NTTFS002N04CLTAG [ONSEMI]

功率 MOSFET,40 V,2.2mOhm,142A,单 N 沟道;
NTTFS002N04CLTAG
型号: NTTFS002N04CLTAG
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,40 V,2.2mOhm,142A,单 N 沟道

脉冲 光电二极管 晶体管
文件: 总9页 (文件大小:359K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NTTFS002N04CL  
MOSFET – Power, Single,  
N-Channel  
40 V, 2.2 mW, 142 A  
Features  
www.onsemi.com  
Small Footprint (3.3 x 3.3 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
These Devices are PbFree and are RoHS Compliant  
2.2 mW @ 10 V  
3.5 mW @ 4.5 V  
40 V  
142 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
NChannel  
D (5 8)  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
142  
80  
A
C
D
q
JC  
T
C
(Notes 1, 2, 3, 4)  
Steady  
State  
Power Dissipation  
T
C
P
85  
W
A
G (4)  
D
R
(Notes 1, 2, 3)  
q
JC  
T
C
= 100°C  
27  
S (1, 2, 3)  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
28  
q
JA  
T = 100°C  
A
20  
(Notes 1, 3, 4)  
Steady  
State  
MARKING DIAGRAM  
Power Dissipation  
T = 25°C  
A
P
3.2  
1.6  
706  
W
D
1
R
(Notes 1, 3)  
q
JA  
S
S
S
G
D
D
D
D
T = 100°C  
A
1
XXXX  
AYWWG  
G
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
WDFN8  
(m8FL)  
CASE 511DY  
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
70.4  
268  
A
S
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 10.2 A)  
L(pk)  
WW  
G
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
1.8  
Unit  
JunctiontoCase Steady State (Note 3)  
JunctiontoAmbient Steady State (Note 3)  
R
°C/W  
q
JC  
R
46.5  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Continuous DC current rating. Maximum current for pulses as long as 1  
second is higher but is dependent on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
June, 2019 Rev. 0  
NTTFS002N04CL/D  
 
NTTFS002N04CL  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
Zero Gate Voltage Drain Current  
V
V
= 0 V, I = 250 mA  
40  
V
(BR)DSS  
GS  
D
I
T = 25°C  
10  
mA  
DSS  
J
V
= 0 V,  
= 40 V  
GS  
DS  
V
T = 125°C  
J
250  
100  
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 5)  
Gate Threshold Voltage  
I
V
V
V
= 0 V, V = 20 V  
nA  
GSS  
DS  
GS  
V
= V , I = 90 mA  
1.2  
2.0  
2.2  
3.5  
135  
V
GS(TH)  
GS  
DS  
D
DraintoSource On Resistance  
R
V
= 10 V, I = 50 A  
1.8  
2.8  
mW  
DS(on)  
GS  
D
= 4.5 V, I = 50 A  
GS  
D
Forward Transconductance  
CHARGES AND CAPACITANCES  
Input Capacitance  
g
FS  
V
= 15 V, I = 50 A  
S
DS  
D
C
2940  
1260  
47  
pF  
iss  
V
GS  
= 0 V, f = 1.0 MHz,  
Output Capacitance  
C
oss  
V
DS  
= 25 V  
Reverse Transfer Capacitance  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Total Gate Charge  
C
rss  
Q
5.3  
nC  
G(TH)  
Q
9.6  
V
V
= 10 V, V = 20 V, I = 50 A  
DS D  
GS  
GD  
GS  
Q
7.4  
Q
= 10 V, V = 20 V, I = 50 A  
49  
nC  
ns  
G(TOT)  
GS  
DS  
D
SWITCHING CHARACTERISTICS (Note 6)  
TurnOn Delay Time  
Rise Time  
t
14  
77  
70  
22  
d(on)  
t
r
V
GS  
= 10 V, V = 20 V,  
DS  
I
D
= 50 A  
TurnOff Delay Time  
Fall Time  
t
d(off)  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
T = 25°C  
0.84  
0.72  
54  
1.2  
V
SD  
J
V
= 0 V,  
GS  
S
I
= 50 A  
T = 125°C  
J
Reverse Recovery Time  
Charge Time  
t
ns  
RR  
t
t
24  
a
V
GS  
= 0 V, dl /dt = 100 A/ms,  
S
I
S
= 50 A  
Discharge Time  
30  
b
Reverse Recovery Charge  
Q
43  
nC  
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
5. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.  
6. Switching characteristics are independent of operating junction temperatures.  
www.onsemi.com  
2
 
NTTFS002N04CL  
TYPICAL CHARACTERISTICS  
210  
210  
180  
150  
120  
90  
4.2 V  
4.0 V  
V
GS  
= 10 V to 4.5 V  
V
DS  
= 10 V  
180  
150  
120  
90  
3.8 V  
3.6 V  
3.4 V  
3.2 V  
T = 25°C  
J
60  
60  
3.0 V  
2.8 V  
30  
0
30  
0
T = 125°C  
J
T = 55°C  
J
0
1
2
3
0
1
2
3
4
5
6
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
5
4
3
2
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
T = 25°C  
D
T = 25°C  
J
J
I
= 50 A  
V
= 4.5 V  
= 10 V  
GS  
V
GS  
1
0
1.5  
1.0  
3
4
5
6
7
8
9
10  
10  
30  
50  
70  
90  
110  
130  
150  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. GatetoSource  
Figure 4. OnResistance vs. Drain Current and  
Voltage  
Gate Voltage  
1M  
100K  
10K  
1K  
2.0  
V
I
= 10 V  
= 50 A  
GS  
1.8  
1.6  
T = 175°C  
J
D
T = 150°C  
J
T = 125°C  
J
1.4  
1.2  
T = 85°C  
J
100  
1.0  
10  
1
0.8  
0.6  
T = 25°C  
J
50 25  
0
25  
50  
75 100 125 150 175  
5
10  
15  
20  
25  
30  
35  
40  
T , JUNCTION TEMPERATURE (°C)  
J
V
, DRAINTOSOURCE VOLTAGE (V)  
DS  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Voltage  
www.onsemi.com  
3
NTTFS002N04CL  
TYPICAL CHARACTERISTICS  
10K  
10  
C
ISS  
9
8
7
C
OSS  
1K  
6
5
4
3
100  
Q
Q
GD  
GS  
C
RSS  
10  
1
V
DS  
= 20 V  
2
V
= 0 V  
GS  
T = 25°C  
J
T = 25°C  
J
1
0
I
D
= 50 A  
f = 1 MHz  
0
5
10  
15  
20  
25  
30  
35  
40  
0
5
10 15 20  
25 30 35  
40 45 50  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
G
Figure 7. Capacitance Variation  
Figure 8. GatetoSource Voltage vs. Total  
Charge  
1000  
100  
100  
10  
V
GS  
= 0 V  
t
r
t
t
d(off)  
t
f
10  
1
d(on)  
1
V
V
= 10 V  
= 20 V  
= 50 A  
GS  
T = 125°C  
J
T = 25°C  
J
T = 55°C  
J
DS  
I
D
0.1  
1
10  
R , GATE RESISTANCE (W)  
100  
0.3  
0.4  
0.5  
, SOURCETODRAIN VOLTAGE (V)  
SD  
0.6  
0.7  
0.8  
0.9  
1.0  
V
G
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
100  
1000  
100  
10  
T
= 25°C  
J(initial)  
10  
T
C
= 25°C  
Single Pulse  
10 V  
10 ms  
V
GS  
0.5 ms  
1 ms  
10 ms  
T
= 100°C  
J(initial)  
1
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
0.1  
1
0.1  
1
10  
100  
1000  
0.00001  
0.0001  
0.001  
0.01  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
TIME IN AVALANCHE (s)  
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. IPEAK vs. Time in Avalanche  
www.onsemi.com  
4
NTTFS002N04CL  
TYPICAL CHARACTERISTICS  
100  
10  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.1  
Single Pulse  
0.01  
0.000001 0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 13. Thermal Characteristics  
DEVICE ORDERING INFORMATION  
Device  
Marking  
Package  
WDFN8  
Shipping  
NTTFS002N04CLTAG  
02NL  
1500 / Tape & Reel  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
5
NTTFS002N04CL  
PACKAGE DIMENSIONS  
WDFN8 3.3x3.3, 0.65P  
CASE 511DY  
ISSUE A  
www.onsemi.com  
6
NTTFS002N04CL  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NTTFS002N04CL/D  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
WDFN8 3.3x3.3, 0.65P  
CASE 511DY  
ISSUE A  
DATE 21 AUG 2018  
GENERIC  
MARKING DIAGRAM*  
XXXX  
AYWW  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year Code  
WW = Work Week Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb−Free indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON90827G  
WDFN8 3.3x3.3, 0.65P  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
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