translating bidirectional transceiver with 3−state outputs. The A− and

B−ports are designed to track two different power supply rails, V

CCA

and V

respectively. Both supply rails are configurable from 0.9 V

CCB

TSSOP−48

DT SUFFIX

CASE1201

to 4.5 V allowing universal bidirectional voltage translation between

the A− and B−ports.

1

The Direction inputs, 1DIR and 2DIR, determine the direction of

data flow. 1DIR and 2DIR are independent of each other. When 1DIR

or 2DIR is High, data flows from 1An to 1Bn or 2An to 2Bn

respectively. When 1DIR or 2DIR is Low, data flows from 1Bn to 1An

or 2Bn to 2An respectively. The Output Enable inputs, and , when

High, disables both A− and B−ports by putting them in 3−state. The

MARKING DIAGRAM

1DIR, 2DIR, and signals are all designed to track V

.

NLA16T245G

AWLYYWW

CCA

Features

1

• Wide V

and V

Operating Range: 0.9 V to 4.5 V

CCA

CCB

• Output Noise Reduction through Dynamic Output Impedance

XXXXX = Specific Device Code

Change

A

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

WL

YY

WW

G

• Drive Capability: 12 mA @ 3.0 V V

CC

• Input/Output Pins OVT to 5.5 V

• Control Inputs Track V

CCA

• Non−preferential V Sequencing

CC

• Outputs at 3−State until Active V is reached

CC

• Power−Off Protection

ORDERING INFORMATION

• Outputs Switch to 3−State with either V at GND

†

CC

Device

NLA16T245DTR2G

Package

TSSOP−48 2500 / Tape &

(Pb−Free) Reel

Shipping

• Pb−Free Packaging: TSSOP−48

• This is a Pb−Free Device

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

Typical Applications

• Mobile Phones, PDAs, Other Portable Devices

Important Information

• ESD Protection for All Pins:

Human Body Model (HBM) > 2000 V

Machine Model (MM) > 200 V

1

Publication Order Number:

September, 2013 − Rev. 0

NLA16T245/D

NLA16T245

Figure 1. Logic Diagram

Figure 2. Pin Assignment

Pin Names

Pins

Function table

Description

A−Port DC Power Supply

B−Port DC Power Supply

Ground

nOE

L

nDIR

Operating Mode

nB to nA

V

CCA

V

CCB

L

H

X

L

nA to nB

GND

H

nA and nB Ports at Hi−Z

1OE, 2OE

1DIR, 2DIR

Output Enable Pins

Direction Select Pins

A−Port I/O

1A , 2A

n

1B , 2B

B−Port I/O

n

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2

NLA16T245

MAXIMUM RATINGS

Symbol

Parameter

Value

Condition

Unit

V

CCA

, V

DC Supply Voltage

Input Voltage

−0.5 to +5.5

−0.5 to +4.6

−0.5 to +5.5

−0.5 to +4.6

−0.5 to +5.5

CCB

V

I

nOE, nDIR, nA

nB

V

CCA

= 0 V

V

CCA

≥ 0.9 V

V

CCB

= 0 V

V

CCB

≥ 0.9 V

V

O

Output Voltage

(Power−Off Mode) nA, nB

(3−State Mode) nA, nB

V

or V = 0

CCB

V

CCA

V

, V

≥ 0.9 V

CCA

CCB

(Active Mode − High or Low State) nA

(Active Mode − High or Low State) nB

nOE, nDIR

−0.5 to V

+ 0.5

V

, V

≥ 0.9 V

CCA

CCB

−0.5 to V

+ 0.5

I

IK

DC Input Diode Current

−50

V < GND

I

mA

°C

I

DC Output Diode Current

−50

50

V < GND

O

OK

I

DC Output Source/Sink Current

DC Supply Current Per Supply Pin

DC Ground Current per Ground Pin

Storage Temperature

O

I

100

CC

I

GND

T

−65 to +125

STG

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

RECOMMENDED OPERATING CONDITIONS

Symbol

, V

Parameter

Min

0.9

Max

4.5

Unit

V

CCA

Positive DC Supply Voltage

Input Voltage

CCB

V

I

GND

−55

V

O

Output Voltage

(Power Down) nA, nB

V

(3−State Mode) nA, nB

(Active Mode − High or Low State) nA

(Active Mode − High or Low State) nB

V

CCA

CCB

V

T

A

Operating Temperature Range

Input Transition Rise or Rate

+115

10

°C

Dt/DV

0

nS

V , V from 30% to 70% of V ; V =3.3 V 0.3 V

I

IO

CC

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3

NLA16T245

DC ELECTRICAL CHARACTERISTICS (INPUT)

Parameter

−555C to +1155C

V

CCI

(Note 1)

(V)

V

CCO

(Note 2)

(V)

Min

Max

Symbol

Test Conditions

Unit

V

IH

3.6 − 4.5

0.9 − 4.5

2.2

V

2.7 − 3.6

1.95 − 2.7

1.2 − 1.95

0.9 − 1.2

3.6 − 4.5

2.7 − 3.6

1.95 − 2.7

1.2 − 1.95

0.9 − 1.2

3.6 − 4.5

2.7 − 3.6

1.95 − 2.7

1.2 − 1.95

0.9 − 1.2

3.6 − 4.5

2.7 − 3.6

1.95 − 2.7

1.2 − 1.95

0.9 − 1.2

2.0

Input HIGH Voltage,

Data Inputs

1.7

0.65 * V

CCI

0.9 * V

CCI

0.8

Input LOW Voltage,

Data Inputs

0.7

V

0.9 − 4.5

V

IL

0.35 * V

CCI

0.1 * V

CCI

2.2

2.0

1.6

Input HIGH Voltage,

Control Inputs

V

IH

Referenced to V

CCA

0.65 * V

CCA

0.9 * V

0.8

0.7

Input LOW Voltage,

Control Inputs

V

IL

CCA

0.35 * V

CCA

0.1 * V

NOTE: Connect ground before applying supply voltage V

sequence of V and V

or V

. This device is designed with the feature that the power−up

CCA

CCB

will not damage the IC.

CCB

CCA

1. V

is the V associated with the input port.

CCI

CC

2. V

is the V associated with the output port.

CCO

CC

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4

NLA16T245

DC ELECTRICAL CHARACTERISTICS (continued)

−555C to +1155C

Min

V − 0.2

CCO

Max

Symbol

Parameter

Test Conditions

V

(V)

V

(V)

Unit

CCA

CCB

I

= −100 mA; V = V

0.9 − 4.5

0.9

0.9 − 4.5

0.9

OH

OL

I

IH

= −0.5 mA; V = V

0.75 * V

CCO

I

= −2 mA; V = V

1.4

1.05

1.2

I

IH

= −4 mA; V = V

1.65

2.3

1.65

2.3

V

OH

Output HIGH Voltage

V

I

= −8 mA; V = V

1.75

2.3

I

= −12 mA; V = V

3.0

I

IH

= −12 mA; V = V

4.5

4.0

I

IH

= 100 mA; V = V

0.9 − 4.5

0.9

0.9 − 4.5

0.9

0.2

I

IL

= 0.5 mA; V = V

0.25 * V

CCO

I

IL

= 2 mA; V = V

1.4

0.35

0.45

0.55

0.7

I

IL

= 4 mA; V = V

1.65

2.3

1.65

2.3

V

OL

Output LOW Voltage

V

I

= 8 mA; V = V

I

= 12 mA; V = V

3.0

I

IL

= 12 mA; V = V

4.5

0.75

2.5

I

IL

I

Input Leakage Current V = V

or GND

nOE

nA

0.9 − 4.5

0

0.9 − 4.5

0 − 4.5

0

mA

I

CCA

I

10.0

OFF

Power−Off Leakage

Current

V or V = 0 to 4.5 V,

I

O

nB

0 − 4.5

V = V or V , V = V

I

IH

IL

O

CCO

nA, nB

3.6

12.5

or GND, nOE = V

IH

(3)

OZ

I

3−State Output

mA

Leakage Current

nA

nB

3.6

0

3.6

0.9

1.6

1.95

2.7

3.6

0

12.5

20

V = V or V , V = V

I

IH

IL

O

CCO

or GND, nOE = don’t care

0.9

1.6

1.95

2.7

0

20

30

−40

40

Quiescent Supply

Current

I

V = V

or GND; I = 0

mA

CCA

I

CCI

O

3.6

0

3.6

4.5

0

40

−40

40

4.5

0.9

1.6

1.95

2.7

0

4.5

0.9

1.6

1.95

2.7

3.6

0

40

20

30

−40

40

Quiescent Supply

Current

I

V = V

or GND; I = 0

mA

CCB

I

CCI

O

3.6

0

3.6

4.5

0

40

−40

40

4.5

40

NOTE: Connect ground before applying supply voltage V

or V

. This device is designed with the feature that the power−up

CCA

CCB

sequence of V

and V

will not damage the IC.

CCA

CCB

3. V

4. V

is the V associated with the input port.

CCI

CC

is the V associated with the output port.

CCO

CC

5. For I/O ports, the parameter IOZ includes the input leakage current.

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5

NLA16T245

AC ELECTRICAL CHARACTERISTICS − See Figure 3

−555C to +1155C

V

CCB

(V)

4.0 − 4.5

3.0 − 3.6

2.3 − 2.7

1.65 − 1.95

1.4 − 1.6

Min Max

Min

Max

Min

Max

Min

Max

Min

Max

Symbol

Parameter

From

To

Unit

V

CCA

= 4.0 − 4.5 V

t

Propagation

Delay

A

B

A

B

A

B

0.5

0.3

0.2

0.8

1.2

3.2

4.5

9.5

4.5

5.6

6

0.3

0.5

1.0

1.2

1.0

1.2

3.2

5.8

7.7

4.8

5.6

6.1

0.7

0.5

0.9

1.4

1.1

3.5

6

0.8

0.7

1.0

1.8

1.1

2.6

4.2

6.3

9

0.4

1.2

0.8

1.6

1.2

2.3

4

ns

PD

6.8

8.5

7.5

5.7

9.6

8

t

Output Enable

Output Disable

ns

EN

6.7

5.6

6

7

5.7

9.2

t

ns

DIS

Output to Out-

put Skew

t

0.15

OSK

V

= 3.0 − 3.6 V

CCA

A

B

A

B

A

B

0.5

0.6

0.8

1.0

1.5

1.7

3.5

5.5

10

5

0.5

0.4

1.0

1.9

1.5

3.1

5.5

8

0.5

0.7

1.3

2.0

1.2

1.1

3.7

5.5

8.0

5.4

5.8

0.7

1.4

1.9

1.6

1.7

5.4

5.8

9.2

6.7

5.2

8.5

0.5

1.0

1.3

0.8

1.4

1.2

5.9

6.5

8.7

7.4

5.4

8.8

Propagation

Delay

t

ns

PD

EN

t

Output Enable

Output Disable

4.9

5.4

6.1

6

t

ns

DIS

6.4

Output to Out-

put Skew

t

0.15

OSK

= 2.3 − 2.7 V

CCA

A

B

A

B

A

B

0.7

0.6

0.9

0.7

2

4

0.5

2.0

1.5

1.6

1.4

3.4

5.3

9.0

5.3

6.2

6.0

0.4

0.6

1.7

2.2

0.7

1.0

4.0

5.0

7.0

6.1

6.5

5.6

0.7

1.2

1.6

2.2

1.5

1.7

5.6

5.8

7.9

7.0

6.0

8.2

0.2

1.0

1.6

1.2

2.0

0.9

6.0

6.1

8.0

7.8

6.5

9.0

Propagation

Delay

t

ns

PD

4.7

12

5.7

6.8

6

Output Enable

Output Disable

EN

t

ns

DIS

1.2

Output to Out-

put Skew

t

0.15

OSK

= 1.65 − 1.95 V

CCA

A

B

A

B

A

B

1.1

1.2

2.2

0.5

2

4.2

4.5

9.7

8.2

9.3

6.2

0.8

1.3

2.0

2.7

1.8

2.0

4.3

5.5

8.5

8.1

8.0

6.1

0.9

2.2

2.7

1.5

1.0

4.7

5.8

8.9

8.1

8.0

5.5

1.0

1.8

2.1

2.7

2.5

6.0

6.7

9.5

8.3

8.8

8.3

0.6

1.4

2.5

1.8

2.1

6.4

6.5

10.0

9.0

8.6

8.8

Propagation

Delay

t

ns

PD

EN

t

Output Enable

Output Disable

t

ns

DIS

1.8

Output to Out-

put Skew

t

0.15

OSK

= 1.4 − 1.6 V

CCA

A

B

A

1.2

1

5

1.3

0.7

5.8

7.3

1.0

0.9

5.5

7.6

1.5

6.3

7.4

1.7

1.8

6.7

6.8

Propagation

Delay

t

ns

PD

5.5

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6

NLA16T245

AC ELECTRICAL CHARACTERISTICS − See Figure 3

−555C to +1155C

V

CCB

(V)

4.0 − 4.5

3.0 − 3.6

2.3 − 2.7

1.65 − 1.95

1.4 − 1.6

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

Symbol

Parameter

Output Enable

Output Disable

From

To

Unit

V

CCA

= 1.4 − 1.6 V

A

B

A

B

3

2

11.5

10

12

6

2.1

3.2

2.0

1.3

10.5

10.7

10.5

6.4

2.3

3.2

1.7

1.1

10.5

10.8

10.5

6.5

2.7

3.2

2.5

12.0

10.2

9.5

2.6

2.7

2.1

12.8

10.6

9.7

t

ns

EN

3

t

ns

DIS

1.2

8.5

8.8

Output to Out-

put Skew

t

0.15

OSK

CAPACITANCES

Symbol

Typ

(Note 6)

Parameter

Output State

Test Conditions

V = 3.3 V or GND

Unit

pF

C

Control Pin Input Capacitance

I/O Pin Input Capacitance

3.5

IN

I

C

V

O

= 3.3 V or GND

5.0

pF

I/O

Power Dissipation Capacitance per

Enabled

Disabled

Enabled

Disabled

Enabled

Disabled

Enabled

Disabled

14.0

7.0

Transceiver, A−Port Input, B−Port Output

Power Dissipation Capacitance per

Transceiver, B−Port Input, A−Port Output

Power Dissipation Capacitance per

Transceiver, A−Port Input, B−Port Output

Power Dissipation Capacitance per

Transceiver, B−Port Input, A−Port Output

C

PDA

C = 0 pF, f = 10 MHz

pF

L

(Note 7)

20.0

7.0

14.0

7.0

C

PDB

C = 0 pF, f = 10 MHz

L

(Note 7)

20.0

7.0

6. Typical values are at V

= V

= 3.3 V, T = +25°C.

CCA

CCB A

7. C is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:

PD

I

(operating) ≈ C x V x f x N

where I = I

+ I

and N

= total number of outputs switching.

CC

PD

CC

IN

SW

CC

CCA

CCB

SW

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7

NLA16T245

Figure 3. Load Circuit and Voltage Waveforms

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8

NLA16T245

PACKAGE DIMENSIONS

TSSOP−48

CASE 1201

ISSUE B

48X K REF

K

K1

NOTES:

M

S

0.12 (0.005)

T U

V

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL

IN EXCESS OF THE K DIMENSION AT

MAXIMUM MATERIAL CONDITION.

5. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

J

J1

48

25

SECTION N−N

B

−U−

L

N

1

24

6. DIMENSIONS A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

MILLIMETERS

INCHES

A

−V−

DIM

A

B

C

D

F

G

H

J

J1

K

MIN

12.40

6.00

−−−

0.05

0.50

MAX

12.60

6.20

1.10

0.15

0.75

MIN

MAX

0.496

0.244

0.043

0.006

0.030

PIN 1

IDENT.

N

0.488

0.236

−−−

0.002

0.020

F

M

0.25 (0.010)

DETAIL E

0.50 BSC

0.0197 BSC

0.015 −−−

0.37

0.09

0.17

7.95

0

−−−

0.20

0.16

0.27

0.23

8.25

8

0.004

0.007

0.313

0

0.008

0.006

0.011

0.009

0.325

8

D

C

−W−

K1

L

M

0.076 (0.003)

DETAIL E

−T−

SEATING

PLANE

_

H

G

RECOMMENDED

SOLDERING FOOTPRINT*

48X

0.32

48X

1.00

8.45

1

0.50

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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9

NLA16T245

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,

copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC

reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for

surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where

personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and

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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture

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