NTD5C632NLT4G [ONSEMI]

单 N 沟道,逻辑电平,功率 MOSFET,60V,155A,2.5mΩ;
NTD5C632NLT4G
型号: NTD5C632NLT4G
厂家: ONSEMI    ONSEMI
描述:

单 N 沟道,逻辑电平,功率 MOSFET,60V,155A,2.5mΩ

文件: 总7页 (文件大小:233K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NTD5C632NL  
MOSFET – Single,  
N-Channel  
60 V, 2.5 mW, 155 A  
Features  
Low R  
www.onsemi.com  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
V
R
I
D
(BR)DSS  
DS(on)  
Compliant  
2.5 mW @ 10 V  
3.4 mW @ 4.5 V  
60 V  
155 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
D
V
DSS  
GatetoSource Voltage  
V
"20  
155  
110  
115  
58  
V
GS  
Continuous Drain Cur-  
T
= 25°C  
= 100°C  
= 25°C  
I
A
C
D
rent R  
(Notes 1 & 3)  
q
JC  
T
C
G
Steady  
State  
Power Dissipation R  
(Note 1)  
T
C
P
W
A
q
D
JC  
JA  
T
C
= 100°C  
S
NCHANNEL MOSFET  
Continuous Drain  
Current R  
T = 25°C  
A
I
29  
D
q
JA  
T = 100°C  
A
21  
(Notes 1, 2 & 3)  
4
Steady  
State  
Power Dissipation R  
(Notes 1 & 2)  
T = 25°C  
A
P
4
W
q
D
2
1
T = 100°C  
A
2
3
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
900  
A
A
p
DPAK  
CASE 369C  
STYLE 2  
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
Source Current (Body Diode)  
I
S
96  
A
Single Pulse DraintoSource Avalanche  
E
363  
mJ  
AS  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Energy (I  
= 14.4 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
4
Drain  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
2
Parameter  
Symbol  
Value  
1.3  
Unit  
Drain  
1
3
Gate Source  
JunctiontoCase (Drain) (Note 1)  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
A
Y
WW  
= Assembly Location  
= Year  
= Work Week  
R
37  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
5C632L = Device Code  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
G
= PbFree Package  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
May, 2019 Rev. 1  
NTD5C632NL/D  
 
NTD5C632NL  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
OFF CHARACTERISTICS  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
60  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
J
24  
mV/°C  
(BR)DSS  
Zero Gate Voltage Drain Current  
I
T = 25°C  
10  
mA  
DSS  
J
V
= 0 V,  
GS  
DS  
V
= 60 V  
T = 125°C  
J
250  
100  
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage  
I
V
= 0 V, V = 20 V  
nA  
GSS  
DS  
GS  
V
V
= V , I = 250 mA  
1.2  
2.1  
V
GS(TH)  
GS  
DS  
D
Negative Threshold Temperature Coefficient  
DraintoSource On Resistance  
V
/T  
5.8  
2.1  
2.7  
185  
mV/°C  
mW  
GS(TH)  
J
R
V
= 10 V, I = 50 A  
2.5  
3.4  
DS(on)  
GS  
D
V
GS  
= 4.5 V, I = 50 A  
D
Forward Transconductance  
g
FS  
V
= 3 V, I = 50 A  
S
DS  
D
CHARGES, CAPACITANCES AND GATE RESISTANCES  
Input Capacitance  
C
5700  
2800  
36  
pF  
iss  
V
= 0 V, f = 1.0 MHz,  
DS  
GS  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C
oss  
V
= 25 V  
C
rss  
Q
Q
V
= 4.5 V  
= 10 V  
34  
nC  
nC  
G(TOT)  
G(TOT)  
GS  
V
= 30 V,  
= 50 A  
DS  
I
D
V
78  
GS  
Total Gate Charge  
34.0  
9.5  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Plateau Voltage  
Q
G(TH)  
V
GS  
= 4.5 V, V = 30 V,  
DS  
Q
16.8  
6.1  
GS  
GD  
GP  
I
D
= 50 A  
Q
V
3.1  
V
Gate Resistance  
R
0.7  
W
G
SWITCHING CHARACTERISTICS (Note 5)  
TurnOn Delay Time  
t
20  
126  
65  
ns  
d(on)  
Rise Time  
t
r
V
= 4.5 V, V = 30 V,  
DS  
GS  
D
I
= 50 A, R = 2.5 W  
G
TurnOff Delay Time  
t
d(off)  
Fall Time  
t
f
121  
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
T = 25°C  
0.8  
0.7  
71  
1.2  
V
SD  
J
V
S
= 0 V,  
GS  
I
= 50 A  
T = 125°C  
J
Reverse Recovery Time  
Charge Time  
t
ns  
RR  
ta  
36  
V
= 0 V, dI /dt = 100 A/ms,  
S
GS  
I
S
= 50 A  
Discharge Time  
tb  
36  
Reverse Recovery Charge  
Q
110  
nC  
RR  
4. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.  
5. Switching characteristics are independent of operating junction temperatures.  
www.onsemi.com  
2
 
NTD5C632NL  
TYPICAL CHARACTERISTICS  
280  
240  
200  
160  
120  
80  
280  
10 V to  
4.5 V  
V
GS  
= 3.6 V  
V
DS  
= 3 V  
3.4 V  
3.2 V  
240  
200  
160  
120  
80  
3.0 V  
T = 25°C  
J
2.8 V  
2.6 V  
40  
0
40  
0
2.4 V  
2.2 V  
T = 125°C  
J
T = 55°C  
J
0
0.5  
1.0  
1.5  
2.0  
2.5  
0
1
2
3
4
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
8
7
6
5
4
3
2
1
3.5  
3.0  
T = 25°C  
D
J
T = 25°C  
J
I
= 50 A  
V
V
= 4.5 V  
= 10 V  
GS  
2.5  
GS  
2.0  
1.5  
0
1
2
3
4
5
6
7
8
9
10  
10 20  
30  
40  
50  
60  
70  
80  
90 100  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. GatetoSource  
Figure 4. OnResistance vs. Drain Current and  
Voltage  
Gate Voltage  
2.0  
100K  
10K  
V
I
= 10 V  
= 50 A  
GS  
T = 150°C  
J
1.8  
1.6  
1.4  
1.2  
1.0  
D
T = 125°C  
J
1K  
T = 85°C  
J
0.8  
0.6  
100  
50 25  
0
25  
50  
75 100 125 150 175  
5
15  
25  
35  
45  
55  
T , JUNCTION TEMPERATURE (°C)  
J
V
, DRAINTOSOURCE VOLTAGE (V)  
DS  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Voltage  
www.onsemi.com  
3
NTD5C632NL  
TYPICAL CHARACTERISTICS  
10K  
1K  
10  
Q
T
C
9
8
7
6
5
4
3
2
ISS  
C
OSS  
100  
Q
GD  
Q
GS  
C
RSS  
10  
1
V
= 0 V  
GS  
V
DS  
= 30 V  
T = 25°C  
J
T = 25°C  
J
1
0
f = 1 MHz  
10  
I
D
= 50 A  
0
20  
30  
40  
50  
60  
0
10  
20  
30  
40  
50  
60  
70  
80  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
G
Figure 7. Capacitance Variation  
Figure 8. GatetoSource Voltage vs. Total  
Charge  
100  
1000  
100  
10  
V
GS  
= 0 V  
t
d(off)  
t
t
f
r
10  
t
d(on)  
V
V
= 4.5 V  
= 30 V  
GS  
DS  
I
D
= 50 A  
T = 125°C  
J
T = 55°C  
J
T = 25°C  
J
1
1
10  
R , GATE RESISTANCE (W)  
100  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
V
SD  
, SOURCETODRAIN VOLTAGE (V)  
G
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
100  
1000  
100  
V
10 V  
T
= 25°C  
GS  
J(initial)  
10  
10  
10 ms  
Single Pulse  
T = 100°C  
J(initial)  
T
C
= 25°C  
0.5 ms  
1 ms  
10 ms  
1
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
0.1  
1
0.1  
1
10  
100  
1000  
1E04  
1E03  
TIME IN AVALANCHE (s)  
1E02  
V
DS  
, DRAINTOSOURCE VOLTAGE(V)  
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Drain Current vs. Time in  
Avalanche  
www.onsemi.com  
4
NTD5C632NL  
TYPICAL CHARACTERISTICS  
100  
10  
1
50% Duty Cycle  
20%  
10%  
5%  
2%  
1%  
0.1  
0.01  
Single Pulse  
0.001  
0.000001 0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 13. Thermal Response  
ORDERING INFORMATION  
Order Number  
Package  
Shipping  
NTD5C632NLT4G  
DPAK  
(PbFree)  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
4
DPAK (SINGLE GAUGE)  
CASE 369C  
ISSUE G  
2
1
DATE 31 MAY 2023  
3
SCALE 1:1  
GENERIC  
MARKING DIAGRAM*  
XXXXXXG  
ALYWW  
AYWW  
XXX  
XXXXXG  
IC  
Discrete  
XXXXXX = Device Code  
A
= Assembly Location  
L
= Wafer Lot  
STYLE 1:  
STYLE 2:  
PIN 1. GATE  
2. DRAIN  
STYLE 3:  
STYLE 4:  
STYLE 5:  
Y
WW  
G
= Year  
= Work Week  
= PbFree Package  
PIN 1. BASE  
PIN 1. ANODE  
2. CATHODE  
3. ANODE  
PIN 1. CATHODE  
2. ANODE  
3. GATE  
PIN 1. GATE  
2. ANODE  
3. CATHODE  
4. ANODE  
2. COLLECTOR  
3. EMITTER  
3. SOURCE  
4. DRAIN  
4. COLLECTOR  
4. CATHODE  
4. ANODE  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
STYLE 6:  
PIN 1. MT1  
2. MT2  
STYLE 7:  
PIN 1. GATE  
STYLE 8:  
PIN 1. N/C  
STYLE 9:  
PIN 1. ANODE  
2. CATHODE  
STYLE 10:  
PIN 1. CATHODE  
2. ANODE  
2. COLLECTOR  
2. CATHODE  
3. GATE  
4. MT2  
3. EMITTER  
4. COLLECTOR  
3. ANODE  
4. CATHODE  
3. RESISTOR ADJUST  
4. CATHODE  
3. CATHODE  
4. ANODE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON10527D  
DPAK (SINGLE GAUGE)  
PAGE 1 OF 1  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
www.onsemi.com/support/sales  

相关型号:

NTD5C648NLT4G

单 N 沟道,功率 MOSFET,60V,91A,4.1mΩ
ONSEMI

NTD5C668NLT4G

单 N 沟道,逻辑电平,功率 MOSFET,60V,48A,9.3mΩ
ONSEMI

NTD5C684NLT4G

Single N-Channel Logic Level Power MOSFET 60V, 27 A, 16.5mΩ
ONSEMI

NTD5C688NLT4G

单 N 沟道,逻辑电平,功率 MOSFET,60V,17A,27.4mΩ
ONSEMI

NTD5N50

5A, 500V, 1.7ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
ONSEMI

NTD5N50

5A, 500V, 1.7ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
MOTOROLA

NTD5N50

5A, 500V, 1.7ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
ROCHESTER

NTD5N50-1

5A, 500V, 1.7ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
ONSEMI

NTD5N50/D

Power MOSFET 5 Amps, 500 Volts
ETC

NTD5N50T4

5A, 500V, 1.7ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
MOTOROLA

NTD5N50T4

5A, 500V, 1.7ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
ROCHESTER

NTD5N50T4

5A, 500V, 1.7ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
ONSEMI