NSVMMBT5401M3T5G [ONSEMI]

150 V,60 mA,低饱和压,PNP 晶体管,SOT-723;
NSVMMBT5401M3T5G
型号: NSVMMBT5401M3T5G
厂家: ONSEMI    ONSEMI
描述:

150 V,60 mA,低饱和压,PNP 晶体管,SOT-723

晶体管
文件: 总7页 (文件大小:218K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MMBT5401M3  
High Voltage Transistor  
PNP Silicon  
The MMBT5401M3 device is a spinoff of our popular SOT23  
threeleaded device. It is designed for general purpose amplifier  
applications and is housed in the SOT723 surface mount package.  
This device is ideal for lowpower surface mount applications where  
board space is at a premium.  
www.onsemi.com  
Features  
SOT723  
CASE 631AA  
NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable  
COLLECTOR  
3
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
1
BASE  
MAXIMUM RATINGS  
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Value  
150  
160  
5.0  
60  
Unit  
Vdc  
2
V
CEO  
V
CBO  
V
EBO  
EMITTER  
Vdc  
Vdc  
MARKING DIAGRAM  
Collector Current Continuous  
I
C
mAdc  
Stresses exceeding those listed in the Maximum Ratings table may damage  
the device. If any of these limits are exceeded, device functionality should not  
be assumed, damage may occur and reliability may be affected.  
RJ M  
1
THERMAL CHARACTERISTICS  
RJ  
M
= Specific Device Code  
= Date Code  
Characteristic  
Symbol  
Max  
Unit  
Total Device Dissipation  
P
130  
mW  
D
FR5 Board (Note 1)  
T = 25°C  
A
Derate Above 25°C  
1.0  
mW/°C  
°C/W  
ORDERING INFORMATION  
Thermal Resistance,  
JunctiontoAmbient (Note 1)  
R
470  
q
JA  
Device  
Shipping  
Package  
MMBT5401M3T5G  
8000 / Tape &  
Reel  
SOT723  
(PbFree)  
Junction and Storage Temperature  
T , T  
55 to +150  
°C  
J
stg  
2
1. FR5 @ 100 mm , 1.0 oz. copper traces, still air.  
NSVMMBT5401M3T5G  
8000 / Tape &  
Reel  
SOT723  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
June, 2019 Rev. 1  
MMBT5401M3/D  
 
MMBT5401M3  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
CollectorEmitter Breakdown Voltage  
(I = 1.0 mA, I = 0)  
V
V
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
150  
160  
5.0  
C
B
CollectorBase Breakdown Voltage  
(I = 100 mA, I = 0)  
V
V
C
E
EmitterBase Breakdown Voltage  
(I = 10 mA, I = 0)  
E
C
CollectorBase Cutoff Current  
(V = 120 V, I = 0)  
I
CBO  
1.6  
0.20  
100  
100  
nA  
nA  
CB  
E
Emitter Cutoff Current  
(V = 5 V)  
BE  
I
EBO  
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
(I = 1.0 mA, V = 5.0 V)  
50  
60  
20  
80  
90  
40  
240  
C
CE  
(I = 10 mA, V = 5.0 V)  
C
CE  
(I = 50 mA, V = 5.0 V)  
C
CE  
CollectorEmitter Saturation Voltage  
(I = 10 mA, I = 1.0 mA)  
V
V
V
CE(sat)  
0.09  
0.15  
0.25  
0.60  
C
B
(I = 50 mA, I = 5.0 mA)  
C
B
BaseEmitter Saturation Voltage  
(I = 10 mA, I = 1.0 mA)  
V
BE(sat)  
0.76  
0.92  
1.0  
1.0  
C
B
(I = 50 mA, I = 5.0 mA)  
C
B
SMALLSIGNAL CHARACTERISTICS  
CurrentGain — Bandwidth Product  
f
MHz  
pF  
pF  
T
(I = 10 mA, V = 5.0 V, f = 100 MHz)  
100  
180  
12.5  
1.5  
300  
15  
C
CE  
Input Capacitance  
C
ibo  
(V = 3 V, I = 0, f = 1.0 MHz)  
EB  
C
Output Capacitance  
(V = 10 V, I = 0, f = 1.0 MHz)  
C
obo  
6.0  
200  
8.0  
CB  
E
Small Signal Current Gain  
h
fe  
(I = 1.0 mA, V = 10 V, f = 1.0 kHz)  
40  
C
CE  
Noise Figure  
NF  
dB  
(I = 200 mA, V = 5.0 V, R = 10 W, f = 1.0 kHz)  
C
CE  
S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
MMBT5401M3  
TYPICAL CHARACTERISTICS  
180  
160  
140  
120  
100  
80  
180  
V
CE  
= 2 V  
V
CE  
= 5 V  
+150°C  
+150°C  
160  
140  
120  
100  
80  
+125°C  
+125°C  
+85°C  
+85°C  
+25°C  
+25°C  
55°C  
60  
60  
55°C  
40  
40  
20  
20  
0
0
0.0001  
0.001  
0.01  
0.1  
0.0001  
0.001  
0.01  
0.1  
I , COLLECTOR CURRENT (A)  
C
I , COLLECTOR CURRENT (A)  
C
Figure 1. DC Current Gain  
Figure 2. DC Current Gain  
2
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
40 mA  
I /I = 10  
C
B
50 mA  
60 mA  
30 mA  
20 mA  
10 mA  
+150°C  
I
C
= 1.0 mA  
0.2  
+125°C  
55°C  
+85°C  
+25°C  
0.2  
0
0.02  
0.0001  
0.005  
0.05  
0.5  
5
50  
0.001  
0.01  
0.1  
I , BASE CURRENT (mA)  
B
I , COLLECTOR CURRENT (A)  
C
Figure 3. Collector Saturation Region  
Figure 4. CollectorEmitter Saturation Region  
1
1
+150°C  
55°C  
I /I = 20  
I /I = 50  
C B  
C
B
+150°C  
+25°C  
+125°C  
+125°C  
0.1  
0.1  
+25°C  
+85°C  
55°C  
+85°C  
0.01  
0.0001  
0.01  
0.0001  
0.001  
0.01  
0.1  
0.001  
0.01  
0.1  
I , COLLECTOR CURRENT (A)  
C
I , COLLECTOR CURRENT (A)  
C
Figure 5. CollectorEmitter Saturation Region  
Figure 6. CollectorEmitter Saturation Region  
www.onsemi.com  
3
MMBT5401M3  
1.0  
0.8  
0.6  
0.4  
1.0  
55°C  
55°C  
0.8  
0.6  
0.4  
0.2  
+25°C  
+85°C  
+25°C  
+85°C  
+150°C  
+150°C  
+125°C  
+125°C  
0.2  
0
I /I = 20  
C
I /I = 10  
C
B
B
0
0.0001  
0.001  
0.01  
0.1  
0.0001  
0.001  
0.01  
0.1  
I , COLLECTOR CURRENT (A)  
C
I , COLLECTOR CURRENT (A)  
C
Figure 7. BaseEmitter Saturation Voltage  
Figure 8. BaseEmitter Saturation Voltage  
1.0  
25  
20  
15  
10  
5
T = 25°C  
A
55°C  
f = 1 MHz  
0.8  
0.6  
0.4  
0.2  
+25°C  
+85°C  
+150°C  
+125°C  
V
CE  
= 2 V  
0.2  
0.0001  
0
0
0.001  
0.01  
0.1  
1  
2  
3  
4  
5  
I , COLLECTOR CURRENT (A)  
C
V
BE  
, BASEEMITTER VOLTAGE (V)  
Figure 9. BaseEmitter “ON” Voltage  
Figure 10. Input Capacitance  
8
7
6
5
4
3
2
1
1000  
T = 25°C  
A
T = 25°C  
J
f = 1 MHz  
V
CE  
= 5 V  
f
= 100 MHz  
test  
100  
10  
1
0
0
5  
10  
15  
20  
25  
30  
1
10  
I , COLLECTOR CURRENT (A)  
100  
V
CB  
, COLLECTORBASE REVERSE VOLTAGE (V)  
C
Figure 11. Output Capacitance  
Figure 12. Current Gain Bandwidth Product  
www.onsemi.com  
4
MMBT5401M3  
20000  
15000  
20000  
t @ V = 120 V  
f
CC  
15000  
t @ V = 120 V  
r
CC  
10000  
5000  
10000  
5000  
t @ V = 30 V  
f
CC  
t @ V = 30 V  
r
CC  
t @ V = 120 V  
s
CC  
t @ V = 30 V  
s
CC  
t @ V = 30 V  
d
CC  
0
0
0.1  
1
10  
100  
0.1  
1
10  
100  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 13. TurnOn Time  
Figure 14. TurnOff Time  
1
V
BB  
V
CC  
+ꢀ8.8 V  
-30, -120 V  
10.2 V  
1 s  
100 ms 10 ms 1 ms  
100  
3.0 k  
R
C
V
in  
V
out  
0.1  
0.25 mF  
10 ms  
R
B
INPUT PULSE  
5.1 k  
100  
t , t 10 ns  
1N4148  
V
in  
r
f
DUTY CYCLE = 1.0%  
0.01  
0.1  
Values Shown are for I @ 10 mA  
C
1
10  
100  
V
CE  
, COLLECTOR EMITTER VOLTAGE (V)  
Figure 15. Switching Time Test Circuit  
Figure 16. Safe Operating Area  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT723  
CASE 631AA01  
ISSUE D  
DATE 10 AUG 2009  
SCALE 4:1  
NOTES:  
X−  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
D
A
b1  
Y−  
3
E
HE  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
1
2
MILLIMETERS  
2X b  
3X  
C
DIM MIN  
NOM  
0.50  
0.21  
0.31  
0.12  
1.20  
0.80  
MAX  
0.55  
0.27  
0.37  
0.17  
1.25  
0.85  
2X e  
0.08 X Y  
A
b
0.45  
0.15  
0.25  
0.07  
1.15  
0.75  
SIDE VIEW  
TOP VIEW  
b1  
C
L
D
1
E
0.40 BSC  
1.20  
0.29 REF  
0.20  
e
H E  
L
1.15  
0.15  
1.25  
0.25  
L2  
GENERIC  
3X  
L2  
MARKING DIAGRAM*  
BOTTOM VIEW  
STYLE 1:  
PIN 1. BASE  
STYLE 2:  
PIN 1. ANODE  
2. N/C  
STYLE 3:  
STYLE 4:  
STYLE 5:  
PIN 1. GATE  
2. SOURCE  
3. DRAIN  
PIN 1. ANODE  
2. ANODE  
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
XX M  
1
2. EMITTER  
3. COLLECTOR  
3. CATHODE  
3. CATHODE  
XX  
M
= Specific Device Code  
= Date Code  
RECOMMENDED  
SOLDERING FOOTPRINT*  
*This information is generic. Please refer  
to device data sheet for actual part  
marking. PbFree indicator, “G”, may  
or not be present.  
2X  
0.40  
2X 0.27  
PACKAGE  
OUTLINE  
1.50  
3X  
0.52  
0.36  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON12989D  
SOT723  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
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