NRVUS2MA [ONSEMI]

Super Fast Surface Mount Rectifiers;
NRVUS2MA
型号: NRVUS2MA
厂家: ONSEMI    ONSEMI
描述:

Super Fast Surface Mount Rectifiers

文件: 总5页 (文件大小:246K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Super Fast Surface Mount  
Rectifiers  
US2AA-US2MAꢀ  
Features  
Glass Passivated Chip Junction  
High Surge Capacity  
Low Forward Voltage Drop  
www.onsemi.com  
Fast Switching with Reverse Recovery Time: 5075 ns Maximum  
UL Flammability 94 V 0 Classification  
MSL 1 per JSTD020  
1
2
Cathode  
Anode  
RoHS Compliant / Green Molding Compound  
NRV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable*  
1
2
Table 1. ORDERING INFORMATION  
Packing  
SMA/DO214AC  
COLOR BAND DENOTES CATHODE  
Method  
Part Number  
Top Mark  
Package  
US2AA,  
NRVUS2AA*  
US2AA  
DO214AC (SMA)  
Tape and Reel  
MARKING DIAGRAM  
US2BA,  
US2BA  
US2DA  
US2FA  
US2GA  
US2JA  
US2KA  
US2MA  
DO214AC (SMA)  
DO214AC (SMA)  
DO214AC (SMA)  
DO214AC (SMA)  
DO214AC (SMA)  
DO214AC (SMA)  
DO214AC (SMA)  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
NRVUS2BA*  
US2DA,  
NRVUS2DA*  
$Y&Z&3  
US2XA  
US2FA,  
NRVUS2FA*  
US2GA,  
NRVUS2GA*  
$Y  
&Z  
&3  
US2XA  
X
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Specific Device Code  
= A/B/D/F/G/J/K/M  
US2JA,  
NRVUS2JA*  
US2KA,  
NRVUS2KA*  
US2MA,  
NRVUS2MA*  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
February, 2021 Rev. 4  
US2AA/D  
US2AAUS2MA  
Table 2. ABSOLUTE MAXIMUM RATINGS  
US2  
AA  
US2  
BA  
US2  
DA  
US2  
FA  
US2  
GA  
US2  
JA  
US2  
KA  
US2  
MA  
Symbol  
Parameter  
Repetitive Peak Reverse Voltage  
RMS Reverse Voltage  
Unit  
V
V
V
50  
35  
50  
100  
70  
200  
140  
200  
300  
210  
300  
400  
280  
400  
600  
420  
600  
800  
560  
800  
1000  
700  
RRM  
V
RMS  
V
DC  
DC Blocking Voltage  
100  
1000  
V
I
Average Forward Rectified Current  
1.5  
50  
A
F(AV)  
I
Peak Forward Surge Current,  
8.3 ms Single HalfSine Wave,  
Superimposed on Rated Load  
A
FSM  
T
Operating Junction Temperature Range  
Storage Temperature Range  
55 to +150  
55 to +150  
°C  
°C  
J
T
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
Table 3. THERMAL CHARACTERISTICS (NOTE 1) (Values are at T = 25°C unless otherwise noted)  
A
Symbol  
Parameter  
Value  
189  
31  
Unit  
°C/W  
°C/W  
R
Typical Thermal Resistance, JunctiontoAmbient  
q
JA  
Y
JL  
Typical Thermal Characteristics, JunctiontoLead (with Reference to Cathode Pin)  
1. Device mounted at minimum pad.  
Table 4. ELECTRICAL CHARACTERISTICS (Values are at T = 25°C unless otherwise noted)  
A
Value  
US2 US2 US2 US2 US2 US2 US2  
US2  
MA  
AA  
BA  
DA  
FA  
GA  
JA  
KA  
Symbol  
Parameter  
Unit  
V
F
Maximum Instantaneous Forward Voltage (Note2)  
1.0  
1.3  
1.7  
V
at Rated I  
F(AV)  
I
R
Maximum Re-  
verse Current  
TJ = 25°C  
5
mA  
TJ = 125°C  
100  
at Rated V  
R
t
Maximum Reverse Recovery Time (Note 3)  
Typical Junction Capacitance (Note 4)  
50  
50  
75  
30  
ns  
rr  
C
pF  
J
2. Pulse test with PW = 300 ms, 1% duty cycle  
3. Reverse recovery test conditions: I = 0.5 A, I = 1.0 A, I = 0.25 A  
F
R
RR  
4. Measured at 1 Mhz and applied reverse voltage of 4.0 V D.C.  
www.onsemi.com  
2
US2AAUS2MA  
TYPICAL PERFORMANCE CHARACTERISTICS  
TJ=125  
RESISTIVE OR  
INDUCTIVE LOAD  
TJ=25  
LEAD TEMPERATURE (oC)  
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)  
Figure 1. Forward Current Derating Curve  
Figure 2. Typical Reverse Characteristics  
8.3ms Single Half Sine Wave  
US2AAUS2FA  
US2GA  
US2JAUS2MA  
NUMBER OF CYCLES AT 60 Hz  
FORWARD VOLTAGE (V)  
Figure 3. Maximum NonRepetitive Forward  
Figure 4. Typical Forward Characteristics  
Surge Current  
f=1.0MHz  
Vslg=50mVpp  
US2AAUS2GA  
US2JAUS2MA  
REVERSE VOLTAGE (V)  
Figure 5. Typical Forward Characteristics  
Figure 6. Typical Forward Characteristics  
www.onsemi.com  
3
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SMA  
CASE 403AE  
ISSUE O  
DATE 31 AUG 2016  
5.60  
4.80  
M
B
B
0.13  
B
C
B
A
2.65  
2.95  
2.50  
1.65  
1.20  
1.75  
4.30  
4.75  
4.00  
B
A
LAND PATTERN RECOMMENDATION  
TOP VIEW  
2.50 MAX  
A
2.20  
1.90  
NOTES:  
A. EXCEPT WHERE NOTED, CONFORMS  
TO JEDEC DO214 VARIATION AC.  
0.30  
0.05  
B
DOES NOT COMPLY JEDEC STANDARD  
VALUE.  
0.203  
0.050  
B
C
C. ALL DIMENSIONS ARE IN MILLIMETERS.  
D. DIMENSIONS ARE EXCLUSIVE OF  
BURRS, MOLD FLASH AND TIE BAR  
PROTRUSIONS.  
E. DIMENSIONS AND TOLERANCE AS  
PER ASME Y14.52009.  
E. LAND PATTERN STD. DIOM5025X231M  
2.05  
1.95  
M
0.13  
C
B
A
SIDE VIEW  
8 °  
0 °  
R0.15 4X  
GAGE PLANE  
0.45  
0.41  
0.15  
1.52  
0.75  
8 °  
0 °  
DETAIL A  
SCALE 20 : 1  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13440G  
SMA  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
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literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
Email Requests to: orderlit@onsemi.com  
TECHNICAL SUPPORT  
North American Technical Support:  
Voice Mail: 1 8002829855 Toll Free USA/Canada  
Phone: 011 421 33 790 2910  
Europe, Middle East and Africa Technical Support:  
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For additional information, please contact your local Sales Representative  
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www.onsemi.com  

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