NTP082N65S3HF [ONSEMI]

MOSFET, Power, N-Channel, SUPERFET® III, FRFET®,650 V, 40 A, 82 mΩ, TO-220;
NTP082N65S3HF
型号: NTP082N65S3HF
厂家: ONSEMI    ONSEMI
描述:

MOSFET, Power, N-Channel, SUPERFET® III, FRFET®,650 V, 40 A, 82 mΩ, TO-220

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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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MOSFET - Power,  
N-Channel, SUPERFETIII,  
FRFET  
650 V, 40 A, 82 mW  
NTP082N65S3HF  
Description  
www.onsemi.com  
SUPERFET III MOSFET is ON Semiconductor’s brandnew high  
voltage superjunction (SJ) MOSFET family that is utilizing charge  
balance technology for outstanding low onresistance and lower gate  
charge performance. This advanced technology is tailored to minimize  
conduction loss, provide superior switching performance, and  
withstand extreme dv/dt rate.  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
650 V  
82 mW @ 10 V  
40 A  
D
Consequently, SUPERFET III MOSFET is very suitable for the  
various power system for miniaturization and higher efficiency.  
SUPERFET III FRFET MOSFET’s optimized reverse recovery  
performance of body diode can remove additional component and  
improve system reliability.  
G
Features  
S
700 V @ T = 150°C  
J
POWER MOSFET  
Typ. R  
= 70 mW  
DS(on)  
Ultra Low Gate Charge (Typ. Q = 81 nC)  
g
Low Effective Output Capacitance (Typ. C  
100% Avalanche Tested  
= 722 pF)  
oss(eff.)  
These Devices are PbFree and are RoHS Compliant  
G
D
S
Applications  
TO220  
CASE 340AT  
Telecom / Server Power Supplies  
Industrial Power Supplies  
EV Charger  
MARKING DIAGRAM  
UPS / Solar  
$Y&Z&3&K  
NTP082  
N65S3HF  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
NTP082N65S3HF = Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
September, 2019 Rev. 1  
NTP082N65S3HF/D  
NTP082N65S3HF  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)  
C
Symbol  
Parameter  
Value  
650  
Unit  
V
V
DSS  
V
GSS  
Drain to Source Voltage  
Gate to Source Voltage  
DC  
30  
V
AC (f > 1 Hz)  
30  
I
D
Drain Current  
Continuous (T = 25°C)  
40  
A
C
Continuous (T = 100°C)  
25.5  
100  
C
I
Drain Current  
Pulsed (Note 1)  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy (Note 2)  
Avalanche Current (Note 2)  
Repetitive Avalanche Energy (Note 1)  
MOSFET dv/dt  
510  
AS  
AS  
I
4.8  
E
3.13  
100  
mJ  
V/ns  
AR  
dv/dt  
Peak Diode Recovery dv/dt (Note 3)  
Power Dissipation  
50  
P
(T = 25°C)  
313  
W
W/°C  
°C  
D
C
Derate Above 25°C  
2.5  
T , T  
Operating and Storage Temperature Range  
55 to +150  
300  
J
STG  
T
Maximum Lead Temperature for Soldering, 1/8from Case for 5 seconds  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: pulsewidth limited by maximum junction temperature.  
2. I = 4.8 A, R = 25 W, starting T = 25°C.  
AS  
G
J
3. I 20 A, di/dt 200 A/ms, V 400 V, starting T = 25°C.  
SD  
DD  
J
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
0.4  
Unit  
R
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
_C/W  
q
JC  
JA  
R
62.5  
q
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Packing Method  
Reel Size  
Tape Width  
N/A  
Quantity  
NTP082N65S3HF  
NTP082N65S3HF  
TO220  
Tube  
N/A  
50 Units  
www.onsemi.com  
2
 
NTP082N65S3HF  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
650  
700  
V
V
V
V
I
= 0 V, I = 1 mA, T = 25_C  
DSS  
GS  
D
J
= 0 V, I = 1 mA, T = 150_C  
GS  
D
J
DBV  
/ DT  
Breakdown Voltage Temperature  
Coefficient  
= 10 mA, Referenced to 25_C  
0.7  
V/_C  
DSS  
J
D
I
Zero Gate Voltage Drain Current  
V
DS  
V
DS  
V
GS  
= 650 V, V = 0 V  
10  
mA  
DSS  
GS  
= 520 V, T = 125_C  
124  
C
I
Gate to Body Leakage Current  
=
30 V, V = 0 V  
100  
nA  
GSS  
DS  
ON CHARACTERISTICS  
V
Gate Threshold Voltage  
V
GS  
V
GS  
V
DS  
= V , I = 4 mA  
3.0  
5.0  
82  
V
mW  
S
GS(th)  
DS(on)  
DS  
D
R
Static Drain to Source On Resistance  
Forward Transconductance  
= 10 V, I = 20 A  
70  
24  
D
g
FS  
= 20 V, I = 20 A  
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 400 V, V = 0 V, f = 1 MHz  
3410  
70  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
W
iss  
DS  
GS  
C
Output Capacitance  
oss  
C
Effective Output Capacitance  
Energy Related Output Capacitance  
Total Gate Charge at 10 V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance  
V
DS  
V
DS  
V
DS  
= 0 V to 400 V, V = 0 V  
722  
126  
81  
oss(eff.)  
GS  
C
= 0 V to 400 V, V = 0 V  
GS  
oss(er.)  
Q
= 400 V, I = 20 A, V = 10 V  
D GS  
g(tot)  
(Note 4)  
Q
24  
gs  
Q
32  
gd  
ESR  
f = 1 MHz  
1.9  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
V
= 400 V, I = 20 A, V = 10 V  
26  
21  
80  
4.0  
ns  
ns  
ns  
ns  
d(on)  
DD  
g
D
GS  
R = 3 W  
t
r
(Note 4)  
t
d(off)  
t
f
SOURCE-DRAIN DIODE CHARACTERISTICS  
I
Maximum Continuous Source to Drain Diode Forward Current  
Maximum Pulsed Source to Drain Diode Forward Current  
40  
100  
1.3  
A
A
S
I
SM  
V
SD  
Source to Drain Diode Forward Voltage  
Reverse Recovery Time  
V
V
= 0 V, I = 20 A  
V
GS  
SD  
t
rr  
= 400 V, I = 20 A,  
108  
410  
ns  
nC  
DD  
SD  
dI /dt = 100 A/ms  
F
Q
Reverse Recovery Charge  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
3
 
NTP082N65S3HF  
TYPICAL PERFORMANCE CHARACTERISTICS  
200  
100  
200  
V
GS  
=10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
5.5 V  
V
= 20 V  
DS  
250 ms Pulse Test  
100  
10  
1
10  
1
150°C  
25°C  
55°C  
250 ms Pulse Test  
= 25°C  
T
C
0.1  
0.1  
1
10  
20  
2
3
V
4
5
6
7
8
9
V
DS  
, DrainSource Voltage (V)  
, GateSource Voltage (V)  
GS  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
1000  
100  
10  
0.20  
0.15  
0.10  
0.05  
0.00  
V = 0 V  
GS  
250 ms Pulse Test  
T
C
= 25°C  
150°C  
25°C  
55°C  
1
V
= 10 V  
GS  
V
GS  
= 20 V  
0.1  
0.01  
0.001  
0.0  
0.5  
1.0  
1.5  
2.0  
0
20  
40  
60  
80  
100  
120  
V
SD  
, Body Diode Forward Voltage (V)  
I , Drain Current (A)  
D
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current and  
Temperature  
Figure 3. OnResistance Variation vs.  
Drain Current and Gate Voltage  
10  
8
100000  
10000  
1000  
100  
I
D
= 20 A  
C
iss  
V
DS  
= 130 V  
V
DS  
= 400 V  
6
C
oss  
4
10  
V
GS  
= 0 V  
f = 1 MHz  
C
2
rss  
C
C
C
= C + C (C = shorted)  
iss  
gs  
gd  
ds  
1
= C + C  
oss  
rss  
ds  
gd  
= C  
gd  
0.1  
0.1  
0
0
20  
g
40  
60  
80  
100  
1
10  
100  
1000  
Q , Total Gate Charge (nC)  
V
DS  
, DrainSource Voltage (V)  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
www.onsemi.com  
4
NTP082N65S3HF  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
1.2  
1.1  
1.0  
0.9  
0.8  
3.0  
V
I
= 0 V  
= 10 mA  
V
I
= 10 V  
= 20 A  
GS  
GS  
D
D
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
50  
50  
100  
150  
0
50  
0
50  
100  
150  
T , Junction Temperature (5C)  
J
T , Junction Temperature (5C)  
J
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. OnResistance Variation  
vs. Temperature  
50  
40  
30  
20  
10  
0
200  
100  
30 ms  
100 ms  
10 ms 1 ms  
DC  
10  
1
Operation in this Area  
is Limited by R  
DS(on)  
T
C
= 25°C  
T = 150°C  
J
Single Pulse  
0.1  
150  
1
10  
100  
1000  
25  
50  
75  
100  
125  
T , Case Temperature (5C)  
V
DS  
, DrainSource Voltage (V)  
C
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
20  
16  
12  
8
4
0
0
130  
DS  
260  
390  
520  
650  
V
, Drain to Source Voltage (V)  
Figure 11. EOSS vs. Drain to Source Voltage  
www.onsemi.com  
5
NTP082N65S3HF  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
2
1
DUTY CYCLE DESCENDING ORDER  
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
P
0.1  
0.01  
DM  
t
1
t
2
Z
q
(t) = r(t) x R  
q
JC  
JC  
R
= 0.4°C/W  
q
JC  
Peak T = P  
Duty Cycle, D = t / t  
100  
x Z (t) + T  
q
JC C  
J
DM  
SINGLE PULSE  
104  
1
2
0.001  
105  
103  
102  
101  
101  
102  
t, Rectangular Pulse Duration (sec)  
Figure 12. Transient Thermal Response Curve  
www.onsemi.com  
6
NTP082N65S3HF  
V
GS  
R
Q
g
L
V
DS  
Q
Q
gs  
gd  
V
GS  
DUT  
I
G
= Const.  
Charge  
Figure 13. Gate Charge Test Circuit & Waveform  
R
L
V
DS  
GS  
90%  
90%  
10%  
90%  
V
DS  
V
DD  
V
GS  
R
G
10%  
V
DUT  
V
GS  
t
t
d(off)  
t
r
t
f
d(on)  
t
on  
t
off  
Figure 14. Resistive Switching Test Circuit & Waveforms  
L
2
1
2
EAS  
+
@ LIAS  
V
DS  
BV  
DSS  
I
D
I
AS  
R
G
V
DD  
I (t)  
D
DUT  
V
DD  
V
GS  
V
DS  
(t)  
t
p
Time  
t
p
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
7
NTP082N65S3HF  
+
DUT  
V
DS  
I
SD  
L
Driver  
R
G
Same Type  
as DUT  
V
DD  
V
GS  
dv/dt controlled by R  
G
I controlled by pulse period  
SD  
Gate Pulse Width  
D +  
Gate Pulse Period  
V
GS  
10 V  
(Driver)  
I
, Body Diode Forward Current  
FM  
I
di/dt  
SD  
(DUT)  
I
RM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V
DS  
V
DD  
V
SD  
(DUT)  
Body Diode  
Forward Voltage Drop  
Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
SUPERFET and FRFET are a registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United  
States and/or other countries.  
www.onsemi.com  
8
NTP082N65S3HF  
TO2203LD  
CASE 340AT  
ISSUE A  
www.onsemi.com  
9
NTP082N65S3HF  
SUPERFET and FRFET are a registered trademark and SyncFET is a trademark of Semiconductor Components Industries, LLC (SCILLC) or  
its subsidiaries in the United States and/or other countries.  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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NTP082N65S3HF/D  

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