NTHL020N090SC1 [ONSEMI]

Silicon Carbide (SiC) MOSFET - EliteSiC, 20 mohm, 900 V, M2, TO-247-3L;
NTHL020N090SC1
型号: NTHL020N090SC1
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) MOSFET - EliteSiC, 20 mohm, 900 V, M2, TO-247-3L

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中文:  中文翻译
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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – EliteSiC,  
20ꢀmohm, 900ꢀV, M2,  
TO-247-3L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
900 V  
28 mW @ 15 V  
118 A  
D
NTHL020N090SC1  
G
Features  
Typ. R  
Typ. R  
= 20 mW @ V = 15 V  
DS(on)  
DS(on)  
GS  
= 16 mW @ V = 18 V  
S
GS  
NCHANNEL MOSFET  
Ultra Low Gate Charge (Q  
= 196 nC)  
G(tot)  
Low Effective Output Capacitance (C = 296 pF)  
100% UIL Tested  
This Device is Halide Free and RoHS Compliant with exemption 7a,  
PbFree 2LI (on second level interconnection)  
oss  
Typical Applications  
UPS  
DCDC Converter  
Boost Inverter  
G
D
S
TO2473LD  
CASE 340CX  
MARKING DIAGRAM  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
900  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
+22/8  
+15/5  
V
GS  
$Y&Z&3&K  
NTHL020  
N090SC1  
Recommended Operation Val-  
ues of Gate Source Voltage  
T
< 175°C  
= 25°C  
V
GSop  
V
C
Continuous Drain  
Current R  
Steady  
State  
T
I
118  
503  
83  
A
W
A
C
DC  
q
JC  
Power Dissipation  
R
P
DC  
q
JC  
$Y  
= onsemi Logo  
&Z  
&3  
&K  
= Assembly Plant Code  
= Date Code (Year & Week)  
= Lot  
Continuous Drain  
Current R  
Steady  
State  
T
C
= 100°C  
I
DC  
q
JC  
Power Dissipation  
R
P
DC  
251  
472  
W
NTHL020N090SC1 = Specific Device Code  
q
JC  
Pulsed Drain Current (Note 2)  
T = 25°C  
I
A
A
DM  
ORDERING INFORMATION  
Operating Junction and Storage Temperature  
Range  
T , T  
J
55 to  
+175  
°C  
stg  
Device  
Package  
Shipping  
Source Current (Body Diode)  
I
153  
264  
A
S
TO2473LD  
30 Units /  
Tube  
NTHL020N090SC1  
Single Pulse DraintoSource Avalanche  
E
mJ  
AS  
Energy (I = 23 A , L = 1 mH) (Note 3)  
L
pk  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. The entire application environment impacts the thermal resistance values  
shown, they are not constants and are only valid for the particular conditions noted.  
2. Repetitive rating, limited by max junction temperature.  
3. E of 162 mJ is based on starting T = 25°C; L = 1 mH, I = 23 A,  
AS  
DD  
J
AS  
V
= 100 V, V = 15 V.  
GS  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
January, 2023 Rev. 4  
NTHL020N090SC1/D  
 
NTHL020N090SC1  
Table 1. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Max  
0.30  
40  
Unit  
°C/W  
°C/W  
Thermal Resistance JunctiontoCase (Note 1)  
Thermal Resistance JunctiontoAmbient (Note 1)  
R
θ
JC  
JA  
R
θ
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise stated)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 1 mA  
900  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/
I
D
= 1 mA, refer to 25°C  
500  
mV/°  
C
(BR)DSS  
T
J
Zero Gate Voltage Drain Current  
I
V
V
= 0 V,  
= 900 V  
T = 25°C  
100  
250  
1
mA  
mA  
mA  
DSS  
GS  
J
DS  
T = 175°C  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS  
I
V
GS  
= +22/8 V, V = 0 V  
DS  
GSS  
Gate Threshold Voltage  
V
V
= V , I = 20 mA  
1.8  
2.7  
4.3  
+15  
28  
V
V
GS(TH)  
GS  
DS  
D
Recommended Gate Voltage  
DraintoSource On Resistance  
V
5  
GOP  
R
V
GS  
V
GS  
V
GS  
V
DS  
= 15 V, I = 60 A, T = 25°C  
20  
16  
27  
49  
mW  
DS(on)  
D
J
= 18 V, I = 60 A, T = 25°C  
D
J
= 15 V, I = 60 A, T = 175°C  
D
J
Forward Transconductance  
g
FS  
= 20 V, I = 60 A  
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
V
= 0 V, f = 1 MHz,  
= 450 V  
4415  
296  
24  
pF  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
RSS  
Reverse Transfer Capacitance  
Total Gate Charge  
C
Q
V
= 5/15 V, V = 720 V,  
196  
42  
nC  
G(TOT)  
GS  
DS  
I
= 60 A  
D
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Q
G(TH)  
Q
78  
GS  
GD  
Q
55  
f = 1 MHz  
1.6  
W
GateResistance  
R
G
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
V
D
= 5/15 V, V = 720 V,  
40  
63  
ns  
d(ON)  
GS  
DS  
I
= 60 A, R = 2.5 W,  
G
Rise Time  
t
r
Inductive Load  
TurnOff Delay Time  
t
55  
d(OFF)  
Fall Time  
t
f
13  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
2025  
201  
2226  
mJ  
ON  
E
OFF  
E
TOT  
DRAINSOURCE DIODE CHARACTERISTICS  
Continuous DrainSource Diode Forward  
I
V
GS  
V
GS  
V
GS  
= 5 V, T = 25°C  
153  
472  
A
A
V
SD  
J
Current  
Pulsed DrainSource Diode Forward  
Current (Note 2)  
I
= 5 V, T = 25°C  
J
SDM  
Forward Diode Voltage  
V
= 5 V, I = 30 A, T = 25°C  
3.8  
SD  
SD  
J
www.onsemi.com  
2
 
NTHL020N090SC1  
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise stated)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
DRAINSOURCE DIODE CHARACTERISTICS  
Reverse Recovery Time  
t
V
= 5/15 V, I = 60 A,  
28  
199  
4
ns  
nC  
mJ  
A
RR  
GS  
S
SD  
dI /dt = 1000 A/ms, V = 720 V  
DS  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
Q
RR  
E
REC  
I
14  
16  
12  
RRM  
Ta  
ns  
ns  
Discharge Time  
Tb  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
NTHL020N090SC1  
TYPICAL CHARACTERISTICS  
200  
150  
100  
4
13 V  
V
GS  
= 15 V  
9 V  
V
GS  
= 10 V  
12 V  
3
12 V  
13 V  
15 V  
2
10 V  
9 V  
1
50  
0
6 V  
7 V  
0
0
2
4
6
8
10  
0
30  
60  
90  
120  
150  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
1.9  
1.7  
1.5  
1.3  
1.1  
160  
120  
80  
I
D
= 60 A  
I
V
= 60 A  
D
= 15 V  
GS  
40  
0
T = 150°C  
J
0.9  
0.7  
T = 25°C  
J
75 50 25  
0
25 50 75 100 125 150 175  
5
10  
15  
20  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 3. OnResistance Variation with  
Figure 4. OnResistance vs. GatetoSource  
Temperature  
Voltage  
120  
100  
80  
300  
T = 175°C  
J
T = 55°C  
J
V
GS  
= 5 V  
T = 25°C  
J
T = 55°C  
J
T = 175°C  
J
60  
30  
40  
T = 25°C  
J
20  
0
V
DS  
= 20 V  
3
3
6
9
12  
15  
1
3
5
7
9
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
www.onsemi.com  
4
NTHL020N090SC1  
TYPICAL CHARACTERISTICS (continued)  
15  
10  
5
50K  
V
DD  
= 180 V  
I
D
= 60 A  
V
DD  
= 540 V  
10K  
1K  
C
iss  
V
DD  
= 720 V  
C
oss  
C
rss  
100  
0
10  
1
f = 1 MHz  
= 0 V  
V
GS  
5  
0.1  
1
10  
100  
800  
175  
0.1  
0
50  
100  
Q , GATE CHARGE (nC)  
150  
200  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
g
Figure 7. GatetoSource Voltage vs. Total  
Figure 8. Capacitance vs. DraintoSource  
Charge  
Voltage  
100  
140  
120  
100  
80  
V
GS  
= 15 V  
T = 25°C  
J
10  
60  
T = 150°C  
J
40  
20  
0
Typical performance based  
on characterization data  
R
= 0.30°C/W  
q
JC  
1
0.001  
0.01  
0.1  
1
10  
100  
25  
50  
75  
100  
125  
150  
t , TIME IN AVALANCHE (ms)  
AV  
T , CASE TEMPERATURE (°C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
100K  
10K  
1000  
100  
10  
Single Pulse  
R
= 0.30°C/W  
q
JC  
T
C
= 25°C  
10 ms  
This area is lim-  
ited by R  
100 ms  
DS(on)  
1K  
Single Pulse  
T = Max Rated  
1
1 ms  
J
R
= 0.30°C/W  
q
JC  
10 ms  
T
C
= 25°C  
100 ms  
1000 5000  
, DRAINTOSOURCE VOLTAGE (V)  
0.1  
100  
0.1  
1
10  
100  
0.00001 0.0001  
0.001  
0.01  
V
DS  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
www.onsemi.com  
5
NTHL020N090SC1  
TYPICAL CHARACTERISTICS (continued)  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.1  
0.02  
Notes:  
Z (t) = r(t) x R  
q
JC  
0.01  
P
DM  
0.01  
q
JC  
Single Pulse  
R
= 0.30°C/W  
q
JC  
t
Peak T = P  
x Z  
(t) + T  
JC C  
1
q
J
DM  
Duty Cycle, D = t /t  
t
1
2
2
0.001  
0.00001  
0.0001  
0.001  
t, RECTANGULAR PULSE DURATION (sec)  
0.01  
0.1  
Figure 13. JunctiontoAmbient Transient Thermal Response Curve  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
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www.onsemi.com  
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