NLX3G16_16 [ONSEMI]
Triple Non-Inverting Buffer;
| 型号： | NLX3G16_16 |
| 厂家： | 
ONSEMI |
| 描述： | Triple Non-Inverting Buffer |
| 文件： | 总8页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NLX3G16
Triple Non-Inverting Buffer
The NLX3G16 MiniGatet is an advanced high−speed CMOS
triple non−inverting buffer in ultra−small footprint.
The NLX3G16 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
www.onsemi.com
MARKING
Features
• High Speed: t = 1.8 ns (Typ) @ V = 5.0 V
PD
CC
• Designed for 1.65 V to 5.5 V V Operation
CC
DIAGRAMS
• Low Power Dissipation: I = 1 mA (Max) at T = 25°C
CC
A
• 24 mA Balanced Output Source and Sink Capability
• Balanced Propagation Delays
UDFN8
1.45 x 1.0
X M
CASE 517BZ
1
• Overvoltage Tolerant (OVT) Input and Output Pins
• Ultra−Small Packages
UDFN8
1.6 x 1.0
CASE 517BY
• These are Pb−Free Devices
X M
X M
1
1
2
3
4
8
7
6
5
IN A1
OUT Y3
IN A2
V
CC
UDFN8
1.95 x 1.0
CASE 517CA
1
OUT Y1
IN A3
1
1
1
IN A1
IN A2
IN A3
OUT Y1
OUT Y2
OUT Y3
J or AD = Specific Device Code
M
G
= Date Code
= Pb−Free Package
GND
OUT Y2
Figure 1. Pinout (Top View)
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
PIN ASSIGNMENT
IN A1
FUNCTION TABLE
1
2
3
4
5
6
7
8
A
Y
OUT Y3
L
L
H
H
IN A2
GND
OUT Y2
IN A3
OUT Y1
V
CC
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
July, 2016 − Rev. 2
NLX3G16/D
NLX3G16
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
−0.5 to +7.0
V
IN
DC Input Voltage
−0.5 to +7.0
V
V
OUT
DC Output Voltage
−0.5 to +7.0
V
I
DC Input Diode Current
V
< GND
< GND
OUT
−50
mA
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
V
−50
OK
I
50
O
I
100
CC
I
100
GND
T
−65 to +150
STG
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
260
°C
L
T
150
Level 1
°C
J
MSL
F
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
500
R
I
Latchup Performance Above V and Below GND at 125 °C (Note 5)
mA
LATCHUP
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/UESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
1.65
0
Max
5.5
Unit
V
V
CC
Positive DC Supply Voltage
Digital Input Voltage
V
IN
5.5
V
V
OUT
Output Voltage
0
5.5
V
T
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
−55
+125
°C
ns/V
A
Dt/DV
V
= 1.8 V 0.18
0
0
0
0
20
20
10
5
CC
V
= 2.5 V 0.2 V
= 3.3 V 0.3 V
= 5.0 V 0.5 V
CC
CC
CC
V
V
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2
NLX3G16
DC ELECTRICAL CHARACTERISTICS
T
A
= −555C to
+1255C
T
A
= 25 5C
Typ
T
= +855C
A
V
(V)
CC
Min
Max
Min
Max
Min
Max
Symbol
Parameter
Conditions
Unit
V
IH
Low−Level
Input
1.65 to
5.5
0.70 x
0.70 x
V
CC
V
V
CC
Voltage
V
Low−Level
Input
Voltage
1.65 to
5.5
0.30 x
0.30 x
0.30 x
V
V
IL
V
CC
V
CC
V
CC
V
OH
High−
Level
V
= V or V
= −100 mA
1.65 to .5
V
0.1
−
V
CC
V
0.1
−
V
0.1
−
IN
IH
IL
CC
CC
CC
I
OH
Output
Voltage
V
= V or V
IN
OH
OH
OH
OH
OH
OH
IH
IL
I
I
I
I
I
I
= −4 mA
= −8 mA
= −12 mA
= −16 mA
= −24 mA
= −32 mA
1.65
2.3
2.7
3.0
3.0
4.5
1.4
1.9
2.2
2.4
2.3
3.8
1.50
2.1
2.4
2.7
2.5
4.0
1.4
1.9
2.2
2.4
2.3
3.8
1.4
1.9
2.2
2.4
2.3
3.8
V
OL
Low−Level
Output
V
= V or V
= 100 mA
1.65 − 5.5
0.1
0.1
0.1
V
IN
IH
IL
I
OL
Voltage
V
= V or V
= 4 mA
= 8 mA
= 12 mA
= 16 mA
= 24 mA
= 32 mA
IN
OH
OH
OH
OH
OH
OH
IH
IL
I
I
I
I
I
I
1.65
2.3
2.7
3.0
3.0
4.5
0.2
0.2
0.22
0.28
0.38
0.42
0.24
0.3
0.4
0.4
0.55
0.24
0.3
0.4
0.4
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.55
0.55
I
Input
Leakage
Current
0 v V v 5.5 V
0 to 5.5
0.1
1.0
1.0
10
1.0
10
mA
mA
IN
IN
I
Power−Off
Output
V
IN
or V
=
0
OFF
OUT
5.5 V
Leakage
Current
I
Quiescent
Supply
0 v V v V
5.5
1.0
10
10
mA
CC
IN
CC
Current
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3
NLX3G16
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 nS)
r
f
T
A
= −555C to
+1255C
T
A
= 25 5C
Typ
T
= +855C
A
V
(V)
Test
Condition
CC
Min
Max
Min
Max
Min
Max
Symbol
Parameter
Unit
t
t
,
Propagation
Delay Input A to
Output
1.65−1.95
1.8
1.0
0.8
1.2
0.5
0.8
6.0
7.9
1.8
8.8
1.8
12
ns
R = 1 MW,
C = 15 pF
L
PLH
L
PHL
2.3−2.7
3.0−3.6
R = 1 MW,
3.0
2.3
3.0
1.8
2.4
7.0
5.2
3.6
4.6
2.9
3.8
1.0
0.8
1.2
0.5
0.8
5.8
4.0
5.1
3.2
4.2
1.0
0.8
1.2
0.5
0.8
9.1
6.5
7.6
5.5
6.4
L
C = 15 pF
L
R = 1 MW,
L
C = 15 pF
L
R = 500 W,
L
C = 50 pF
L
4.5−5.5
R = 1 MW,
L
C = 15 pF
L
R = 500 W,
L
C = 50 pF
L
C
Input
Capacitance
5.5
V
V
= 0 V or V
pF
pF
IN
IN
CC
C
Power
3.3
5.5
10 MHz
9
11
PD
Dissipation
Capacitance
(Note 6)
= 0 V or V
IN
CC
6. C is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
PD
load. Average operating current can be obtained by the equation I
= C • V • f + I . C is used to determine the no−load
CC(OPR)
PD
CC
in
CC
PD
2
dynamic power consumption: P = C • V
• f + I • V
D
PD
CC
in
CC
CC.
V
CC
A
50%
GND
t
t
PHL
PLH
Y
50% V
CC
PROPAGATION DELAYS
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns
F
W
Figure 3. Switching Waveforms
V
CC
PULSE
GENERATOR
DUT
R
T
C
R
L
L
R = Z
of pulse generator (typically 50 W)
T
OUT
Figure 4. Test Circuit
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4
NLX3G16
ORDERING INFORMATION
Device
†
Package
Shipping
NLX3G16DMUTCG
UDFN8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
NLX3G16EMUTCG
NLX3G16FMUTCG
UDFN8, 1.6 x 1.0, 0.4P
(Pb−Free)
UDFN8, 1.45 x 1.0, 0.35P
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NLX3G16
PACKAGE DIMENSIONS
UDFN8 1.6x1.0, 0.4P
CASE 517BY
ISSUE O
NOTES:
A
B
E
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
REFERENCE
2X
0.10
C
MILLIMETERS
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.13 REF
2X
0.10
C
TOP VIEW
0.15
0.25
A3
0.05
C
C
D
E
e
L
1.60 BSC
1.00 BSC
0.40 BSC
A
0.25
0.30
0.35
0.40
L1
0.05
A1
SEATING
C
RECOMMENDED
SIDE VIEW
PLANE
SOLDERING FOOTPRINT*
7X
8X
e/2
0.49
0.26
e
7X L
4
5
1
8
L1
1.24
1
8X b
0.53
0.40
PITCH
PKG
OUTLINE
M
0.10
0.05
C
C
A B
DIMENSIONS: MILLIMETERS
M
NOTE 3
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
NLX3G16
PACKAGE DIMENSIONS
UDFN8 1.45x1.0, 0.35P
CASE 517BZ
ISSUE O
NOTES:
A
B
E
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
REFERENCE
2X
0.10
C
MILLIMETERS
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.13 REF
2X
0.10
C
TOP VIEW
0.15
0.25
A3
0.05
C
C
D
E
e
L
1.45 BSC
1.00 BSC
0.35 BSC
A
0.25
0.30
0.35
0.40
L1
0.05
A1
SEATING
C
RECOMMENDED
SIDE VIEW
PLANE
SOLDERING FOOTPRINT*
7X
8X
0.48
0.22
e/2
e
7X L
4
1
8
L1
1.18
1
5
0.53
8X b
0.35
PITCH
PKG
M
0.10
0.05
C
C
A B
OUTLINE
DIMENSIONS: MILLIMETERS
M
NOTE 3
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
NLX3G16
PACKAGE DIMENSIONS
UDFN8 1.95x1.0, 0.5P
CASE 517CA
ISSUE O
NOTES:
A
B
E
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
REFERENCE
2X
0.10
C
MILLIMETERS
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.13 REF
2X
0.10
C
TOP VIEW
0.15
0.25
A3
0.05
C
C
D
E
e
L
1.95 BSC
1.00 BSC
0.50 BSC
A
0.25
0.30
0.35
0.40
L1
0.05
A1
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
C
SIDE VIEW
7X
0.49
8X
0.30
e/2
e
4
7X L
1
L1
1.24
8
5
1
8X b
0.54
0.50
PITCH
PKG
OUTLINE
M
M
0.10
0.05
C
C
A B
DIMENSIONS: MILLIMETERS
NOTE 3
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NLX3G16/D
相关型号：
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3G SERIES, TRIPLE 1-INPUT NON-INVERT GATE, PDSO8, 1.95 X 1 MM, 0.50 MM PITCH, LEAD FREE, UDFN-8
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NLX3G17EMUTCG
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