NLV14050BDTG [ONSEMI]
Hex Buffer;
| 型号： | NLV14050BDTG |
| 厂家： | 
ONSEMI |
| 描述： | Hex Buffer |
| 文件： | 总8页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC14049B, MC14050B
Hex Buffer
The MC14049B Hex Inverter/Buffer and MC14050B Noninverting
Hex Buffer are constructed with MOS P−Channel and N−Channel
enhancement mode devices in a single monolithic structure. These
complementary MOS devices find primary use where low power
dissipation and/or high noise immunity is desired. These devices
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provide logic level conversion using only one supply voltage, V
.
DD
The input−signal high level (V ) can exceed the V
supply
IH
DD
voltage for logic level conversions. Two TTL/DTL loads can be driven
when the devices are used as a CMOS−to−TTL/DTL converter
(V = 5.0 V, V ≤ 0.4 V, I ≥ 3.2 mA).
Note that pins 13 and 16 are not connected internally on these
devices; consequently connections to these terminals will not affect
circuit operation.
DD
OL
OL
SOIC−16
D SUFFIX
CASE 751B
SOEIAJ−16
F SUFFIX
CASE 966
TSSOP−16
DT SUFFIX
CASE 948F
PIN ASSIGNMENT
Features
• High Source and Sink Currents
• High−to−Low Level Converter
• Supply Voltage Range = 3.0 V to 18 V
• V can exceed V
V
1
2
3
4
5
6
7
8
16 NC
15 OUT
DD
OUT
A
F
IN
OUT
IN
14 IN
F
A
B
B
IN
DD
13 NC
• Meets JEDEC B Specifications
12 OUT
E
D
• Improved ESD Protection On All Inputs
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
OUT
11 IN
C
C
E
IN
10 OUT
V
9
IN
D
SS
• These Devices are Pb−Free and are RoHS Compliant
MARKING DIAGRAMS
MAXIMUM RATINGS (Voltages Referenced to V
)
SS
16
Symbol
Parameter
Value
Unit
V
16
1
V
DD
DC Supply Voltage Range
−0.5 to +18.0
−0.5 to +18.0
140xxBG
AWLYWW
MC140xxB
ALYWG
V
in
Input Voltage Range (DC or Transient)
V
V
out
Output Voltage Range (DC or Transient) −0.5 to V
+
DD
V
1
0.5
SOIC−16
SOEIAJ−16
I
in
Input Current (DC or Transient) per Pin
Output Current (DC or Transient) per Pin
10
45
mA
mA
mW
16
I
out
14
050B
ALYWG
G
P
D
Power Dissipation, per Package (Note 1)
(Plastic)
(SOIC)
825
740
T
A
Ambient Temperature Range
−55 to +125
−65 to +150
260
°C
°C
°C
1
T
stg
Storage Temperature Range
TSSOP−16
T
L
Lead Temperature (8−Second Soldering)
xx
A
WL, L
YY, Y
= Specific Device Code
= Assembly Location
= Wafer Lot
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: See Figure 3.
= Year
WW, W = Work Week
This device contains protection circuitry to protect the inputs against damage
due to high static voltages or electric fields referenced to the V pin only. Extra
G or G
= Pb−Free Indicator
SS
(Note: Microdot may be in either location)
precautions must be taken to avoid applications of any voltage higher than the
maximum rated voltages to this high−impedance circuit. For proper operation, the
ranges V ≤ V ≤ 18 V and V ≤ V ≤ V are recommended.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
SS
in
SS
out
DD
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either V or V ). Unused outputs must be left open.
SS
DD
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
August, 2014 − Rev. 9
MC14049B/D
MC14049B, MC14050B
LOGIC DIAGRAM
MC14049B
MC14050B
3
5
2
3
5
2
4
4
7
6
7
6
9
10
12
15
9
10
12
15
11
14
11
14
NC = PIN 13, 16
NC = PIN 13, 16
V
SS
V
DD
= PIN 8
= PIN 1
V
SS
V
DD
= PIN 8
= PIN 1
ORDERING INFORMATION
Device
†
Package
Shipping
MC14049BDG
SOIC−16
(Pb−Free)
48 Units / Rail
MC14049BDR2G
NLV14049BDR2G*
MC14049BFELG
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
2500 Units / Tape & Reel
2000 Units / Tape & Reel
SOIC−16
(Pb−Free)
SOEIAJ−16
(Pb−Free)
MC14050BDG
SOIC−16
(Pb−Free)
48 Units / Rail
48 Units / Rail
NLV14050BDG*
SOIC−16
(Pb−Free)
MC14050BDR2G
NLV14050BDR2G*
MC14050BDTG
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
2500 Units / Tape & Reel
96 Units / Rail
SOIC−16
(Pb−Free)
TSSOP−16
(Pb−Free)
NLV14050BDTG*
MC14050BDTR2G
MC14050BFELG
TSSOP−16
(Pb−Free)
96 Units / Rail
TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
2000 Units / Tape & Reel
SOEIAJ−16
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
MC14049B, MC14050B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
)
SS
–55_C
+25_C
Typ
+125_C
V
DD
(Note 2)
Min
Max
Min
Max
Min
Max
Vdc
Characteristic
Symbol
Unit
Output Voltage
“0” Level
“1” Level
“0” Level
V
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
OL
V
in
= V
DD
V
OH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Vdc
V
in
= 0
Input Voltage
(V = 4.5 Vdc)
V
IL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
O
(V = 9.0 Vdc)
O
(V = 13.5 Vdc)
O
V
IH
Vdc
“1” Level
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
(V = 0.5 Vdc)
O
(V = 1.0 Vdc)
O
(V = 1.5 Vdc)
O
Output Drive Current
I
mAdc
mAdc
OH
(V = 2.5 Vdc)
Source
Sink
5.0
10
15
–1.6
–1.6
–4.7
−
−
−
–1.25
–1.30
–3.75
–2.5
–2.6
–10
−
−
−
–1.0
–1.0
–3.0
−
−
−
OH
(V = 9.5 Vdc)
OH
(V = 13.5 Vdc)
OH
I
5.0
10
15
3.75
10
30
−
−
−
3.2
8.0
24
6.0
16
40
−
−
−
2.6
6.6
19
−
−
−
(V = 0.4 Vdc)
OL
OL
(V = 0.5 Vdc)
OL
(V = 1.5 Vdc)
OL
Input Current
Input Capacitance (V = 0)
I
15
−
−
−
0.1
−
−
−
0.00001
10
0.1
20
−
−
1.0
−
mAdc
pF
in
C
in
in
Quiescent Current (Per Package)
I
5.0
10
15
−
−
−
1.0
2.0
4.0
−
−
−
0.002
0.004
0.006
1.0
2.0
4.0
−
−
−
30
60
120
mAdc
DD
Total Supply Current (Notes 3 & 4)
(Dynamic plus Quiescent,
per package)
I
T
5.0
10
15
I = (1.8 mA/kHz) f + I
mAdc
T
DD
DD
DD
I = (3.5 mA/kHz) f + I
T
I = (5.3 mA/kHz) f + I
T
(C = 50 pF on all outputs, all
L
buffers switching
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at +25_C
4. To calculate total supply current at loads other than 50 pF:
I (C ) = I (50 pF) + (C − 50) Vfk
T
L
T
L
Where: IT is in mA (per Package), C in pF, V = (V − V ) in volts, f in kHz is input frequency and k = 0.002.
L
DD
SS
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3
MC14049B, MC14050B
AC SWITCHING CHARACTERISTICS (Note 5) (C = 50 pF, T = + 25_C)
L
A
V
DD
Typ
Vdc
(Note 6)
Characteristic
Symbol
Min
Max
Unit
Output Rise Time
t
ns
TLH
THL
PLH
PHL
t
t
t
= (0.7 ns/pF) C + 65 ns
= (0.25 ns/pF) C + 37.5 ns
= (0.2 ns/pF) C + 30 ns
5.0
10
15
−
−
−
100
50
40
160
80
60
TLH
TLH
TLH
L
L
L
Output Fall Time
t
ns
ns
ns
t
t
t
= (0.2 ns/pF) C + 30 ns
= (0.06 ns/pF) C + 17 ns
= (0.04 ns/pF) C + 13 ns
5.0
10
15
−
−
−
40
20
15
60
40
30
THL
THL
THL
L
L
L
Propagation Delay Time
t
t
t
t
t
= (0.33 ns/pF) C + 63.5 ns
= (0.19 ns/pF) C + 30.5 ns
= (0.06 ns/pF) C + 27 ns
5.0
10
15
−
−
−
80
40
30
140
80
60
PLH
PLH
PLH
L
L
L
Propagation Delay Time
t
t
t
= (0.2 ns/pF) C + 30 ns
5.0
10
15
−
−
−
40
20
15
80
40
30
PHL
PHL
PHL
L
= (0.1 ns/pF) C + 15 ns
L
= (0.05 ns/pF) C + 12.5 ns
L
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labeled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
MC14049B
V
MC14050B
V
MC14049B
V
MC14050B
V
DD
DD
DD
DD
1
1
1
1
I
I
OL
I
OL
I
OH
OH
V
OH
V
OL
V
OL
V
OH
V
SS
8
V
SS
8
V
SS
V
SS
8
8
V
DS
= V - V
OH
V = V
DD OL
DD
0
-ꢀ10
-ꢀ20
-ꢀ30
-ꢀ40
-ꢀ50
160
120
80
40
0
V
= 15 Vdc
= 10 Vdc
GS
V
GS
= 5.0 Vdc
V
GS
V
GS
= 10 Vdc
MAXIMUM CURRENT LEVEL
V
GS
= 15 Vdc
V
GS
= 5.0 Vdc
MAXIMUM CURRENT LEVEL
-ꢀ10
-ꢀ8.0
-ꢀ6.0
-ꢀ4.0
-ꢀ2.0
0
0
2.0
4.0
6.0
8.0
10
V
DS
, DRAIN-TO-SOURCE VOLTAGE (Vdc)
V , DRAIN-TO-SOURCE VOLTAGE (Vdc)
DS
Figure 1. Typical Output Source Characteristics
Figure 2. Typical Output Sink Characteristics
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4
MC14049B, MC14050B
1200
1100
1000
900
825
800
740
700
600
500
400
300
200
100
0
(P) PDIP
(D) SOIC
175 mW (P)
120 mW (D)
25
50
75
100
125
150
175
T , AMBIENT TEMPERATURE (°C)
A
Figure 3. Ambient Temperature Power Derating
20 ns
20 ns
V
DD
INPUT
90%
50%
10%
V
1
DD
V
V
SS
t
t
PLH
PHL
OH
#
90%
50%
10%
OUTPUT
PULSE
MC14049B
GENERATOR
V
OL
V
OH
V
OL
V
in
V
out
t
t
t
TLH
PLH
THL
8
V
SS
C
L
t
t
PHL
PHL
90%
50%
OUTPUT
MC14050B
#ꢀInvert on MC14049B only
10%
t
t
THL
TLH
Figure 4. Switching Time Test Circuit and Waveforms
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5
MC14049B, MC14050B
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−A−
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
16
9
8
−B−
P 8 PL
M
S
B
0.25 (0.010)
1
MILLIMETERS
INCHES
MIN
0.386
DIM MIN
MAX
MAX
0.393
0.157
0.068
0.019
0.049
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
10.00
G
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
F
R X 45
K
_
G
J
1.27 BSC
0.050 BSC
0.19
0.10
0
0.25 0.008
0.25 0.004
0.009
0.009
7
K
M
P
R
C
7
0
_
_
_
_
−T−
SEATING
PLANE
5.80
0.25
6.20 0.229
0.50 0.010
0.244
0.019
J
M
D
16 PL
M
S
S
A
0.25 (0.010)
T B
SOLDERING FOOTPRINT*
8X
6.40
16X
1.12
1
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MC14049B, MC14050B
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
16X KREF
NOTES:
1. DIMENSIONING AND TOLERANCING PER
M
S
S
0.10 (0.004)
T U
V
ANSI Y14.5M, 1982.
S
0.15 (0.006) T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
K
K1
16
9
2X L/2
J1
SECTION N−N
B
−U−
L
J
PIN 1
IDENT.
N
8
0.25 (0.010)
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
S
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
N
−V−
A
B
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
F
C
1.20
−−− 0.047
DETAIL E
D
F
0.15 0.002 0.006
0.75 0.020 0.030
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
−W−
0.18
0.09
0.09
0.19
0.19
0.28 0.007 0.011
C
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.10 (0.004)
H
DETAIL E
SEATING
PLANE
−T−
6.40 BSC
0.252 BSC
D
G
M
0
8
0
8
_
_
_
_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MC14049B, MC14050B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
CASE 966
ISSUE A
NOTES:
ꢁꢂ1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
L
E
16
9
ꢁꢂ2. CONTROLLING DIMENSION: MILLIMETER.
ꢁꢂ3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
Q
1
H
E
M
_
E
ꢁꢂ4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
1
8
L
ꢁꢂ5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DETAIL P
Z
D
VIEW P
e
A
c
MILLIMETERS
INCHES
MIN
---
DIM MIN
MAX
MAX
0.081
0.008
0.020
0.011
0.413
0.215
A
---
0.05
0.35
0.10
9.90
5.10
2.05
A
A
1
0.20 0.002
0.50 0.014
0.20 0.007
1
b
0.13 (0.005)
b
c
0.10 (0.004)
M
D
E
10.50
5.45 0.201
0.390
e
1.27 BSC
0.050 BSC
H
7.40
0.50
1.10
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
E
L
L
E
M
Q
0
10
0.90 0.028
10
_
0.035
0.031
0
_
_
_
0.70
---
1
Z
0.78
---
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