NVH4L020N090SC1 [ONSEMI]

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 20 mohm, 900 V, M2, TO247−4L;
NVH4L020N090SC1
型号: NVH4L020N090SC1
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 20 mohm, 900 V, M2, TO247−4L

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – 20 mohm, 900 V,  
M2, TO-247-4L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
900 V  
28 mW @ 15 V  
118 A  
D
NVH4L020N090SC1  
Features  
G
Typ. R  
= 20 mW @ V = 15 V  
GS  
= 16 mW @ V = 18 V  
GS  
DS(on)  
S1: Kelvin Source  
S2: Power Source  
Typ. R  
DS(on)  
Ultra Low Gate Charge (typ. Q  
= 196 nC)  
G(tot)  
S2 S1  
NCHANNEL MOSFET  
Low Effective Output Capacitance (typ. C = 296 pF)  
oss  
100% UIL Tested  
AECQ101 Qualified and PPAP Capable  
This Device is Halide Free and RoHS Compliant with exemption 7a,  
PbFree 2LI (on second level interconnection)  
Typical Applications  
D
Automotive Traction Inverters  
Automotive On Board Charger  
Automotive DC-DC Converter for EV/HEV  
S2  
S1  
G
TO2474L  
CASE 340CJ  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING DIAGRAM  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
Unit  
V
DSS  
900  
V
V
V
GatetoSource Voltage  
V
GS  
+22/8  
+15/5  
H4L020  
090SC1  
&Z&3&K  
$Y  
Recommended Operation  
T
< 175°C  
= 25°C  
V
GSop  
C
Values of GateSource Voltage  
Continuous Drain  
Current R  
Steady  
State  
T
I
116  
484  
82  
A
W
A
C
DC  
q
JC  
Power Dissipation  
R
P
DC  
q
JC  
H4L020090SC1  
= Specific Device Code  
= Assembly Plant Code  
= Date Code (Year & Week)  
= Lot  
Continuous Drain  
Current R  
Steady  
State  
T
C
= 100°C  
I
DC  
&Z  
&3  
&K  
$Y  
q
JC  
Power Dissipation  
R
P
DC  
242  
504  
W
q
JC  
= onsemi Logo  
Pulsed Drain Current (Note 2)  
T = 25°C  
A
I
A
DM  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 6 of  
this data sheet.  
+175  
Source Current (Body Diode)  
I
S
106  
264  
A
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I = 23 A , L = 1 mH) (Note 3)  
L
pk  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive rating, limited by max junction temperature.  
3. E of 264 mJ is based on starting T = 25°C; L = 1 mH, I = 23 A,  
AS  
DD  
J
AS  
V
= 100 V, V = 15 V.  
GS  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
May, 2022 Rev. 1  
NVH4L020N090SC1/D  
 
NVH4L020N090SC1  
Table 1. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Max  
0.31  
40  
Unit  
°C/W  
°C/W  
Thermal Resistance JunctiontoCase (Note 1)  
Thermal Resistance JunctiontoAmbient (Note 1)  
R
θ
JC  
JA  
R
θ
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise stated)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 1 mA  
900  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
J
I = 1 mA, refer to 25°C  
D
500  
mV/°C  
(BR)DSS  
Zero Gate Voltage Drain Current  
I
V
V
= 0 V,  
T = 25°C  
100  
250  
1
mA  
mA  
mA  
DSS  
GS  
DS  
J
= 900 V  
T = 175°C  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS  
I
V
= +22/8 V, V = 0 V  
DS  
GSS  
GS  
GS  
Gate Threshold Voltage  
V
R
V
= V , I = 20 mA  
1.8  
2.7  
4.3  
+15  
28  
V
V
GS(TH)  
DS  
D
Recommended Gate Voltage  
DraintoSource On Resistance  
V
5  
GOP  
V
GS  
V
GS  
V
GS  
V
DS  
= 15 V, I = 60 A, T = 25°C  
20  
16  
27  
49  
mW  
DS(on)  
D
J
= 18 V, I = 60 A, T = 25°C  
D
J
= 15 V, I = 60 A, T = 175°C  
D
J
Forward Transconductance  
g
= 20 V, I = 60 A  
S
FS  
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
V
= 0 V, f = 1 MHz,  
= 450 V  
4415  
296  
24  
pF  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
RSS  
Reverse Transfer Capacitance  
Total Gate Charge  
C
Q
V
= 5/15 V, V = 720 V,  
196  
42  
nC  
G(TOT)  
GS  
DS  
I
= 60 A  
D
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Q
G(TH)  
Q
78  
GS  
GD  
Q
55  
f = 1 MHz  
1.6  
W
GateResistance  
R
G
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
V
D
= 5/15 V, V = 720 V,  
29  
28  
ns  
d(ON)  
GS  
DS  
I
= 60 A, R = 2.5 W,  
G
Rise Time  
t
r
Inductive Load  
TurnOff Delay Time  
t
54  
d(OFF)  
Fall Time  
t
f
14  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
611  
293  
904  
mJ  
ON  
E
OFF  
E
TOT  
DRAINSOURCE DIODE CHARACTERISTICS  
Continuous DrainSource Diode Forward  
I
V
GS  
V
GS  
V
GS  
= 5 V, T = 25°C  
106  
504  
A
A
V
SD  
J
Current  
Pulsed DrainSource Diode Forward  
Current (Note 2)  
I
= 5 V, T = 25°C  
J
SDM  
Forward Diode Voltage  
V
= 5 V, I = 30 A, T = 25°C  
3.8  
SD  
SD  
J
www.onsemi.com  
2
 
NVH4L020N090SC1  
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise stated) (continued)  
J
Parameter  
DRAINSOURCE DIODE CHARACTERISTICS  
Reverse Recovery Time  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
t
V
= 5/15 V, I = 60 A,  
30  
244  
11  
ns  
nC  
mJ  
A
RR  
GS  
S
SD  
dI /dt = 1000 A/ms, V = 720 V  
DS  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
Q
RR  
E
REC  
I
16  
RRM  
Ta  
17  
ns  
ns  
Discharge Time  
Tb  
13  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
NVH4L020N090SC1  
TYPICAL CHARACTERISTICS  
200  
150  
100  
4
13 V  
V
GS  
= 15 V  
9 V  
V
GS  
= 10 V  
12 V  
3
12 V  
13 V  
15 V  
2
10 V  
9 V  
1
50  
0
6 V  
7 V  
0
0
2
4
6
8
10  
0
30  
60  
90  
120  
150  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
1.9  
1.7  
1.5  
1.3  
1.1  
160  
120  
80  
I
D
= 60 A  
I
V
= 60 A  
D
= 15 V  
GS  
40  
0
T = 150°C  
J
0.9  
0.7  
T = 25°C  
J
75 50 25  
0
25 50 75 100 125 150 175  
5
10  
15  
20  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 3. OnResistance Variation with  
Figure 4. OnResistance vs. GatetoSource  
Temperature  
Voltage  
120  
100  
80  
300  
T = 175°C  
J
T = 55°C  
J
V
GS  
= 5 V  
T = 25°C  
J
T = 55°C  
J
T = 175°C  
J
60  
30  
40  
T = 25°C  
J
20  
0
V
DS  
= 20 V  
3
3
6
9
12  
15  
1
3
5
7
9
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
www.onsemi.com  
4
NVH4L020N090SC1  
TYPICAL CHARACTERISTICS (continued)  
15  
10  
5
50K  
V
DD  
= 180 V  
I
D
= 60 A  
V
DD  
= 540 V  
10K  
1K  
C
iss  
V
DD  
= 720 V  
C
oss  
C
rss  
100  
0
10  
1
f = 1 MHz  
= 0 V  
V
GS  
5  
0.1  
1
10  
100  
800  
175  
1
0
50  
100  
Q , GATE CHARGE (nC)  
150  
200  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
g
Figure 7. GatetoSource Voltage vs. Total  
Figure 8. Capacitance vs. DraintoSource  
Charge  
Voltage  
100  
140  
120  
100  
80  
V
GS  
= 15 V  
T = 25°C  
J
10  
60  
T = 150°C  
J
40  
20  
0
Typical performance based  
on characterization data  
R
= 0.31°C/W  
q
JC  
1
0.001  
0.01  
0.1  
1
10  
100  
25  
50  
75  
100  
125  
150  
t , TIME IN AVALANCHE (ms)  
AV  
T , CASE TEMPERATURE (°C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
1E+06  
1E+05  
1E+04  
1E+03  
1000  
100  
10  
Single Pulse  
R
T
= 0.31°C/W  
q
JC  
= 25°C  
C
10 ms  
T
= 25°C  
C
100 ms  
Single Pulse  
R
= 0.31°C/W  
q
JC  
1
R
Limit  
1 ms  
10 ms  
DS(on)  
1E+02  
1E+01  
Thermal Limit  
Package Limit  
100 ms/DC  
0.1  
0.1  
1
10  
100 1000  
0.00001 0.0001 0.001  
0.01  
0.1  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
www.onsemi.com  
5
NVH4L020N090SC1  
TYPICAL CHARACTERISTICS (continued)  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Notes:  
P
0.01  
DM  
Z
q
(t) = r(t) x R  
q
JC  
JC  
R
= 0.31°C/W  
0.01  
qJC  
t
Peak T = P  
x Z (t) + T  
1
q
J
DM  
JC  
C
Duty Cycle, D = t /t  
t
Single Pulse  
0.00001  
1
2
2
0.001  
0.0001  
0.001  
t, PULSE TIME (s)  
0.01  
0.1  
1
Figure 13. JunctiontoAmbient Transient Thermal Response Curve  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Packing Method  
Reel Size  
Tape Size  
Quantity  
NVH4L020N090SC1  
H4L020090SC1  
TO2474L  
Tube  
N/A  
N/A  
30 Units  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2474LD  
CASE 340CJ  
ISSUE A  
DATE 16 SEP 2019  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13852G  
TO2474LD  
PAGE 1 OF 1  
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