NV25640MUW3VTBG [ONSEMI]
EEPROM Serial 64-Kb SPI;
| 型号： | NV25640MUW3VTBG |
| 厂家： | 
ONSEMI |
| 描述： | EEPROM Serial 64-Kb SPI 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
| 文件： | 总13页 (文件大小：195K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NV25640WF
EEPROM Serial 64-Kb SPI
Automotive Grade 1
inꢀWettable Flank UDFN-8
Package
www.onsemi.com
Description
The NV25640 is a EEPROM Serial 64−Kb SPI Automotive Grade 1
device internally organized as 8Kx8 bits. This features a 64−byte page
write buffer and supports the Serial Peripheral Interface (SPI)
protocol. The device is enabled through a Chip Select (CS) input. In
addition, the required bus signals are clock input (SCK), data input
(SI) and data output (SO) lines. The HOLD input may be used to pause
any serial communication with the NV25640 device. The device
features software and hardware write protection, including partial as
well as full array protection.
1
UDFN8
(Wettable Flank)
MUW3 SUFFIX
CASE 517DH
Features
PIN CONFIGURATIONS
• Automotive Temperature Grade 1 (−40°C to +125°C)
• 10 MHz SPI Compatible
V
CS
SO
1
CC
HOLD
SCK
SI
• 2.5 V to 5.5 V Supply Voltage Range
• SPI Modes (0,0) & (1,1)
WP
V
SS
• 64−byte Page Write Buffer
• Self−timed Write Cycle
UDFN8 (MUW3)
(Top View)
• Hardware and Software Protection
• Block Write Protection
PIN FUNCTION
1
1
− Protect / , / or Entire EEPROM Array
4
2
Pin Name
Function
Chip Select
• Low Power CMOS Technology
• 1,000,000 Program/Erase Cycles
• 100 Year Data Retention
CS
SO
WP
Serial Data Output
Write Protect
• Wettable Flank UDFN 8−pad Package
V
SS
Ground
• This Device is Pb−Free, Halogen Free/BFR Free, and RoHS
SI
Serial Data Input
Serial Clock
Compliant
SCK
V
CC
HOLD
Hold Transmission Input
Power Supply
V
CC
SI
CS
NV25640WF
SO
WP
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
HOLD
SCK
V
SS
Figure 1. Functional Symbol
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
June, 2018 − Rev. 1
NV25640WF/D
NV25640WF
DEVICE MARKING
(UDFN8)
S6W
AWLYWG
G
S6W= Specific Device Code
A
= Assembly Location
WL = Wafer Lot Number
YW = Assembly Start Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameters
Ratings
Unit
°C
°C
V
Operating Temperature
−45 to +130
−65 to +150
−0.5 to +6.5
Storage Temperature
Voltage on any Pin with Respect to Ground (Note 1)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The DC input voltage on any pin should not be lower than −0.5 V or higher than V + 0.5 V. During transitions, the voltage on any pin may
CC
undershoot to no less than −1.5 V or overshoot to no more than V + 1.5 V, for periods of less than 20 ns.
CC
Table 2. RELIABILITY CHARACTERISTICS (Note 2)
Symbol
(Note 3)
Parameter
Min
1,000,000
100
Unit
Program / Erase Cycles
Years
N
Endurance
END
T
DR
Data Retention
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
3. Page Mode, V = 5 V, 25°C.
CC
Table 3. DC OPERATING CHARACTERISTICS (V = 2.5 V to 5.5 V, T = −40°C to +125°C, unless otherwise specified.)
CC
A
Symbol
Parameter
Supply Current (Read Mode)
Supply Current (Write Mode)
Standby Current
Test Conditions
Min
Max
Unit
mA
mA
mA
I
Read, V = 5.5 V, 5 MHz, SO open
2
3
2
CCR
CC
I
Write, V = 5.5 V, 5 MHz, SO open
CC
CCW
I
V
IN
= GND or V , CS = V
,
SB1
CC
CC
WP = V , V = 5.5 V
CC
CC
I
Standby Current
V
IN
= GND or V , CS = V
,
5
mA
SB2
CC
CC
WP = GND, V = 5.5 V
CC
I
Input Leakage Current
Output Leakage Current
V
= GND or V
CC
−2
−1
2
2
mA
mA
L
IN
I
CS = V
,
LO
CC
V
OUT
= GND or V
CC
V
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
−0.5
0.3 V
V
V
V
V
IL
CC
V
IH
0.7 V
V
CC
+ 0.5
CC
V
I
I
= 3.0 mA
0.4
OL1
OH1
OL
V
= −1.6 mA
V
− 0.8 V
OH
CC
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2
NV25640WF
Table 4. PIN CAPACITANCE (T = 25°C, f = 1.0 MHz, V = +5.0 V) (Note 2)
A
CC
Symbol
Test
Conditions
= 0 V
Min
Typ
Max
8
Unit
pF
C
Output Capacitance (SO)
V
OUT
OUT
C
Input Capacitance (CS, SCK, SI, WP, HOLD)
V
IN
= 0 V
8
pF
IN
Table 5. AC CHARACTERISTICS (T = −40°C to +125°C) (Note 4)
A
V
CC
= 2.5 V − 5.5 V
Min
DC
10
Max
Symbol
Parameter
Unit
f
Clock Frequency
Data Setup Time
Data Hold Time
SCK High Time
SCK Low Time
10
MHz
ns
ns
ns
ns
ns
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
SCK
t
SU
t
H
10
t
40
WH
t
40
WL
t
LZ
HOLD to Output Low Z
Input Rise Time
25
2
t
(Note 5)
(Note 5)
RI
t
Input Fall Time
2
FI
t
HOLD Setup Time
HOLD Hold Time
Output Valid from Clock Low
Output Hold Time
Output Disable Time
HOLD to Output High Z
CS High Time
0
HD
CD
t
10
t
V
35
t
0
HO
t
20
25
DIS
t
HZ
CS
t
40
30
30
20
20
10
10
t
CS Setup Time
CSS
CSH
CNS
CNH
WPS
WPH
t
t
CS Hold Time
CS Inactive Setup Time
CS Inactive Hold Time
WP Setup Time
t
t
t
WP Hold Time
t
(Note 6)
Write Cycle Time
5
WC
4. AC Test Conditions:
Input Pulse Voltages: 0.3 V to 0.7 V
CC
CC
Input rise and fall times: ≤ 10 ns
Input and output reference voltages: 0.5 V
CC
Output load: current source I
/I
; C = 30 pF
OL max OH max L
5. This parameter is tested initially and after a design or process change that affects the parameter.
6. t is the time from the rising edge of CS after a valid write sequence to the end of the internal write cycle.
WC
Table 6. POWER−UP TIMING (Notes 5, 7)
Symbol
Parameter
Max
1
Unit
ms
t
Power−up to Read Operation
Power−up to Write Operation
PUR
t
1
ms
PUW
7. t
and t
are the delays required from the time V is stable until the specified operation can be initiated.
PUR
PUW
CC
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3
NV25640WF
Pin Description
Functional Description
The NV25640 device supports the Serial Peripheral
Interface (SPI) bus protocol, modes (0,0) and (1,1). The
device contains an 8−bit instruction register. The instruction
set and associated op−codes are listed in Table 7.
Reading data stored in the NV25640 is accomplished by
simply providing the READ command and an address.
Writing to the NV25640, in addition to a WRITE command,
address and data, also requires enabling the device for
writing by first setting certain bits in a Status Register, as will
be explained later.
SI: The serial data input pin accepts op−codes, addresses
and data. In SPI modes (0,0) and (1,1) input data is latched
on the rising edge of the SCK clock input.
SO: The serial data output pin is used to transfer data out of
the device. In SPI modes (0,0) and (1,1) data is shifted out
on the falling edge of the SCK clock.
SCK: The serial clock input pin accepts the clock provided
by the host and used for synchronizing communication
between host and NV25640.
CS: The chip select input pin is used to enable/disable the
NV25640. When CS is high, the SO output is tri−stated (high
impedance) and the device is in Standby Mode (unless an
internal write operation is in progress). Every communication
session between host and NV25640 must be preceded by a
high to low transition and concluded with a low to high
transition of the CS input.
After a high to low transition on the CS input pin, the
NV25640 will accept any one of the six instruction op−codes
listed in Table 7 and will ignore all other possible 8−bit
combinations. The communication protocol follows the
timing from Figure 2.
Table 7. INSTRUCTION SET
Instruction
WREN
WRDI
Op−code
0000 0110
0000 0100
0000 0101
0000 0001
0000 0011
0000 0010
Operation
WP: The write protect input pin will allow all write
operations to the device when held high. When WP pin is
tied low and the WPEN bit in the Status Register (refer to
Status Register description, later in this Data Sheet) is set to
“1”, writing to the Status Register is disabled.
Enable Write Operations
Disable Write Operations
Read Status Register
Write Status Register
Read Data from Memory
Write Data to Memory
RDSR
WRSR
READ
HOLD: The HOLD input pin is used to pause transmission
between host and NV25640, without having to retransmit
the entire sequence at a later time. To pause, HOLD must be
taken low and to resume it must be taken back high, with the
SCK input low during both transitions. When not used for
WRITE
pausing, the HOLD input should be tied to V , either
CC
directly or through a resistor.
t
CS
CS
t
t
t
WL
CSS
WH
t
t
t
CNS
CNH
CSH
SCK
SI
t
H
t
RI
t
FI
t
SU
VALID
IN
t
V
t
V
t
DIS
t
HO
HI−Z
HI−Z
VALID
OUT
SO
Figure 2. Synchronous Data Timing
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4
NV25640WF
Status Register
The Status Register, as shown in Table 8, contains a
number of status and control bits.
allowed to protect a quarter, one half or the entire memory,
by setting these bits according to Table 9. The protected
blocks then become read−only.
The RDY (Ready) bit indicates whether the device is busy
with a write operation. This bit is automatically set to 1 during
an internal write cycle, and reset to 0 when the device is ready
to accept commands. For the host, this bit is read only.
The WEL (Write Enable Latch) bit is set/reset by the
WREN/WRDI commands. When set to 1, the device is in a
Write Enable state and when set to 0, the device is in a Write
Disable state.
The WPEN (Write Protect Enable) bit acts as an enable for
the WP pin. Hardware write protection is enabled when the
WP pin is low and the WPEN bit is 1. This condition
prevents writing to the status register and to the block
protected sections of memory. While hardware write
protection is active, only the non−block protected memory
can be written. Hardware write protection is disabled when
the WP pin is high or the WPEN bit is 0. The WPEN bit, WP
pin and WEL bit combine to either permit or inhibit Write
operations, as detailed in Table 10.
The BP0 and BP1 (Block Protect) bits determine which
blocks are currently write protected. They are set by the user
with the WRSR command and are non−volatile. The user is
Table 8. STATUS REGISTER
7
6
0
5
0
4
0
3
2
1
0
WPEN
BP1
BP0
WEL
RDY
Table 9. BLOCK PROTECTION BITS
Status Register Bits
BP1
BP0
Array Address Protected
None
Protection
0
0
1
1
0
1
0
1
No Protection
1800−1FFF
Quarter Array Protection
Half Array Protection
Full Array Protection
1000−1FFF
0000−1FFF
Table 10. WRITE PROTECT CONDITIONS
WPEN
WP
X
WEL
Protected Blocks
Protected
Unprotected Blocks
Protected
Status Register
Protected
Writable
0
0
1
1
X
X
0
1
0
1
0
1
X
Protected
Writable
Low
Low
High
High
Protected
Protected
Protected
Protected
Protected
Writable
Protected
Writable
Protected
Protected
Protected
Writable
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5
NV25640WF
WRITE OPERATIONS
Write Enable and Write Disable
The NV25640 device powers up into a write disable state.
The device contains a Write Enable Latch (WEL) which
must be set before attempting to write to the memory array
or to the status register. In addition, the address of the
memory location(s) to be written must be outside the
protected area, as defined by BP0 and BP1 bits from the
status register.
The internal Write Enable Latch and the corresponding
Status Register WEL bit are set by sending the WREN
instruction to the NV25640. Care must be taken to take the
CS input high after the WREN instruction, as otherwise the
Write Enable Latch will not be properly set. WREN timing
is illustrated in Figure 3. The WREN instruction must be
sent prior to any WRITE or WRSR instruction.
The internal write enable latch is reset by sending the
WRDI instruction as shown in Figure 4. Disabling write
operations by resetting the WEL bit, will protect the device
against inadvertent writes.
CS
SCK
1
1
0
SI
0
0
0
0
0
HIGH IMPEDANCE
SO
Dashed Line = mode (1, 1)
Figure 3. WREN Timing
CS
SCK
1
0
0
SI
0
0
0
0
0
HIGH IMPEDANCE
SO
Dashed Line = mode (1, 1)
Figure 4. WRDI Timing
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6
NV25640WF
Byte Write
Page Write
Once the WEL bit is set, the user may execute a write
sequence, by sending a WRITE instruction, a 16−bit address
and data as shown in Figure 5. Only 13 significant address
bits are used by the NV25640. The rest are don’t care bits,
as shown in Table 11. Internal programming will start after
the low to high CS transition. During an internal write cycle,
all commands, except for RDSR (Read Status Register) will
be ignored. The RDY bit will indicate if the internal write
cycle is in progress (RDY high), or the device is ready to
accept commands (RDY low).
After sending the first data byte to the NV25640, the host
may continue sending data, up to a total of 64 bytes,
according to timing shown in Figure 6. After each data byte,
the lower order address bits are automatically incremented,
while the higher order address bits (page address) remain
unchanged. If during this process the end of page is
exceeded, then loading will “roll over” to the first byte in the
page, thus possibly overwriting previously loaded data.
Following completion of the write cycle, the NV25640 is
automatically returned to the write disable state.
Table 11. BYTE ADDRESS
Device
Address Significant Bits
Address Don’t Care Bits
# Address Clock Pulses
NV25640
A12 − A0
A15 − A13
16
CS
0
1
2
3
4
5
6
7
8
21 22 23 24 25 26 27 28 29 30 31
SCK
OPCODE
DATA IN
BYTE ADDRESS*
D7 D6 D5 D4 D3 D2 D1 D0
SI
0
0
0
0
0
0
1
0
A
N
A
0
HIGH IMPEDANCE
Dashed Line = mode (1, 1)
SO
* Please check the Byte Address Table (Table 11)
Figure 5. Byte WRITE Timing
CS
24+(N−1)x8−1 .. 24+(N−1)x8
21 22 23 24−31 32−39
0
1
2
3
4
5
6
7
8
24+Nx8−1
SCK
SI
Data Byte N
7..1
BYTE ADDRESS*
OPCODE
DATA IN
A
N
A
0
0
0
0
0
0
0
1
0
0
Data Data Data
Byte 1 Byte 2 Byte 3
HIGH IMPEDANCE
SO
Dashed Line = mode (1, 1)
* Please check the Byte Address Table (Table 11)
Figure 6. Page WRITE Timing
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7
NV25640WF
Write Status Register
Write Protection
The Status Register is written by sending a WRSR
instruction according to timing shown in Figure 7. Only bits
2, 3 and 7 can be written using the WRSR command.
The Write Protect (WP) pin can be used to protect the
Block Protect bits BP0 and BP1 against being inadvertently
altered. When WP is low and the WPEN bit is set to “1”,
write operations to the Status Register are inhibited. WP
going low while CS is still low will interrupt a write to the
status register. If the internal write cycle has already been
initiated, WP going low will have no effect on any write
operation to the Status Register. The WP pin function is
blocked when the WPEN bit is set to “0”. The WP input
timing is shown in Figure 8.
CS
0
1
2
3
4
5
6
7
1
8
9
6
10
5
11
4
12
13
2
14
1
15
0
SCK
SI
OPCODE
0
DATA IN
3
0
0
0
0
0
0
7
MSB
HIGH IMPEDANCE
Dashed Line = mode (1, 1)
SO
Figure 7. WRSR Timing
t
t
WPH
WPS
CS
SCK
WP
WP
Dashed Line = mode (1, 1)
Figure 8. WP Timing
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8
NV25640WF
READ OPERATIONS
Read from Memory Array
address, and the read cycle can be continued indefinitely.
The read operation is terminated by taking CS high.
To read from memory, the host sends a READ instruction
followed by a 16−bit address (see Table 11 for the number
of significant address bits).
Read Status Register
To read the status register, the host simply sends a RDSR
command. After receiving the last bit of the command, the
NV25640 will shift out the contents of the status register on
the SO pin (Figure 10). The status register may be read at
any time, including during an internal write cycle. While the
internal write cycle is in progress, the RDSR command will
output the contents of the status register.
After receiving the last address bit, the NV25640 will
respond by shifting out data on the SO pin (as shown in
Figure 9). Sequentially stored data can be read out by simply
continuing to run the clock. The internal address pointer is
automatically incremented to the next higher address as data
is shifted out. After reaching the highest memory address,
the address counter “rolls over” to the lowest memory
CS
20 21 22 23 24 25 26 27 28 29 30
0
1
2
3
4
5
6
7
8
9
10
SCK
SI
OPCODE
BYTE ADDRESS*
A
0
A
N
0
0
0
0
0
0
1
1
DATA OUT
HIGH IMPEDANCE
SO
7
6
5
4
3
2
1
0
Dashed Line = mode (1, 1)
* Please check the Byte Address Table (Table 11)
MSB
Figure 9. READ Timing
CS
0
1
2
3
4
5
1
6
0
7
1
8
9
10
11
12
13
14
SCK
OPCODE
0
0
0
0
0
SI
DATA OUT
3
HIGH IMPEDANCE
Dashed Line = mode (1, 1)
5
7
6
4
2
1
0
SO
MSB
Figure 10. RDSR Timing
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9
NV25640WF
Hold Operation
below the POR trigger level. This bi−directional POR
behavior protects the device against ‘brown−out’ failure
following a temporary loss of power.
The NV25640 device powers up in a write disable state
and in a low power standby mode. A WREN instruction
must be issued prior to any writes to the device.
After power up, the CS pin must be brought low to enter
a ready state and receive an instruction. After a successful
byte/page write or status register write, the device goes into
a write disable mode. The CS input must be set high after the
proper number of clock cycles to start the internal write
cycle. Access to the memory array during an internal write
cycle is ignored and programming is continued. Any invalid
op−code will be ignored and the serial output pin (SO) will
remain in the high impedance state.
The HOLD input can be used to pause communication
between host and NV25640. To pause, HOLD must be taken
low while SCK is low (Figure 11). During the hold condition
the device must remain selected (CS low). During the pause,
the data output pin (SO) is tri−stated (high impedance) and
SI transitions are ignored. To resume communication,
HOLD must be taken high while SCK is low.
Design Considerations
The NV25640 device incorporates Power−On Reset
(POR) circuitry which protects the internal logic against
powering up in the wrong state. The device will power up
into Standby mode after VCC exceeds the POR trigger level
and will power down into Reset mode when VCC drops
CS
t
t
CD
CD
SCK
t
HD
t
HD
HOLD
SO
t
HZ
HIGH IMPEDANCE
t
LZ
Dashed Line = mode (1, 1)
Figure 11. HOLD Timing
ORDERING INFORMATION (Notes 8 − 10)
†
Device Order Number
NV25640MUW3VTBG
Specific Device Marking
Package Type
Shipping
S6W
UDFN8
(Wettable Flank)
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
8. All packages are RoHS−compliant (Lead−free, Halogen−free).
9. The standard lead finish is NiPdAu.
10.For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
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10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN8 2x3, 0.5P
CASE 517DH
ISSUE O
1
SCALE 2:1
DATE 06 NOV 2015
NOTES:
A
B
E
D
L
L
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. FOR DEVICE OPN CONTAINING W OPTION,
DETAIL B ALTERNATE CONSTRUCTION IS
NOT APPLICABLE.
L1
DETAIL A
ALTERNATE
CONSTRUCTIONS
PIN ONE
INDICATOR
0.05 C
0.05 C
MILLIMETERS
A3
DIM MIN
MAX
0.55
0.05
EXPOSED Cu
MOLD CMPD
A
A1
A3
b
D
D2
E
E2
e
L
0.45
0.00
TOP VIEW
0.13 REF
0.20
0.30
DETAIL B
A1
2.00 BSC
A
1.30
1.50
0.10
0.08
C
C
DETAIL B
ALTERNATE
CONSTRUCTIONS
A3
C
3.00 BSC
1.30
1.50
0.50 BSC
0.30
−−−
0.50
0.15
A1
SIDE VIEW
L1
SEATING
PLANE
NOTE 4
GENERIC
MARKING DIAGRAM*
DETAIL A
D2
L
1
4
1
XXXXX
AWLYWG
E2
XXXXX = Specific Device Code
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
8
5
8X
W
G
= Work Week
= Pb−Free Package
b
e
M
0.10
C A
B
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
M
0.05
C
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
1.56
8X
0.68
1.55 3.40
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
98AON06579G
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
ON SEMICONDUCTOR STANDARD
REFERENCE:
DESCRIPTION: UDFN8 2X3, 0.5P
PAGE 1 OF2
DOCUMENT NUMBER:
98AON06579G
PAGE 2 OF 2
ISSUE
REVISION
DATE
06 NOV 2015
O
RELEASED FOR PRODUCTION. REQ. BY I. HYLAND.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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© Semiconductor Components Industries, LLC, 2015
Case Outline Number:
November, 2015 − Rev. O
517DH
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