NVMYS7D0N06CTWG [ONSEMI]
Power MOSFET 60 V, 1.68 mOhms, 224 A, Single N-Channel;型号: | NVMYS7D0N06CTWG |
厂家: | ONSEMI |
描述: | Power MOSFET 60 V, 1.68 mOhms, 224 A, Single N-Channel |
文件: | 总6页 (文件大小:209K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
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MOSFET - Power, Single
N-Channel
60 V, 7.0 mW, 66 A
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
60 V
7.0 mW @ 10 V
66 A
D (5)
NVMYS7D0N06C
Features
• Small Footprint (5x6 mm) for Compact Design
G (4)
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
S (1,2,3)
N−CHANNEL MOSFET
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
MARKING
DIAGRAM
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
Gate−to−Source Voltage
V
20
V
GS
7D0N06
C
AWLYW
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
66
A
C
D
q
JC
T
C
46.8
61.3
30.7
16.9
11.9
4.0
LFPAK4
CASE 760AB
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
W
A
D
R
(Note 1)
q
JC
T
C
= 100°C
7D0N06C
A
WL
Y
W
= Specific Device Code
= Assembly Location
=Wafer Lot
Continuous Drain
Current R
T = 25°C
A
I
D
q
JA
T = 100°C
A
= Year
= Work Week
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1, 2)
q
JA
T = 100°C
A
2.0
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
366
A
A
p
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
Source Current (Body Diode)
I
51.1
195
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I
= 3.6 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
2.45
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
37.6
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
October, 2021 − Rev. 0
NVMYS7D0N06C/D
NVMYS7D0N06C
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)
J
Parameter
OFF CHARACTERISTICS
Symbol
Test Condition
Min
Typ
Max
Unit
Drain−to−Source Breakdown Voltage
V
V
GS
= 0 V, I = 250 mA
60
V
(BR)DSS
D
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V
/
25.4
mV/°C
(BR)DSS
T
J
Zero Gate Voltage Drain Current
I
V
= 0 V,
T = 25 °C
10
mA
DSS
GS
DS
J
V
= 60 V
T = 125°C
J
250
100
Gate−to−Source Leakage Current
ON CHARACTERISTICS
I
V
= 0 V, V = 20 V
nA
GSS
DS
GS
Gate Threshold Voltage
V
V
= V , I = 53 mA
2.0
4.0
7.0
V
GS(TH)
GS
DS
D
Threshold Temperature Coefficient
Drain−to−Source On Resistance
V
/T
−8.4
mV/°C
mW
GS(TH)
J
R
V
= 10 V
I = 11 A
D
5.8
DS(on)
GS
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
1035
713
9
pF
nC
ISS
Output Capacitance
C
V
= 0 V, f = 1 MHz, V = 25 V
DS
OSS
RSS
GS
Reverse Transfer Capacitance
Total Gate Charge
C
Q
V
GS
= 10 V, V = 48 V; I = 11 A
14
G(TOT)
DS
D
Threshold Gate Charge
Gate−to−Source Charge
Gate−to−Drain Charge
Plateau Voltage
Q
3.0
4.4
1.9
4.4
G(TH)
Q
GS
GD
GP
V
GS
= 10 V, V = 48 V; I = 11 A
DS
D
Q
V
V
SWITCHING CHARACTERISTICS (Note 4)
Turn−On Delay Time
t
10
3
ns
d(ON)
Rise Time
t
r
V
= 10 V, V = 48 V,
DS
GS
D
I
= 11 A, R = 2.5 W
G
Turn−Off Delay Time
t
16
4
d(OFF)
Fall Time
t
f
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
T = 25°C
0.81
0.67
32
1.2
V
SD
J
V
S
= 0 V,
GS
I
= 11 A
T = 125°C
J
Reverse Recovery Time
Charge Time
t
ns
RR
t
t
16
a
V
= 0 V, dI /dt = 100 A/ms,
S
GS
I
S
= 11 A
Discharge Time
16
b
Reverse Recovery Charge
Q
15
nC
RR
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Switching characteristics are independent of operating junction temperatures.
www.onsemi.com
2
NVMYS7D0N06C
TYPICAL CHARACTERISTICS
60
45
30
150
V
GS
= 10 V to 6 V
V
DS
= 5 V
120
90
5.0 V
60
T = 25°C
J
15
0
30
0
4.5 V
4.0 V
T = 125°C
J
T = −55°C
J
0
1
2
3
4
5
2
4
6
8
10
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
Figure 1. On−Region Characteristics
Figure 2. Transfer Characteristics
16
12
8
40
32
24
16
T = 25°C
D
T = 25°C
J
J
I
= 11 A
V
GS
= 10 V
4
0
8
0
5
6
7
8
9
10
0
15
30
I , DRAIN CURRENT (A)
45
60
V
, GATE−TO−SOURCE VOLTAGE (V)
GS
D
Figure 3. On−Resistance vs. Gate−to−Source
Figure 4. On−Resistance vs. Drain Current and
Voltage
Gate Voltage
2.0
1.8
1.6
1.4
1.2
1.0
1E−04
1E−05
1E−06
1E−07
1E−08
T = 175°C
J
V
= 10 V
= 11 A
GS
T = 150°C
J
I
D
T = 125°C
J
T = 100°C
J
T = 85°C
J
T = 25°C
J
1E−09
1E−10
0.8
0.6
−75 −50 −25
0
25 50 75 100 125 150 175
5
15
25
35
45
55
T , JUNCTION TEMPERATURE (°C)
J
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Figure 6. Drain−to−Source Leakage Current
Temperature
vs. Voltage
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3
NVMYS7D0N06C
TYPICAL CHARACTERISTICS
10,000
1000
100
10
C
8
6
4
ISS
C
OSS
Q
Q
GD
GS
V
= 48 V
C
DS
RSS
10
1
V
= 0 V
GS
T = 25°C
2
0
J
T = 25°C
J
I
D
= 11 A
f = 1 MHz
0.1
1
10
60
0
4
8
12
16
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Q , TOTAL GATE CHARGE (nC)
G
Figure 7. Capacitance Variation
Figure 8. Gate−to−Source vs. Total Charge
1000
100
100
10
1
V
GS
= 0 V
V
= 10 V
= 48 V
= 11 A
GS
V
DS
I
D
t
t
d(off)
0.1
10
1
d(on)
t
f
0.01
t
r
T = 125°C T = 25°C
T = −55°C
J
J
J
0.001
1
10
R , GATE RESISTANCE (W)
50
0
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
, SOURCE−TO−DRAIN VOLTAGE (V)
G
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
Figure 10. Diode Forward Voltage vs. Current
1000
100
100
10
T
= 25°C
J(initial)
10
T
= 25°C
T
= 150°C
C
J(initial)
10 ms
Single Pulse
≤ 10 V
1
V
GS
1
0.5 ms
1 ms
10 ms
R
Limit
DS(on)
Thermal Limit
Package Limit
0.1
0.1
0.1
1
10
100
1000
0.0001
0.001
0.01
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
TIME IN AVALANCHE (s)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
Figure 12. Maximum Drain Current vs. Time in
Avalanche
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4
NVMYS7D0N06C
TYPICAL CHARACTERISTICS
100
10
1
50% Duty Cycle
20%
10%
5%
2%
1%
0.1
0.01
Single Pulse
0.001
0.0000001 0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 13. Transient Thermal Impedance
DEVICE ORDERING INFORMATION
Device
†
Marking
Package
Shipping
NVMYS7D0N06CTWG
7D0N06C
LFPAK4
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NVMYS7D0N06C
PACKAGE DIMENSIONS
LFPAK4 5x6
CASE 760AB
ISSUE B
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and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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Phone: 011 421 33 790 2910
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