NLSV1T34DFT2G [ONSEMI]
1-Bit Dual-Supply Non-Inverting Level Translator; 1位双电源非反相电平转换器
| 型号： | NLSV1T34DFT2G |
| 厂家： | 
ONSEMI |
| 描述： | 1-Bit Dual-Supply Non-Inverting Level Translator |
| 文件： | 总9页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NLSV1T34
1-Bit Dual-Supply
Non-Inverting Level
Translator
The NLSV1T34 is a 1−bit configurable dual−supply voltage level
translator. The input A and output B ports are designed to track two
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MARKING
n
n
different power supply rails, V
and V
respectively. Both
CCA
CCB
supply rails are configurable from 0.9 V to 4.5 V allowing universal
low−voltage translation from the input A to the output B port.
DIAGRAMS
n
n
Features
UDFN6
MU SUFFIX
CASE 517AA
M
G
• Wide V
and V
Operating Range: 0.9 V to 4.5 V
CCA
CCB
1
1
• High−Speed w/ Balanced Propagation Delay
• Inputs and Outputs have OVT Protection to 4.5 V
UDFN6
MU SUFFIX
CASE 517AQ
A M
QM
• Non−preferential V
• Power−Off Protection
and V
Sequencing
CCA
CCB
• Power−Off High Impedance Inputs and Outputs
ULLGA6
MX1 SUFFIX
CASE 613AF
• Ultra−Small Packaging: 1.45 mm x 1.0 mm ULLGA6
2.0 mm x 2.1 mm SC−88A
1
1.2 mm x 1.0 mm UDFN6
1.45 mm x 1.0 mm UDFN6
X
M
= Specific Device Code
= Date Code
• These are Pb−Free Devices
5
SC−88A
Typical Applications
(SOT−353/SC−70)
W0 M G
5
DF SUFFIX
CASE 419A
G
• Mobile Phones, PDAs, Other Portable Devices
1
1
Important Information
W0 = Device Code
• ESD Protection for All Pins:
M
G
= Date Code*
= Pb−Free Package
HBM (Human Body Model) > 3000 V
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
V
CCA
V
CCB
B
A
PIN ASSIGNMENT
1
2
3
6 V
1
2
3
5 V
CCB
V
V
CCA
CCB
CCA
Figure 1. Logic Diagram
5
4
A
NC
A
GND
B
4
GND
B
ULLGA6/UDFN6
(Top View)
SC−88A
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
April, 2010 − Rev. 5
NLSV1T34/D
NLSV1T34
PIN ASSIGNMENT
PIN
TRUTH TABLE
FUNCTION
INPUTS
OUTPUTS
V
V
Input Port DC Power Supply
Output Port DC Power Supply
Ground
A
L
B
L
CCA
CCB
GND
A
H
H
Input Port
B
Output Port
MAXIMUM RATINGS
Symbol
Rating
Value
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−20
Condition
Unit
V
V
CCA
, V
CCB
DC Supply Voltage
V
I
DC Input Voltage
A
B
B
V
V
O
DC Output Voltage
(Power Down)
(Active Mode)
V
= V = 0
CCB
V
CCA
V
I
DC Input Diode Current
DC Output Diode Current
V < GND
I
mA
mA
mA
mA
mA
°C
IK
I
−50
V < GND
O
OK
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
50
O
I
, I
100
CCA CCB
I
100
GND
T
−65 to +150
STG
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
, V
Parameter
Min
0.9
Max
4.5
4.5
4.5
Unit
V
V
CCA
Positive DC Supply Voltage
Bus Input Voltage
CCB
V
I
GND
GND
GND
−40
0
V
V
IO
Bus Output Voltage
(Power Down Mode)
(Active Mode)
B
B
V
V
CCB
V
T
A
Operating Temperature Range
Input Transition Rise or Rate
+85
°C
nS
Dt / DV
10
V , from 30% to 70% of V ; V = 3.3 V 0.3 V
I
CC
CC
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2
NLSV1T34
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
Min
Max
Symbol
Parameter
Test Conditions
V
CCA
(V)
V
CCB
(V)
Unit
V
Input HIGH Voltage
0.9 – 4.5
V
3.6 – 4.5
2.7 – 3.6
2.3 – 2.7
1.4 − 2.3
0.9 – 1.4
3.6 – 4.5
2.7 – 3.6
2.3 – 2.7
1.4 − 2.3
0.9 – 1.4
0.9 – 4.5
0.9
2.2
−
IH
2.0
1.6
−
−
−
0.65 * V
CCA
CCA
0.9 * V
−
V
Input LOW Voltage
0.9 – 4.5
V
V
−
−
−
−
−
0.8
IL
0.8
0.7
0.35 * V
CCA
CCA
0.1 * V
V
OH
Output HIGH Voltage
I
I
I
I
= −100 mA; V = V
0.9 – 4.5
0.9
V – 0.2
CCB
−
−
OH
OH
OH
OH
I
IH
= −0.5 mA; V = V
0.75 * V
1.05
1.25
2.0
1.8
2.2
1.7
2.4
2.2
−
I
IH
CCB
= −2 mA; V = V
1.4
1.4
−
I
IH
IH
= −6 mA; V = V
1.65
1.65
2.3
−
I
2.3
−
I
I
= −12 mA; V = V
2.3
2.3
−
OH
OH
I
IH
2.7
2.7
−
= −18 mA; V = V
2.3
2.3
−
I
IH
IH
3.0
3.0
−
I
I
I
I
I
I
= −24 mA; V = V
3.0
3.0
−
OH
OL
OL
OL
OL
OL
I
V
OL
Output LOW Voltage
V
= 100 mA; V = V
0.9 – 4.5
1.1
0.9 – 4.5
1.1
0.2
0.3
I
IL
= 0.5 mA; V = V
−
I
IH
= 2 mA; V = V
1.4
1.4
−
0.35
0.3
0.4
0.4
0.6
0.4
0.55
1.0
2.0
I
IH
IL
= 6 mA; V = V
1.65
1.65
2.3
−
I
= 12 mA; V = V
2.3
−
I
IL
2.7
2.7
−
I
= 18 mA; V = V
2.3
2.3
−
OL
OL
I
IL
3.0
3.0
−
I
= 24 mA; V = V
3.0
3.0
−
I
IL
I
Input Leakage Current
V = V
or GND
or GND;
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 − 4.5
−1.0
mA
mA
I
I
CCA
I
I
Quiescent Supply Current
V = V
−
CCA
I
CCA
= 0, V
I
O
= V
CCA CCB
Quiescent Supply Current
Quiescent Supply Current
Power OFF Leakage Current
V = V
or GND;
0.9 – 4.5
0.9 – 4.5
0
0.9 − 4.5
0.9 – 4.5
0
−
−
−
2.0
4.0
5.0
mA
mA
mA
CCB
I
CCA
I
O
= 0, V
= V
CCA
CCB
I
+ I
V = V
or GND;
= V
CCB
CCA
CCB
I
CCA
CCA
I
O
= 0, V
I
V = 4.5 V
I
OFF
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3
NLSV1T34
TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB
)
−405C to +855C
V
CCB
(V)
4.5
3.3
2.8
1.8
0.9
V
CCA
(V)
Min
Max
2
Min
Max
2
Min
Max
Min
Max
2
Min
Max
< 1.5
< 1.5
< 0.5
< 0.5
< 0.5
Unit
μA
μA
μA
μA
μA
4.5
2
3.3
2.8
1.8
0.9
2
2
2
2
< 2
< 1
< 0.5
< 1
< 1
< 0.5
< 1
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
NOTE: Connect ground before applying supply voltage V
or V
. This device is designed with the feature that the power−up sequence
CCA
CCB
of V
and V
will not damage the IC.
CCA
CCB
AC ELECTRICAL CHARACTERISTICS
−405C to +855C
V
CCB
(V)
4.5
3.3
2.8
1.8
1.2
Min
Max
Min
Max
1.8
1.9
2.1
2.4
2.7
Min
Max
2.0
2.1
2.3
2.5
2.8
Min
Max
2.1
2.3
2.5
2.7
3.0
Min
Max
2.3
2.6
2.8
3.0
3.3
Symbol
Parameter
V
CCA
(V)
Unit
t
t
,
Propagation
Delay,
4.5
1.6
1.7
1.9
2.1
2.4
nS
PLH
PHL
3.3
2.8
1.8
1.2
(Note 1)
A to B
1. Propagation delays defined per Figure 2.
CAPACITANCE
Symbol
Parameter
Test Conditions
= 3.3 V, V = 0 V or V
CCA/B
Typ (Note 2)
Unit
pF
C
I/O
C
PD
I/O Pin Input Capacitance
Power Dissipation Capacitance
V
V
= V
5.0
5.0
CCA
CCB
I
= V
= 3.3 V, V = 0 V or V , f = 10 MHz
CCA
pF
CCA
CCB
I
2. Typical values are at T = +25°C.
A
3. C is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:
PD
I
^ C x V x f where I = I
+ I
CCB
.
CC(operating)
PD
CC
IN
CC
CCA
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4
NLSV1T34
V
CC
Pulse
Generator
DUT
C
R
L
L
Figure 2. AC (Propagation Delay) Test Circuit
Switch
Test
C = 15 pF or equivalent (includes probe and jig capacitance)
L
R = 2 kW or equivalent
L
Z
OUT
of pulse generator = 50 W
V
IH
Input (A )
n
Vm
Vm
0 V
t
t
PHL
PLH
V
OH
Output (B )
n
Vm
Vm
V
OL
Waveform 1 − Propagation Delays
= t = 2.0 ns, 10% to 90%; f = 1 MHz; t = 500 ns
t
R
F
W
Figure 3. AC (Propagation Delay) Test Circuit Waveforms
V
CC
0.9 V – 4.5 V
Symbol
V
V
CCA
V
CCB
/2
/2
mA
mB
V
ORDERING INFORMATION
Device
†
Package
Shipping
NLSV1T34MUTCG
UDFN6
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
(Pb−Free)
NLSV1T34AMUTCG
NLSV1T34AMX1TCG
NLSV1T34DFT2G
UDFN6
(Pb−Free)
ULLGA6
(Pb−Free)
SC−88A
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NLSV1T34
PACKAGE DIMENSIONS
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
G
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
D 5 PL
0.2 (0.008)
B
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
mm
inches
ǒ
Ǔ
1.9
0.0748
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NLSV1T34
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE C
EDGE OF PACKAGE
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
L1
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
E
DETAIL A
REFERENCE
Bottom View
MILLIMETERS
2X
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
(Optional)
A
0.10
C
MOLD CMPD
EXPOSED Cu
TOP VIEW
A3
b
D
E
0.127 REF
2X
0.15
0.25
0.10
C
C
1.20 BSC
1.00 BSC
0.40 BSC
A3
e
L
0.30
0.40
0.15
0.50
(A3)
L1 0.00
L2 0.40
0.10
0.08
A1
DETAIL B
Side View
(Optional)
A
MOUNTING FOOTPRINT*
SEATING
PLANE
10X
C
SIDE VIEW
6X
6X
0.22
0.42
C
A1
5X L
3
1
L2
6X b
0.40
PITCH
6
4
1.07
0.10 C A B
0.05
e
C
DIMENSIONS: MILLIMETERS
NOTE 3
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
NLSV1T34
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ−01
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
REFERENCE
OPTIONAL
E
MILLIMETERS
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
1.45 BSC
TOP VIEW
0.30
0.10
C
D
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
6X
MOUNTING FOOTPRINT
A1
SEATING
PLANE
6X
A2
C
SIDE VIEW
e
0.30
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
0.53
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
6
4
6X b
0.10 C A B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
C
0.05
BOTTOM VIEW
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8
NLSV1T34
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
A
B
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
PIN ONE
E
REFERENCE
MILLIMETERS
DIM MIN
−−−
A1 0.00
MAX
0.40
0.05
0.25
A
0.10
C
TOP VIEW
SIDE VIEW
b
D
E
e
0.15
1.45 BSC
1.00 BSC
0.50 BSC
0.25
0.10
C
L
0.35
0.40
0.05
0.05
C
C
L1 0.30
A
MOUNTING FOOTPRINT
SEATING
PLANE
6X
SOLDERMASK DEFINED*
05.4X9
A1
C
6X
0.30
e
NOTE 4
5X L
3
1
6
1.24
L1
1
0.53
PKG
OUTLINE
0.50
PITCH
4
6X b
DIMENSIONS: MILLIMETERS
0.10 C A B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
C
0.05
BOTTOM VIEW
ON Semiconductor and
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NLSV1T34/D
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