NSZ5V6V2T1G [ONSEMI]

Zener Voltage Regulators; 齐纳稳压器
NSZ5V6V2T1G
型号: NSZ5V6V2T1G
厂家: ONSEMI    ONSEMI
描述:

Zener Voltage Regulators
齐纳稳压器

稳压器
文件: 总3页 (文件大小:68K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NSZ5V6V2T1G  
Zener Voltage Regulators  
200 mW SOD-523 Surface Mount  
This series of Zener diodes is packaged in a SOD-523 surface  
mount package. They are designed to provide voltage regulation  
protection and are especially attractive in situations where space is at a  
premium. They are well suited for applications such as cellular  
phones, hand held portables, and high density PC boards.  
http://onsemi.com  
Specification Features  
1
Cathode  
2
Anode  
ꢀStandard Zener Breakdown Voltage of 5.6 V  
ꢀSteady State Power Rating of 200 mW  
ꢀSmall Body Outline Dimensions:  
0.047x 0.032(1.20 mm x 0.80 mm)  
2
ꢀLow Body Height: 0.028(0.7 mm)  
1
ꢀESD Rating of Class 3 (>16 kV) per Human Body Model  
ꢀTight Tolerance V  
Z
SOD-523  
CASE 502  
PLASTIC  
ꢀThese are Pb-Free Devices  
Mechanical Characteristics  
CASE: Void‐free, transfer‐molded, thermosetting plastic  
Epoxy Meets UL 94, V-0  
MARKING DIAGRAM  
CT MG  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
G
2
1
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
CT = Specific Device Code  
Date Code*  
M
G = Pb-Free Package  
(Note: Microdot may be in either location)  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
*Date Code orientation may vary depending  
upon manufacturing location.  
Total Device Dissipation FR-5 Board,  
(Note 1) @ T = 25°C  
Derate above 25°C  
P
D
200  
1.5  
mW  
mW/°C  
A
ORDERING INFORMATION  
Thermal Resistance from  
Junction-to-Ambient  
R
q
JA  
635  
°C/W  
Device  
Package  
Shipping  
Junction and Storage Temperature Range  
T , T  
J
-65 to  
+150  
°C  
stg  
NSZ5V6V2T1G  
SOD-523*  
3000/Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR-4 Minimum Pad.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*This package is inherently Pb-Free.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
©ꢀ Semiconductor Components Industries, LLC, 2007  
May, 2007 - Rev. 0  
1
Publication Order Number:  
NSZ5V6V2/D  
 
NSZ5V6V2T1G  
ELECTRICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted,  
A
V = 0.9 V Max. @ I = 10 mA for all types)  
I
F
F
I
F
Symbol  
Parameter  
V
Reverse Zener Voltage @ I  
Reverse Current  
Z
ZT  
I
ZT  
Z
Maximum Zener Impedance @ I  
Reverse Current  
ZT  
ZK  
ZT  
ZK  
V
Z
V
R
V
I
ZT  
V
F
R
I
ZK  
I
Z
Maximum Zener Impedance @ I  
I
Reverse Leakage Current @ V  
Reverse Voltage  
R
R
V
R
I
F
Forward Current  
V
F
Forward Voltage @ I  
F
Figure 1. Zener Voltage Regulator  
QV  
Maximum Temperature Coefficient of V  
Z
Z
C
Max. Capacitance @V = 0 and f = 1 MHz  
R
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)  
Z
I = IZT  
ZT  
Zener Voltage  
VZ  
Max  
IR @ VR  
d
@ I  
/dt (mV/k)  
VZ  
Z
I
Z
Z
ZK  
= 5 mA  
ZT1  
@ 10%  
Mod W  
Max  
Test  
Current  
Izt mA  
C pF Max @ V  
= 0  
= 1.0  
mA W  
Max  
R
Min  
Max  
mA  
1.0  
V
Min  
Max  
f = 1 MHz  
Device*  
NSZ5V6V2T1G  
5.0  
5.49  
5.73  
200  
40  
2.0  
-2.0  
2.5  
200  
100  
80  
60  
40  
20  
0
0
25  
50  
75  
100  
125  
150  
TEMPERATURE (°C)  
Figure 2. Steady State Power Derating  
http://onsemi.com  
2
NSZ5V6V2T1G  
PACKAGE DIMENSIONS  
SOD-523  
CASE 502-01  
ISSUE C  
-X-  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD THICKNESS  
IS THE MINIMUM THICKNESS OF BASE  
MATERIAL.  
A
-Y-  
B
1
2
MILLIMETERS  
NOM  
INCHES  
NOM  
D 2 PL  
DIM MIN  
MAX  
1.30  
0.90  
0.70  
0.35  
MIN  
MAX  
0.051  
0.035  
0.028  
0.014  
A
B
C
D
J
1.10  
1.20  
0.80  
0.60  
0.30  
0.14  
0.20  
1.60  
0.043  
0.028  
0.020  
0.010  
0.047  
0.032  
0.024  
0.012  
M
0.08 (0.003)  
T
X
Y
0.70  
0.50  
0.25  
0.07  
0.15  
1.50  
0.20 0.0028 0.0055 0.0079  
K
S
0.25  
1.70  
0.006  
0.059  
0.008  
0.063  
0.010  
0.067  
C
-T-  
SEATING  
PLANE  
K
J
S
SOLDERING FOOTPRINT*  
1.40  
0.0547  
0.40  
0.0157  
0.40  
0.0157  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb-Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
ꢁLiterature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
N. American Technical Support: 800-282-9855 Toll Free  
ꢁUSA/Canada  
Europe, Middle East and Africa Technical Support:  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada ꢁPhone: 421 33 790 2910  
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
Japan Customer Focus Center  
ꢁPhone: 81-3-5773-3850  
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