NUP2125_16 [ONSEMI]

Dual Line CAN Bus Protector;
NUP2125_16
型号: NUP2125_16
厂家: ONSEMI    ONSEMI
描述:

Dual Line CAN Bus Protector

文件: 总4页 (文件大小:61K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NUP2125, SZNUP2125  
Dual Line CAN  
Bus Protector  
The SZ/NUP2125 has been designed to protect the CAN transceiver  
from ESD and other harmful transient voltage events. This device  
provides bidirectional protection for each data line with a single  
compact SC−70 (SOT−323) package, giving the system designer a low  
cost option for improving system reliability and meeting stringent  
EMI requirements.  
www.onsemi.com  
MARKING  
DIAGRAM  
Features  
SC−70  
CASE 419  
STYLE 4  
25MG  
200 W Peak Power Dissipation per Line (8 x 20 msec Waveform)  
Diode Capacitance Matching  
Low Reverse Leakage Current (< 100 nA)  
IEC Compatibility: − IEC 61000−4−2 (ESD): Level 4  
− IEC 61000−4−4 (EFT): 50 A – 5/50 ns  
− IEC 61000−4−5 (Lighting) 3.0 A (8/20 ms)  
ISO 7637−1, Nonrepetitive EMI Surge Pulse 2, 8.0 A  
(1 x 50 ms)  
G
1
25  
M
G
= Specific Device Code  
= Date Code  
= Pb−Free Package  
(Note: Microdot may be in either location)  
PIN 1  
ISO 7637−3, Repetitive Electrical Fast Transient (EFT)  
EMI Surge Pulses, 50 A (5 x 50 ns)  
PIN 3  
PIN 2  
Flammability Rating UL 94 V−0  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
CAN_H  
CAN_L  
CAN  
Transceiver  
CAN Bus  
These are Pb−Free Devices  
Applications  
NUP2125  
Automotive Networks  
CAN / CAN−FD  
Low and High−Speed CAN  
Fault Tolerant CAN  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
September, 2016 − Rev. 1  
NUP2125/D  
NUP2125, SZNUP2125  
MAXIMUM RATINGS (T = 25°C, unless otherwise specified)  
J
Symbol  
Rating  
Value  
200  
Unit  
W
PPK  
Peak Power Dissipation, 8 x 20 ms Double Exponential Waveform (Note 1)  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
−55 to 150  
−55 to 150  
260  
°C  
T
J
°C  
T
L
Lead Solder Temperature (10 s)  
°C  
ESD  
Human Body Model (HBM)  
Machine Model (MM)  
IEC 61000−4−2 Contact  
IEC 61000−4−2 Air  
ISO 10605 150 pF / 2 kW Contact  
ISO 10605 330 pF / 2 kW Contact  
8.0  
1.6  
30  
30  
30  
30  
kV  
kV  
kV  
kV  
kV  
kV  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Non−repetitive current pulse per Figure 1.  
ELECTRICAL CHARACTERISTICS (T = 25°C, unless otherwise specified)  
J
Symbol  
Parameter  
Reverse Working Voltage  
Breakdown Voltage  
Test Conditions  
Min  
24  
26.2  
Typ  
Max  
Unit  
V
V
RWM  
(Note 2)  
I = 1 mA (Note 3)  
V
BR  
28.5  
15  
32  
V
T
I
R
Reverse Leakage Current  
Clamping Voltage  
V
RWM  
= 24 V  
100  
36.6  
nA  
V
V
C
I
PP  
= 1 A (8/20 ms Waveform)  
33.4  
(Note 4)  
V
C
Clamping Voltage  
I
PP  
= 3 A (8/20 ms Waveform)  
44  
50  
V
(Note 4)  
I
Maximum Peak Pulse Current  
Capacitance  
8/20 ms Waveform (Note 4)  
3.0  
10  
2
A
pF  
%
PP  
C
V
R
V
R
= 0 V, f = 1 MHz (Line to GND)  
= 0 V, 5 MHz (Note 5)  
J
DC  
Diode Capacitance Matching  
0.26  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. TVS devices are normally selected according to the working peak reverse voltage (V  
or continuous peak operating voltage level.  
), which should be equal or greater than the DC  
RWM  
3. V is measured at pulse test current I .  
BR  
T
4. Pulse waveform per Figure 1.  
5. DC is the percentage difference between C of lines 1 and 2 measured according to the test conditions given in the electrical characteristics  
J
table.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NUP2125WTT1G  
3000 / Tape & Reel  
SZNUP2125WTT1G*  
NUP2125WTT3G  
SC−70  
(Pb−Free)  
10000 / Tape & Reel  
SZNUP2125WTT3G*  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP  
Capable.  
www.onsemi.com  
2
 
NUP2125, SZNUP2125  
TYPICAL PERFORMANCE CURVES  
(T = 25°C unless otherwise noted)  
J
3.5  
110  
100  
90  
WAVEFORM  
PARAMETERS  
3.0  
2.5  
2.0  
1.5  
1.0  
t = 8 ms  
r
80  
t = 20 ms  
d
c−t  
70  
60  
50  
t = I /2  
d
PP  
40  
30  
20  
10  
0
0.5  
0.0  
0
5
10  
15  
t, TIME (ms)  
20  
25  
30  
30  
35  
40  
45  
50  
V , CLAMPING VOLTAGE (V)  
C
Figure 1. Pulse Waveform, 8 × 20 ms  
Figure 2. Clamping Voltage vs Peak Pulse Current  
50  
9
8
7
45  
40  
35  
30  
25  
20  
15  
10  
5
125°C  
25°C  
6
5
4
3
2
25°C  
65°C  
125°C  
T = −55°C  
A
0
20  
22  
24  
26  
28  
30  
32  
34  
0
5
10  
15  
20  
25  
V , REVERSE VOLTAGE (V)  
R
V
BR  
, VOLTAGE (V)  
Figure 4. VBR versus IT Characteristics  
Figure 3. Typical Junction Capacitance vs  
Reverse Voltage  
120  
100  
80  
60  
40  
20  
0
25  
20  
15  
10  
5
−55°C  
+25°C  
T = +150°C  
A
0
−60  
−30  
0
30  
60  
90  
120  
150 180  
0
1
2
3
4
5
I , LEAKAGE CURRENT (nA)  
L
TEMPERATURE (°C)  
Figure 5. IR versus Temperature Characteristics  
Figure 6. Temperature Power Dissipation Derating  
www.onsemi.com  
3
NUP2125, SZNUP2125  
PACKAGE DIMENSIONS  
SC−70 (SOT−323)  
CASE 419−04  
ISSUE N  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
D
e1  
MILLIMETERS  
INCHES  
DIM  
A
A1  
A2  
b
c
D
E
e
MIN  
0.80  
0.00  
NOM  
0.90  
0.05  
0.70 REF  
0.35  
0.18  
2.10  
1.24  
1.30  
0.65 BSC  
MAX  
1.00  
0.10  
MIN  
0.032  
0.000  
NOM  
0.035  
0.002  
0.028 REF  
0.014  
0.007  
0.083  
0.049  
0.051  
0.026 BSC  
MAX  
0.040  
0.004  
3
E
H
E
1
2
0.30  
0.10  
1.80  
1.15  
1.20  
0.40  
0.25  
2.20  
1.35  
1.40  
0.012  
0.004  
0.071  
0.045  
0.047  
0.016  
0.010  
0.087  
0.053  
0.055  
b
e
e1  
L
H
E
0.38  
2.10  
0.015  
0.083  
0.20  
2.00  
0.56  
2.40  
0.008  
0.079  
0.022  
0.095  
STYLE 4:  
c
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
A
A2  
0.05 (0.002)  
L
A1  
SOLDERING FOOTPRINT*  
0.65  
0.025  
0.65  
0.025  
1.9  
0.075  
0.9  
0.035  
0.7  
0.028  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
Honeywell and SDS are registered trademarks of Honeywell International Inc.  
DeviceNet is a trademark of Rockwell Automation.  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
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PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
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Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NUP2125/D  

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