NRTS6100TFSTWG [ONSEMI]

NRTS6100TFS: 6 A, 100 V High Performance Trench Schottky Rectifier in u8-FL package;
NRTS6100TFSTWG
型号: NRTS6100TFSTWG
厂家: ONSEMI    ONSEMI
描述:

NRTS6100TFS: 6 A, 100 V High Performance Trench Schottky Rectifier in u8-FL package

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To learn more about onsemi™, please visit our website at  
www.onsemi.com  
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application  
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Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.  
Schottky Barrier Rectifier,  
Trench-based,  
High Performance  
NRTS6100TFS  
This Trench Schottky rectifier is high performance device in m8FL  
package. The lower forward voltage, less leakage current, and small  
junction capacitance are suitable to high switching frequency high  
density DC to DC conversion application. Offering higher avalanche  
energy capability for Oring or reverse protection application. The  
m8FL package provides an excellent thermal performance, less land  
area of board space, and low profile.  
www.onsemi.com  
TRENCH SCHOTTKY  
RECTIFIER 6.0 AMPERE  
100 VOLTS  
Features  
Lower Forward Voltage Drop  
Less Leakage Current in High Temperature  
Small Junction Capacitance for High Switching Frequency  
Higher Avalanche Energy Capability  
175°C Operating Junction Temperature  
Good Alternative Solution of SMA and SMB Package  
Small Footprint Land Area: 12.5 mm  
Low Profile Maximum Height of 1.1 mm  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
1, 2, 3  
Anode  
5, 6, 7, 8  
Cathode  
1
WDFN8  
(m8FL)  
2
CASE 511AB  
FLAT LEAD  
MARKING DIAGRAM  
Mechanical Characteristics:  
Case: Molded Epoxy  
1
A
A
A
C
C
C
C
T610  
AYWWG  
G
Epoxy Meets UL 94 V0 @ 0.125 in  
Weight: 95 mg (Approximately)  
NC  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Maximum for 10 Seconds  
MSL 1  
T610  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
Applications  
High Switching Frequency DC/DC Converter  
nd  
2 Rectifier  
Freewheeling Diode used with Inductive Load  
Oring / Reverse Protection  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NRTS6100TFSTAG  
WDFN8 1500/Tape & Reel  
(PbFree) Pin1 Upper Left  
NRTS6100TFSTWG WDFN8 5000/Tape & Reel  
(PbFree) Pin1 Upper Left  
NRTS6100TFSTBG  
NRTS6100TFSTXG  
WDFN8 1500/Tape & Reel  
(PbFree) Pin1 Upper Right  
WDFN8 5000/Tape & Reel  
(PbFree) Pin1 Upper Right  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
January, 2021 Rev. 1  
NRTS6100TFS/D  
NRTS6100TFS  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
100  
V
RRM  
RWM  
R
V
V
Continuous Forward Current (T = 167°C, DC)  
I
6
12  
A
A
A
C
F(DC)  
Peak Repetitive Forward Current (T = 165°C, Square Wave, Duty = 0.5)  
I
FRM  
C
NonRepetitive Peak Surge Current  
Sinusoidal Halfwave, 8.3 ms  
Square wave, 1 ms  
I
150  
FSM  
300  
Square wave, 100 ms  
500  
NonRepetitive Avalanche Energy (T = 25°C)  
E
100  
mJ  
°C  
°C  
J
AS  
Storage Temperature Range  
T
stg  
65 to +175  
55 to +175  
3B  
Operating Junction Temperature Range (Note 1)  
ESD Rating (Human Body Model)  
ESD Rating (Machine Model)  
T
J
M4  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. The heat generated must be less than the thermal conductivity from JunctiontoAmbient dP /dT < 1/R  
q
D
J
JA  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
70  
Unit  
°C/W  
°C/W  
°C/W  
°C/W  
Thermal Resistance, JunctiontoAmbient (Note 2)  
R
q
JA  
Thermal Resistance, JunctiontoCase Bottom (Note 2)  
Thermal Characterization, JunctiontoCase Top (Note 2)  
Thermal Characterization, JunctiontoLead of Cathode (Note 2)  
R
2.4  
4.3  
2.5  
q
JCB  
y
JCT  
JLC  
y
2
2. Assume 600 mm , 1 oz. copper bond pad on a FR4 board.  
ELECTRICAL CHARACTERISTICS  
Characteristic  
Symbol  
Typ  
Max  
Unit  
Instantaneous Forward Voltage  
V
F
V
(I = 3 A, T = 25°C)  
0.52  
0.47  
0.62  
0.56  
0.68  
0.62  
F
J
(I = 3 A, T = 125°C)  
F
J
(I = 6 A, T = 25°C)  
F
J
(I = 6 A, T = 125°C)  
F
J
Instantaneous Reverse Current  
I
R
(V = Rated DC Voltage, T = 25°C)  
5.2  
3.2  
50  
15  
mA  
mA  
R
J
(V = Rated DC Voltage, T = 125°C)  
R
J
Junction Capacitance  
C
pF  
J
(V = 1 V, T = 25°C, f = 1 MHz)  
782  
R
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.  
www.onsemi.com  
2
 
NRTS6100TFS  
TYPICAL CHARACTERISTICS  
30  
27  
24  
21  
20  
18  
T = 175°C  
T = 175°C  
J
J
R
= 70°C/W  
R
= 2.4°C/W  
q
JA  
q
JCB  
Square Wave  
16  
14  
12  
10  
8
D = 0.2  
D = 0.3  
Square Wave (Duty = 0.5)  
DC  
18  
15  
12  
9
D = 0.5  
DC  
6
4
2
0
6
3
0
25 40  
55 70  
85 100 115 130 145 160 175  
25 40 55 70  
85 100 115 130 145 160 175  
T , CASE TEMPERATURE (°C)  
C
T , AMBIENT TEMPERATURE (°C)  
A
Figure 1. Forward Current Derating of Case  
Temperature  
Figure 2. Forward Current Derating of Ambient  
Temperature  
100  
10  
100  
10  
T = 175°C  
A
T = 150°C  
A
T = 125°C  
A
T = 85°C  
A
T = 25°C  
A
1
1
T = 25°C  
A
T = 125°C  
A
T = 20°C  
A
T = 40°C  
T = 40°C  
A
A
0.1  
0.1  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
V , INSTANTANEOUS FORWARD VOLTAGE (V)  
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)  
F
Figure 3. Typical Forward Characteristics  
Figure 4. Maximum Forward Characteristics  
1.E+00  
1.E+00  
T = 150°C  
A
1.E01  
1.E02  
1.E01  
1.E02  
T = 175°C  
A
T = 125°C  
A
1.E03  
1.E04  
1.E05  
1.E06  
1.E07  
1.E03  
1.E04  
1.E05  
1.E06  
1.E07  
T = 125°C  
A
T = 85°C  
A
T = 25°C  
A
T = 25°C  
A
T = 40°C  
A
T = 20°C  
A
1.E08  
1.E09  
1.E10  
1.E11  
1.E08  
1.E09  
1.E10  
1.E11  
T = 40°C  
A
0
10 20 30 40 50 60 70  
80 90 100  
0
10 20 30 40 50 60 70 80 90 100  
V , INSTANTANEOUS REVERSE VOLTAGE (V)  
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)  
R
Figure 5. Typical Reverse Characteristics  
Figure 6. Maximum Reverse Characteristics  
www.onsemi.com  
3
NRTS6100TFS  
TYPICAL CHARACTERISTICS  
10000  
1000  
5.0  
T = 175°C  
J
T = 25°C  
J
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
Square Wave  
D = 0.5  
DC  
D = 0.3  
D = 0.2  
100  
10  
1.5  
1.0  
0.5  
0
0.1  
1
10  
100  
0
1
2
3
4
5
6
V , REVERSE VOLTAGE (V)  
R
I , AVERAGE FORWARD CURRENT (A)  
F(AV)  
Figure 7. Typical Junction Capacitance  
Figure 8. Average Forward Power Dissipation  
100  
10  
1
50% Duty Cycle  
20%  
10%  
5%  
2%  
1%  
0.1  
2
Single Pulse  
(Assume 600 mm , 1 oz. copper bond pad on a FR4 board)  
0.01  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 9. Typical Thermal Characteristics, JunctiontoAmbient  
www.onsemi.com  
4
NRTS6100TFS  
PACKAGE DIMENSIONS  
WDFN8 3.3x3.3, 0.65P  
CASE 511AB  
ISSUE D  
2X  
NOTES:  
0.20  
C
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH  
PROTRUSIONS OR GATE BURRS.  
D
A
B
E
2X  
D1  
MILLIMETERS  
INCHES  
NOM  
0.030  
−−−  
0.012  
0.20  
C
8
1
7
6
5
4
DIM  
A
A1  
b
MIN  
0.70  
0.00  
0.23  
0.15  
NOM  
0.75  
−−−  
0.30  
0.20  
MAX  
MIN  
MAX  
0.031  
0.002  
0.016  
0.010  
0.80  
0.05  
0.40  
0.25  
0.028  
0.000  
0.009  
0.006  
4X  
q
E1  
0.008  
c
0.130 BSC  
0.120  
0.083  
0.130 BSC  
0.120  
0.063  
0.012  
0.026 BSC  
0.016  
0.032  
0.017  
D
3.30 BSC  
3.05  
2.11  
3.30 BSC  
3.05  
1.60  
0.30  
0.65 BSC  
0.41  
0.80  
0.43  
0.13  
1.50  
−−−  
D1  
D2  
E
E1  
E2  
E3  
e
G
K
L
L1  
M
2.95  
1.98  
3.15  
2.24  
0.116  
0.078  
0.124  
0.088  
c
2
3
A1  
TOP VIEW  
2.95  
1.47  
0.23  
3.15  
1.73  
0.40  
0.116  
0.058  
0.009  
0.124  
0.068  
0.016  
0.10  
0.10  
C
C
A
C
6X  
e
0.30  
0.65  
0.30  
0.06  
1.40  
0
0.51  
0.95  
0.56  
0.20  
1.60  
0.012  
0.026  
0.012  
0.002  
0.055  
0
0.020  
0.037  
0.022  
0.008  
0.063  
SEATING  
PLANE  
0.005  
0.059  
−−−  
DETAIL A  
SIDE VIEW  
DETAIL A  
q
12  
12  
_
_
_
_
8X b  
0.10  
0.05  
C
C
A
B
SOLDERING FOOTPRINT*  
8X  
e/2  
0.42  
0.65  
4X  
L
4X  
0.66  
PITCH  
1
8
4
5
PACKAGE  
OUTLINE  
K
E2  
M
E3  
3.60  
L1  
D2  
BOTTOM VIEW  
G
2.30  
0.57  
0.47  
0.75  
2.37  
3.46  
DIMENSION: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
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