NTMFS5C460NLT3G [ONSEMI]

Power MOSFET;
NTMFS5C460NLT3G
型号: NTMFS5C460NLT3G
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET

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中文:  中文翻译
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NTMFS5C670NL  
Power MOSFET  
60 V, 6.1 mW, 71 A, Single N−Channel  
Features  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
G
These Devices are Pb−Free and are RoHS Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
6.1 mW @ 10 V  
8.8 mW @ 4.5 V  
60 V  
71 A  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
Gate−to−Source Voltage  
V
GS  
20  
V
D (5)  
Continuous Drain  
Current R  
(Notes 1, 3)  
T
= 25°C  
= 100°C  
= 25°C  
I
71  
A
C
D
q
JC  
T
C
50  
Steady  
State  
Power Dissipation  
T
C
P
61  
W
A
D
R
(Note 1)  
q
JC  
G (4)  
T
C
= 100°C  
31  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
17  
q
JA  
S (1,2,3)  
N−CHANNEL MOSFET  
T = 100°C  
A
12  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.6  
1.8  
440  
W
D
R
(Notes 1 & 2)  
q
JA  
T = 100°C  
A
MARKING  
DIAGRAM  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
T , T  
55 to  
+175  
°C  
J
stg  
D
1
S
S
S
G
D
D
Source Current (Body Diode)  
I
68  
A
S
DFN5  
(SO−8FL)  
CASE 488AA  
STYLE 1  
5C670L  
AYWZZ  
Single Pulse Drain−to−Source Avalanche  
E
AS  
166  
mJ  
Energy (I  
= 3.6 A)  
L(pk)  
D
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
5C670L = Specific Device Code  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
2.4  
Unit  
Junction−to−Case − Steady State  
Junction−to−Ambient − Steady State (Note 2)  
R
°C/W  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
q
JC  
JA  
R
41  
q
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
January, 2016 − Rev. 1  
NTMFS5C670NL/D  
 
NTMFS5C670NL  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain−to−Source Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
60  
V
(BR)DSS  
D
Drain−to−Source Breakdown Voltage  
Temperature Coefficient  
V
/
27  
(BR)DSS  
mV/°C  
T
J
Zero Gate Voltage Drain Current  
I
V
V
= 0 V,  
= 60 V  
T = 25 °C  
10  
DSS  
GS  
DS  
J
mA  
T = 125°C  
J
250  
100  
Gate−to−Source Leakage Current  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage  
I
V
= 0 V, V = 20 V  
nA  
GSS  
DS  
GS  
V
V
= V , I = 53 mA  
1.2  
2.0  
V
GS(TH)  
GS  
DS  
D
Threshold Temperature Coefficient  
Drain−to−Source On Resistance  
V
/T  
−4.7  
5.1  
7.0  
82  
mV/°C  
GS(TH)  
J
R
V
= 10 V  
I
= 35 A  
= 35 A  
6.1  
8.8  
DS(on)  
GS  
D
mW  
V
GS  
= 4.5 V  
I
D
Forward Transconductance  
CHARGES AND CAPACITANCES  
Input Capacitance  
g
FS  
V
= 15 V, I = 35 A  
S
DS  
D
C
1400  
640  
15  
ISS  
Output Capacitance  
C
C
V
= 0 V, f = 1 MHz, V = 25 V  
pF  
OSS  
RSS  
GS  
DS  
Reverse Transfer Capacitance  
Total Gate Charge  
Q
V
= 4.5 V, V = 30 V; I = 35 A  
9.0  
20  
G(TOT)  
G(TOT)  
GS  
DS  
D
Total Gate Charge  
Q
V
= 10 V, V = 30 V; I = 35 A  
DS D  
GS  
Threshold Gate Charge  
Gate−to−Source Charge  
Gate−to−Drain Charge  
Plateau Voltage  
Q
2.5  
4.5  
2.0  
3.1  
nC  
V
G(TH)  
Q
GS  
GD  
GP  
V
GS  
= 10 V, V = 30 V; I = 35 A  
DS  
D
Q
V
SWITCHING CHARACTERISTICS (Note 5)  
Turn−On Delay Time  
t
11  
60  
15  
4
d(ON)  
Rise Time  
t
r
V
= 4.5 V, V = 30 V,  
DS  
GS  
ns  
V
I
D
= 35 A, R = 2.5 W  
G
Turn−Off Delay Time  
t
d(OFF)  
Fall Time  
t
f
DRAIN−SOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
T = 25°C  
0.9  
0.8  
34  
17  
17  
19  
1.2  
SD  
J
V
= 0 V,  
= 35 A  
GS  
I
S
T = 125°C  
J
Reverse Recovery Time  
Charge Time  
t
RR  
t
ns  
a
V
GS  
= 0 V, dI /dt = 100 A/ms,  
S
I
S
= 35 A  
Discharge Time  
t
b
Reverse Recovery Charge  
Q
nC  
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.  
5. Switching characteristics are independent of operating junction temperatures.  
www.onsemi.com  
2
 
NTMFS5C670NL  
TYPICAL CHARACTERISTICS  
140  
120  
100  
80  
140  
6.5 V to  
10 V  
4.5 V  
V
DS  
= 5 V  
120  
100  
80  
3.8 V  
3.4 V  
3.0 V  
60  
60  
40  
20  
0
T = 25°C  
J
40  
20  
0
2.6 V  
3.5  
T = 125°C  
J
T = −55°C  
J
0
0.5  
V
1.0  
1.5  
2.0  
2.5  
3.0  
4.0  
0
0.5  
1.0  
, GATE−TO−SOURCE VOLTAGE (V)  
GS  
1.5  
2.0  
2.5  
3.0  
3.5 4.0  
, DRAIN−TO−SOURCE VOLTAGE (V)  
V
DS  
Figure 1. On−Region Characteristics  
Figure 2. Transfer Characteristics  
15  
14  
13  
12  
11  
10  
9
10  
9
T = 25°C  
J
T = 25°C  
D
J
I
= 35 A  
8
V
GS  
= 4.5 V  
7
6
8
V
= 10 V  
55  
GS  
7
5
4
6
5
3.5  
4.5  
5.5  
6.5  
7.5  
8.5  
9.5  
5
15  
25  
35  
45  
65  
75  
V
GS  
, GATE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. On−Resistance vs. Gate−to−Source  
Voltage  
Figure 4. On−Resistance vs. Drain Current and  
Gate Voltage  
100000  
10000  
1000  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
V
= 10 V  
= 35 A  
T = 175°C  
GS  
J
I
D
T = 125°C  
J
T = 85°C  
J
100  
10  
0.8  
0.6  
−50 −25  
0
25  
50  
75 100 125 150 175  
10  
20  
V , DRAIN−TO−SOURCE VOLTAGE (V)  
DS  
30  
40  
50  
60  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 5. On−Resistance Variation with  
Temperature  
Figure 6. Drain−to−Source Leakage Current  
vs. Voltage  
www.onsemi.com  
3
NTMFS5C670NL  
TYPICAL CHARACTERISTICS  
10000  
1000  
100  
10  
10  
9
Q
T
C
ISS  
8
7
6
5
4
3
2
1
0
C
OSS  
Q
GD  
Q
GS  
C
RSS  
V
= 30 V  
DS  
V
= 0 V  
GS  
T = 25°C  
J
T = 25°C  
J
I
D
= 35 A  
f = 1 MHz  
1
0
10  
20  
30  
40  
50  
60  
0
2
4
6
8
10 12 14 16 18 20  
V
DS  
, DRAIN−TO−SOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
G
Figure 7. Capacitance Variation  
Figure 8. Gate−to−Source and  
Drain−to−Source Voltage vs. Total Charge  
1000  
100  
10  
T = 125°C  
J
t
r
10  
T = 25°C  
J
t
d(on)  
t
d(off)  
T = −55°C  
J
V
V
I
= 4.5 V  
= 30 V  
= 35 A  
GS  
DS  
t
f
D
1
1
1
10  
R , GATE RESISTANCE (W)  
100  
0.3  
0.4  
0.5  
, SOURCE−TO−DRAIN VOLTAGE (V)  
SD  
0.6  
0.7  
0.8  
0.9  
1.0  
V
G
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
1000  
100  
10  
100  
10  
T
V
= 25°C  
10 V  
C
GS  
Single Pulse  
500 ms  
T = 25°C  
J
T = 100°C  
J
10 ms  
1
1
R
Limit  
DS(on)  
1 ms  
Thermal Limit  
Package Limit  
0.1  
0.1  
0.1  
1
10  
100  
1E−5  
1E−4  
1E−3  
1E−2  
V
DS  
(V)  
TIME IN AVALANCHE (s)  
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Drain Current vs. Time in  
Avalanche  
www.onsemi.com  
4
NTMFS5C670NL  
100  
10  
50% Duty Cycle  
20%  
10%  
5%  
1
2%  
1%  
0.1  
0.01  
Single Pulse  
0.00001 0.0001  
0.000001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 13. Thermal Characteristics  
DEVICE ORDERING INFORMATION  
Device  
Marking  
Package  
Shipping  
NTMFS5C670NLT1G  
5C670L  
DFN5  
(Pb−Free)  
1500 / Tape & Reel  
5000 / Tape & Reel  
NTMFS5C670NLT3G  
5C670L  
DFN5  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
5
NTMFS5C670NL  
PACKAGE DIMENSIONS  
DFN5 5x6, 1.27P  
(SO−8FL)  
CASE 488AA  
ISSUE M  
2 X  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
0.20  
C
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION D1 AND E1 DO NOT INCLUDE  
MOLD FLASH PROTRUSIONS OR GATE  
BURRS.  
D
A
2
B
E
2 X  
D1  
MILLIMETERS  
0.20  
C
DIM  
A
A1  
b
c
D
D1  
D2  
E
E1  
E2  
e
G
K
L
L1  
M
MIN  
0.90  
0.00  
0.33  
0.23  
5.00  
4.70  
3.80  
6.00  
5.70  
3.45  
NOM  
1.00  
−−−  
0.41  
0.28  
5.15  
4.90  
4.00  
6.15  
MAX  
1.10  
0.05  
0.51  
0.33  
5.30  
5.10  
4.20  
6.30  
6.10  
3.85  
4 X  
q
E1  
2
c
A1  
5.90  
3.65  
1
2
3
4
1.27 BSC  
0.575  
1.35  
0.575  
0.125 REF  
3.40  
0.51  
1.20  
0.51  
0.71  
1.50  
0.71  
TOP VIEW  
C
SEATING  
DETAIL A  
PLANE  
0.10  
0.10  
C
C
3.00  
0
3.80  
q
−−−  
12  
A
_
_
RECOMMENDED  
SOLDERING FOOTPRINT*  
STYLE 1:  
PIN 1. SOURCE  
2. SOURCE  
3. SOURCE  
4. GATE  
SIDE VIEW  
2X  
DETAIL A  
0.495  
4.560  
5. DRAIN  
2X  
8X b  
A B  
1.530  
0.10  
0.05  
C
c
e/2  
e
L
1
4
3.200  
1.330  
4.530  
K
2X  
E2  
PIN 5  
(EXPOSED PAD)  
0.905  
M
L1  
1
0.965  
4X  
1.000  
0.750  
D2  
BOTTOM VIEW  
G
1.270  
PITCH  
4X  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and the  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed  
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation  
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and  
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets  
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each  
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,  
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which  
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or  
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim  
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable  
copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
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19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NTMFS5C670NL/D  

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