NSVR02100HT1G [ONSEMI]

肖特基势垒二极管;


型号：	NSVR02100HT1G
厂家：	ONSEMI
描述：	肖特基势垒二极管快速恢复二极管测试光电二极管
文件：	总5页 (文件大小：115K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NSR02100HT1G

Schottky Barrier Diodes

These Schottky barrier diodes are designed for high speed switching

applications, circuit protection, and voltage clamping. Extremely low

forward voltage reduces conduction loss. Miniature surface mount

package is excellent for hand held and portable applications where

space is limited.

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Features

• Fast Switching Speed

• Low Leakage Current

100 VOLT SCHOTTKY

BARRIER DIODE

• Low Forward Voltage − 0.45 V @ I = 1 mAdc

• Surface Mount Device

• Low Capacitance Diode

• NSVR Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

SOD−323

CASE 477

STYLE 1

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MAXIMUM RATINGS

CATHODE

ANODE

Characteristic

Symbol Value

Unit

Total Device Dissipation FR−5 Board,

(Note 1)

MARKING DIAGRAM

T = 25°C

200

1.57

mW/°C

Derate above 25°C

JCM G

Forward Current (DC)

200

Non−Repetitive Peak Forward Current,

t < 10 msec

FSM

= Device Code

= Date Code

= Pb−Free Package

Thermal Resistance

Junction−to−Ambient

635

°C/W

°C

Junction and Storage Temperature Range

−55

to150

T , T

(Note: Microdot may be in either location)

stg

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−4 Minimum Pad

ORDERING INFORMATION

†

Device

Package

Shipping

NSR02100HT1G

SOD−323

(Pb−Free)

3,000 /

Tape & Reel

NSVR02100HT1G SOD−323

(Pb−Free)

3,000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Publication Order Number:

December, 2016 − Rev. 1

NSR02100HT1/D

NSR02100HT1G

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Characteristic

Symbol

Min

−

Typ

100

−

Max

−

Unit

Reverse Breakdown Voltage

(I = 10 μA)

Reverse Leakage

(V = 50 V)

μAdc

mAdc

Vdc

−

0.05

0.15

0.45

0.57

0.80

0.95

Reverse Leakage

(V = 100 V)

−

Forward Voltage

(I = 1 mAdc)

−

Forward Voltage

(I = 10 mAdc)

−

Forward Voltage

(I = 100 mAdc)

−

Forward Voltage

(I = 200 mAdc)

−

Total Capacitance

(V = 1.0 V, f = 1.0 MHz)

−

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

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NSR02100HT1G

TYPICAL CHARACTERISTICS

0.1

−55°C

150°C

0.01

75°C

125°C

0.001

0.0001

25°C

0.2

0.4

0.6

0.8

1.0

1.2

1.4

V , FORWARD VOLTAGE (V)

Figure 1. Forward Voltage

1000

100

T = 150°C

T = 85°C

T = 125°C

0.1

T = 25°C

0.01

0.001

0.0001

0.00001

T = −55°C

10 20

30 40 50

70 80 90 100

V , REVERSE VOLTAGE (V)

Figure 2. Leakage Current

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

10 20

30 40 50

70 80 90 100

V , REVERSE VOLTAGE (V)

Figure 3. Total Capacitance

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MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SOD−323

CASE 477−02

ISSUE H

DATE 13 MAR 2007

STYLE 1

STYLE 2

SCALE 4:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS SPECIFIED PER L/F DRAWING

WITH SOLDER PLATING.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

5. DIMENSION L IS MEASURED FROM END OF RADIUS.

MILLIMETERS

DIM MIN NOM MAX

0.80

INCHES

NOM MAX

1.00 0.031 0.035 0.040

0.10 0.000 0.002 0.004

0.006 REF

MIN

0.90

0.05

A1 0.00

0.15 REF

0.32

0.25

0.089

1.60

1.15

0.08

2.30

0.4 0.010 0.012 0.016

0.12 0.177 0.003 0.005 0.007

1.70

1.25

1.80 0.062 0.066 0.070

1.35 0.045 0.049 0.053

0.003

2.50

2.70 0.090 0.098 0.105

NOTE 5

NOTE 3

GENERIC

MARKING DIAGRAM*

SOLDERING FOOTPRINT*

XX M

0.63

0.025

STYLE 1

STYLE 2

0.83

0.033

XX = Specific Device Code

= Date Code

1.60

0.063

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

2.85

0.112

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

STYLE 1:

PIN 1. CATHODE (POLARITY BAND)

2. ANODE

STYLE 2:

NO POLARITY

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98ASB17533C

SOD−323

PAGE 1 OF 1

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