NUP4107UPMU [ONSEMI]
High Speed Data Line Protection;
| 型号： | NUP4107UPMU |
| 厂家： | 
ONSEMI |
| 描述： | High Speed Data Line Protection |
| 文件： | 总3页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NUP4107UPMU
Product Preview
Low Capacitance ESD
Protection Array for High
Speed Data Line Protection
The NUP4107UPMU ESD protection array is designed to protect
high speed data lines from ESD. Ultra−low capacitance and high level
of ESD protection makes this device well suited for use in USB 2.0
applications.
http://onsemi.com
4
5
6
Features
• Low Capacitance (< 2 pF Typical Between I/O Lines and Ground)
• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
• Protection for the Following IEC Standards:
IEC 61000−4−2 (12 kV Contact)
3
1
• UL Flammability Rating of 94 V−0
• This is a Pb−Free Device
MARKING
DIAGRAM
Typical Applications
• USB 2.0 Data Line and Power Line Protection
• MIDDI Ports
1
UDFN6 1.6x1.6
MU SUFFIX
CASE 517AP
6
XX MG
G
1
• SIM Ports
XX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
• Gigabit Ethernet
• Notebook Computers
(Note: Microdot may be in either location)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
−40 to +125
−55 to +150
260
Unit
°C
PIN CONNECTIONS
Operating Junction Temperature Range
Storage Temperature Range
T
J
6
5
4
T
stg
°C
I/O
V
I/O
NC
I/O
1
2
3
Lead Solder Temperature −
Maximum (10 Seconds)
T
L
°C
GND
BUS
I/O
Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 Contact (ESD)
ESD
16000
400
12000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
NUP4107UPMUTAG UDFN6 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
November, 2008 − Rev. P0
NUP4107UPMU/D
NUP4107UPMU
ELECTRICAL CHARACTERISTICS (T =25°C unless otherwise specified)
J
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Conditions
Min
Typ
Max
Unit
V
V
RWM
(Note 1)
I = 1 mA, (Note 2)
5.0
V
BR
6.0
V
T
Reverse Leakage Current
Junction Capacitance
Junction Capacitance
I
V
V
V
= 5 V
1.0
3.0
1.0
mA
pF
pF
R
RWM
C
= 0 V, f = 1 MHz between I/O Pins and GND
= 0 V, f = 1 MHz between I/O Pins
1.9
0.8
J
J
R
R
C
1. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
), which should be equal or greater than the DC
RWM
2. V is measured at pulse test current I .
BR
T
http://onsemi.com
2
NUP4107UPMU
PACKAGE DIMENSIONS
UDFN6, 1.6x1.6, 0.5P
CASE 517AP−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
A
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
B
2X
L
0.10
C
L1
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
E
DETAIL A
OPTIONAL
REFERENCE
MILLIMETERS
CONSTRUCTION
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
2X
A
0.10
C
MOLD CMPD
EXPOSED Cu
A3
b
D
E
0.13 REF
TOP VIEW
0.20
0.30
1.60 BSC
1.60 BSC
0.50 BSC
A3
A
(A3)
e
DETAIL B
D2 1.10
E2 0.45
1.30
0.65
−−−
0.40
0.15
0.05
0.05
C
C
A1
K
L
0.20
0.20
DETAIL B
OPTIONAL
6X
L1 0.00
CONSTRUCTION
SIDE VIEW
SEATING
PLANE
C
A1
SOLDERMASK DEFINED
MOUNTING FOOTPRINT*
DETAIL A
6X L
D2
1.26
3
1
E2
6X
6
5
0.52
0.61 1.90
6X K
6X b
0.10
0.05
C A B
e
NOTE 3
C
1
BOTTOM VIEW
0.50 PITCH
6X
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NUP4107UPMU/D
相关型号：
NUP4114HMR6
Transient Voltage Suppressors Low Capacitance ESD Protection for High Speed Data Lines
ONSEMI
NUP4114HMR6T1G
Transient Voltage Suppressors Low Capacitance ESD Protection for High Speed Data Lines
ONSEMI
©2020 ICPDF网 联系我们和版权申明