NVBG070N120M3S [ONSEMI]

Silicon Carbide (SiC) MOSFET- EliteSiC, 70 mohm, 1200 V, M3S, D2PAK-7L;
NVBG070N120M3S
型号: NVBG070N120M3S
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) MOSFET- EliteSiC, 70 mohm, 1200 V, M3S, D2PAK-7L

文件: 总8页 (文件大小:224K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – EliteSiC,  
65ꢀmohm, 1200ꢀV, M3S,  
D2PAK-7L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
1200 V  
87 mW @ 18 V  
36 A  
Drain (TAB)  
NVBG070N120M3S  
Features  
Gate (Pin 1)  
Typ. R  
= 65 mW @ V = 18 V  
GS  
DS(on)  
Ultra Low Gate Charge (Q  
= 57 nC)  
G(tot)  
High Speed Switching with Low Capacitance (C = 57 pF)  
oss  
Driver Source (Pin 2)  
Power Source (Pins 3, 4, 5, 6, 7)  
100% Avalanche Tested  
AECQ101 Qualified and PPAP Capable  
NCHANNEL MOSFET  
This Device is Halide Free and RoHS Compliant with exemption 7a,  
PbFree 2LI (on second level interconnection)  
Typical Applications  
Automotive On Board Charger  
Automotive DC/DC Converter for EV/HEV  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
1200  
Unit  
V
D2PAK7L  
CASE 418BJ  
V
DSS  
GatetoSource Voltage  
V
GS  
10/+22  
3/+18  
V
Recommended Operation Values  
of GatetoSource Voltage  
T
< 175°C  
= 25°C  
V
GSop  
V
C
MARKING DIAGRAM  
Continuous Drain  
Current (Notes 2, 3)  
Steady  
State  
T
I
D
36  
172  
25  
A
W
A
C
BG070N  
120M3S  
AYWWZZ  
Power Dissipation  
(Note 2)  
P
D
Continuous Drain  
Current (Notes 2, 3)  
Steady  
State  
T
C
= 100°C  
I
D
BG070N120M3S = Specific Device Code  
A
Y
= Assembly Location  
= Year  
Power Dissipation  
(Note 2)  
P
86  
W
A
D
WW = Work Week  
ZZ  
Pulsed Drain Current  
(Note 4)  
T
C
= 25°C  
I
93  
DM  
= Lot Traceability  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
A
J
stg  
+175  
ORDERING INFORMATION  
Source Current (Body Diode)  
I
S
33  
91  
Device  
Package  
Shipping  
T
C
= 25°C, V = 3 V (Note 2)  
GS  
NVBG070N120M3S  
D2PAK7L  
800 / Tape  
& Reel  
Single Pulse DraintoSource Avalanche  
Energy (I = 13.5 A, L = 1 mH) (Note 5)  
E
AS  
mJ  
°C  
L(pk)  
Maximum Temperature for Soldering (10 s)  
T
L
270  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surface mounted on a FR4 board using1 in pad of 2 oz copper.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
3. The maximum current rating is based on typical RDS(on) performance.  
4. Repetitive rating, limited by max junction temperature.  
5. E of 91 mJ is based on starting T = 25°C; L = 1 mH, I = 13.5 A,  
AS  
DD  
J
AS  
V
= 100 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
March, 2023 Rev. 0  
NVBG070N120M3S/D  
 
NVBG070N120M3S  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Max  
0.87  
40  
Unit  
JunctiontoCase Steady State (Note 2)  
R
°C/W  
q
JC  
JunctiontoAmbient Steady State (Notes 1, 2)  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFFSTATE CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
= 0 V, I = 1 mA  
1200  
V
(BR)DSS  
GS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
I
D
= 1 mA, referenced to 25°C  
0.3  
V/°C  
(BR)DSS  
J
(Note 7)  
Zero Gate Voltage Drain Current  
GatetoSource Leakage Current  
ONSTATE CHARACTERISTICS  
Gate Threshold Voltage  
I
V
= 0 V, V = 1200 V  
100  
1
mA  
mA  
DSS  
GS  
DS  
I
V
= +22/10 V, V = 0 V  
GSS  
GS DS  
V
R
V
= V , I = 7 mA  
2.04  
3  
2.9  
4.4  
+18  
87  
V
V
GS(TH)  
GS  
DS  
D
Recommended Gate Voltage  
DraintoSource On Resistance  
V
GOP  
V
= 18 V, I = 15 A, T = 25°C  
65  
mW  
DS(on)  
GS  
D
J
V
GS  
= 18 V, I = 15 A, T = 175°C  
136  
D
J
(Note 7)  
Forward Transconductance  
g
FS  
V
DS  
= 10 V, I = 15 A (Note 7)  
12  
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
= 0 V, f = 1 MHz, V = 800 V  
1230  
57  
pF  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
C
RSS  
Reverse Transfer Capacitance  
Total Gate Charge  
5
Q
V
= 3/18 V, V = 800 V,  
57  
nC  
G(TOT)  
GS  
DS  
I
= 15 A  
D
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
GateResistance  
Q
3.2  
9.6  
17  
G(TH)  
Q
GS  
GD  
Q
R
f = 1 MHz  
4.2  
W
G
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
V
= 3/18 V,  
11  
12  
ns  
d(ON)  
GS  
V
= 800 V,  
= 15 A,  
= 4.7 W  
DS  
Rise Time  
t
r
I
D
R
G
TurnOff Delay Time  
t
30  
d(OFF)  
inductive load (Notes 6, 7)  
Fall Time  
t
f
8.8  
119  
36  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
ON  
mJ  
E
OFF  
E
tot  
155  
SOURCEDRAIN DIODE CHARACTERISTICS  
Continuous SourceDrain Diode Forward  
I
V
= 3 V, T = 25°C  
33  
93  
A
V
SD  
GS  
C
Current (Note 2)  
(Note 7)  
Pulsed SourceDrain Diode Forward  
Current (Note 4)  
I
SDM  
Forward Diode Voltage  
V
V
GS  
= 3 V, I = 15 A, T = 25°C  
4.7  
SD  
SD  
J
www.onsemi.com  
2
NVBG070N120M3S  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified) (continued)  
J
Parameter  
SOURCEDRAIN DIODE CHARACTERISTICS  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge time  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
t
V
S
= 3/18 V, I = 15 A,  
15  
63  
ns  
nC  
mJ  
A
RR  
GS  
SD  
dI /dt = 1000 A/ms, V = 800 V  
DS  
Q
RR  
(Note 7)  
E
5.7  
8.6  
8.3  
6.3  
REC  
RRM  
I
t
A
t
B
ns  
ns  
Discharge time  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
6. E /E  
result is with body diode  
ON OFF  
7. Defined by design, not subject to production test.  
www.onsemi.com  
3
 
NVBG070N120M3S  
TYPICAL CHARACTERISTICS  
80  
60  
40  
2.0  
12 V  
V
GS  
= 20 V to 15 V  
1.5  
12 V  
V
= 15 V to 20 V  
GS  
1.0  
0.5  
20  
0
0
2
4
6
8
10  
0
4
5
20  
40  
I , DRAIN CURRENT (A)  
60  
80  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
2.5  
2.0  
1.5  
1.0  
500  
400  
300  
200  
I
V
= 15 A  
I
D
= 15 A  
D
= 18 V  
GS  
T = 150°C  
J
0.5  
0
100  
0
T = 25°C  
J
75 50 25  
0
25 50 75 100 125 150 175 200  
8
12  
16  
20  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 3. OnResistance Variation with  
Figure 4. OnResistance vs. GatetoSource  
Temperature  
Voltage  
50  
40  
30  
20  
160  
140  
120  
100  
80  
Etot  
R
V
V
= 4.7 W  
= 800 V  
= 18/3 V  
G
V
DS  
= 10 V  
DD  
GS  
Eon  
Eoff  
T
C
= 25°C  
60  
T = 175°C  
J
T = 25°C  
J
40  
10  
0
20  
0
T = 55°C  
J
0
5
10  
15  
20  
7
9
11  
13  
15  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , COLLECTOR CURRENT (A)  
D
Figure 5. Transfer Characteristics  
Figure 6. Switching Loss vs. Collector Current  
www.onsemi.com  
4
NVBG070N120M3S  
TYPICAL CHARACTERISTICS  
160  
140  
120  
100  
80  
150  
Etot  
V
I
= 800 V  
= 7.5 A  
= 18/3 V  
DD  
R
= 4.7 W  
= 15 A  
= 18/3 V  
G
Etot  
Eon  
D
I
D
V
GS  
V
GS  
Eon  
Eoff  
100  
60  
50  
0
40  
Eoff  
20  
0
600  
650  
700  
750  
800  
0
2
4
6
8
10  
60  
10  
V
, DRAINTOSOURCE VOLTAGE (V)  
R , GATE RESISTANCE (W)  
G
DD  
Figure 7. Switching Loss vs. DraintoSource  
Figure 8. Switching Loss vs. Gate Resistance  
Voltage  
200  
100  
18  
V
DD  
= 400 V  
V
= 3 V  
I
= 15 A  
GS  
D
15  
12  
V
= 800 V  
DD  
9
6
3
V
DD  
= 600 V  
T = 175°C  
J
10  
1
T = 25°C  
J
0
T = 55°C  
J
3  
0
2
4
6
8
10  
0
10  
20  
30  
40  
50  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Q , GATE CHARGE (nC)  
G
Figure 9. Reverse Drain Current vs. Body  
Diode Forward Voltage  
Figure 10. GatetoSource Voltage vs. Total  
Charge  
10K  
1K  
100  
C
ISS  
25°C  
150°C  
C
OSS  
RSS  
10  
100  
10  
1
C
f = 1 MHz  
= 0 V  
V
GS  
1
0.1  
1
10  
100  
800  
0.0001  
0.001  
0.01  
T , AVALANCHE TIME (ms)  
AV  
0.1  
1
V
, DRAINTOSOURCE VOLTAGE (V)  
DS  
Figure 11. Capacitance vs. DraintoSource  
Figure 12. Unclamped Inductive Switching  
Capability  
Voltage  
www.onsemi.com  
5
NVBG070N120M3S  
TYPICAL CHARACTERISTICS  
40  
30  
20  
1000  
R
= 0.87°C/W  
q
JC  
T = Max Rated  
J
Single Pulse  
100  
10  
1
V
GS  
= 18 V  
T
C
= 25°C  
10 ms  
100 ms  
10 ms  
1 ms  
R
= 0.87°C/W  
10  
0
q
JC  
R
Limit  
0.1  
DS(on)  
Thermal Limit  
Package Limit  
100 ms/DC  
0.01  
25  
50  
75  
100  
125  
150  
175  
0.1  
1
10  
100  
1000  
T , CASE TEMPERATURE (°C)  
C
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 13. Maximum Continuous Drain  
Current vs. Case Temperature  
Figure 14. Safe Operating Area  
20K  
10K  
R
= 0.87°C/W  
q
JC  
Single Pulse  
T
C
= 25°C  
1K  
100  
10  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t, PULSE WIDTH (sec)  
Figure 15. Single Pulse Maximum Power  
Dissipation  
2
1
50% Duty Cycle  
20%  
10%  
5%  
0.1  
2%  
1%  
Single Pulse  
P
DM  
Notes:  
= 0.87°C/W  
0.01  
R
q
JC  
Peak T = P  
Duty Cycle, D = t / t  
x Z (t) + T  
q
JC C  
t
1
J
DM  
1
2
t
2
0.001  
0.00001  
0.0001  
0.001  
t, PULSE TIME (s)  
0.01  
0.1  
1
Figure 16. JunctiontoCase Transient Thermal Response  
www.onsemi.com  
6
NVBG070N120M3S  
PACKAGE DIMENSIONS  
D2PAK7 (TO2637L HV)  
CASE 418BJ  
ISSUE B  
www.onsemi.com  
7
NVBG070N120M3S  
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