NVTYS003N04CLTWG [ONSEMI]

MOSFET – Power, Single, N-Channel;
NVTYS003N04CLTWG
型号: NVTYS003N04CLTWG
厂家: ONSEMI    ONSEMI
描述:

MOSFET – Power, Single, N-Channel

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www.onsemi.com  
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.  
MOSFET – Power, Single  
N-Channel  
40 V, 3.4 mW, 107 A  
NVTYS003N04CL  
Features  
www.onsemi.com  
Small Footprint (3.3 x 3.3 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
AECQ101 Qualified and PPAP Capable  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
3.4 mW @ 10 V  
5.3 mW @ 4.5 V  
These Devices are PbFree and are RoHS Compliant  
40 V  
107 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
D (5)  
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
106  
75  
A
C
D
q
JC  
G (4)  
T
C
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
69  
W
A
D
R
(Note 1)  
S (1,2,3)  
q
JC  
T
C
= 100°C  
34  
NCHANNEL MOSFET  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
23  
q
JA  
T = 100°C  
A
16  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.2  
1.6  
498  
W
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
LFPAK8  
3.3x3.3  
CASE 760AD  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
57.1  
179  
A
S
MARKING DIAGRAM  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 7.4 A)  
L(pk)  
003N  
04CL  
AWLYW  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
003N04CL = Specific Device Code  
= Assembly Location  
WL = Wafer Lot  
A
THERMAL RESISTANCE MAXIMUM RATINGS  
Y
= Year  
Parameter  
Symbol  
Value  
2.2  
Unit  
W
= Work Week  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
(Note: Microdot may be in either location)  
q
JC  
R
46.7  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
April, 2021 Rev. 1  
NVTYS003N04CL/D  
 
NVTYS003N04CL  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
40  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/
23  
(BR)DSS  
mV/°C  
T
J
Zero Gate Voltage Drain Current  
I
V
= 0 V,  
T = 25 °C  
10  
DSS  
GS  
DS  
J
V
= 40 V  
mA  
T = 125°C  
J
250  
100  
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage  
I
V
= 0 V, V = 20 V  
nA  
GSS  
DS  
GS  
V
V
= V , I = 60 mA  
1.2  
2.0  
V
GS(TH)  
GS  
DS  
D
Threshold Temperature Coefficient  
DraintoSource On Resistance  
V
/T  
5.7  
2.9  
mV/°C  
GS(TH)  
J
R
V
= 10 V  
I
= 40 A  
= 40 A  
3.4  
5.3  
DS(on)  
GS  
D
mW  
V
GS  
= 4.5 V  
I
D
4.3  
Forward Transconductance  
CHARGES AND CAPACITANCES  
Input Capacitance  
g
V
= 5 V, I = 40 A  
120  
S
FS  
DS  
D
C
2240  
800  
21  
ISS  
Output Capacitance  
C
OSS  
C
RSS  
V
= 0 V, f = 1 MHz, V = 25 V  
pF  
GS  
DS  
Reverse Transfer Capacitance  
Total Gate Charge  
Q
V
GS  
= 10 V, V = 32 V; I = 40 A  
36  
G(TOT)  
G(TOT)  
DS  
D
Total Gate Charge  
Q
17  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Plateau Voltage  
Q
3.5  
6.5  
5.5  
3.1  
nC  
V
G(TH)  
Q
V
GS  
= 4.5 V, V = 32 V; I = 40 A  
GS  
GD  
GP  
DS  
D
Q
V
SWITCHING CHARACTERISTICS (Note 5)  
TurnOn Delay Time  
t
17  
13  
24  
9
d(ON)  
Rise Time  
t
r
V
= 4.5 V, V = 32 V,  
DS  
GS  
D
ns  
V
I
= 40 A, R = 2.5 W  
G
TurnOff Delay Time  
t
d(OFF)  
Fall Time  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
T = 25°C  
0.84  
0.72  
34  
1.2  
SD  
RR  
J
V
S
= 0 V,  
GS  
I
= 40 A  
T = 125°C  
J
Reverse Recovery Time  
Charge Time  
t
t
15  
ns  
a
V
GS  
= 0 V, dI /dt = 100 A/ms,  
S
I
S
= 40 A  
Discharge Time  
t
19  
b
Reverse Recovery Charge  
Q
14  
nC  
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Pulse Test: pulse width 300 ms, duty cycle 2%.  
5. Switching characteristics are independent of operating junction temperatures.  
www.onsemi.com  
2
 
NVTYS003N04CL  
TYPICAL CHARACTERISTICS  
200  
180  
160  
140  
120  
100  
80  
200  
V
= 4.5 V  
to 10 V  
GS  
V
DS  
= 10 V  
180  
160  
140  
120  
100  
80  
4.4 V  
3.6 V  
3.2 V  
60  
40  
20  
0
60  
40  
20  
0
T = 25°C  
J
2.8 V  
2.6 V  
T = 125°C  
J
T = 55°C  
J
0
1
2
3
4
5
0
1
2
3
4
5
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
6
5
4
3
40  
35  
30  
25  
20  
15  
10  
T = 25°C  
D
T = 25°C  
J
J
I
= 40 A  
V
= 4.5 V  
= 10 V  
GS  
V
GS  
2
1
5
0
3
4
5
6
7
8
9
10  
10 20  
30  
40  
50  
60  
70  
80  
90 100  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. GatetoSource  
Figure 4. OnResistance vs. Drain Current and  
Voltage  
Gate Voltage  
1000  
100  
10  
3.0  
2.5  
2.0  
1.5  
1.0  
V
I
= 10 V  
= 40 A  
GS  
T = 175°C  
J
D
T = 125°C  
J
1
T = 85°C  
J
0.1  
0.01  
0.001  
T = 25°C  
J
0.5  
0
0.0001  
50 25  
0
25  
50  
75  
100 125 150 175  
5
10  
15  
20  
25  
30  
35  
40  
T , JUNCTION TEMPERATURE (°C)  
J
V
, DRAINTOSOURCE VOLTAGE (V)  
DS  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Voltage  
www.onsemi.com  
3
NVTYS003N04CL  
TYPICAL CHARACTERISTICS  
10  
9
10000  
1000  
100  
C
ISS  
8
7
6
5
4
3
2
C
OSS  
Q
Q
GS  
GD  
C
RSS  
10  
1
V
DS  
= 32 V  
V
= 0 V  
GS  
T = 25°C  
J
T = 25°C  
J
1
0
I
D
= 40 A  
f = 1 MHz  
0
10  
20  
30  
40  
0
5
10  
15  
20  
25  
30  
35  
40  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
G
Figure 7. Capacitance Variation  
Figure 8. GatetoSource and  
DraintoSource Voltage vs. Total Charge  
1000  
100  
40  
30  
20  
T = 125°C  
J
t
r
T = 25°C  
J
t
d(off)  
T = 55°C  
J
t
d(on)  
t
f
10  
1
10  
0
V
V
= 4.5 V  
= 32 V  
= 40 A  
GS  
DD  
I
D
1
10  
R , GATE RESISTANCE (W)  
100  
0.2 0.3  
V
0.4  
0.5  
0.6  
0.7  
0.8  
0.9 1.0  
, SOURCETODRAIN VOLTAGE (V)  
SD  
G
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
100  
10  
1000  
T
= 25°C  
J(initial)  
100  
10  
10 ms  
T
V
= 25°C  
10 V  
C
T
= 150°C  
GS  
J(initial)  
Single Pulse  
1
0.5 ms  
1 ms  
10 ms  
1
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
0.1  
0.1  
0.0001  
0.001  
TIME IN AVALANCHE (s)  
0.01  
0.1  
1
10  
100  
1000  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Safe Operating Area  
Figure 12. IPEAK vs. Time in Avalanche  
www.onsemi.com  
4
NVTYS003N04CL  
TYPICAL CHARACTERISTICS  
100  
10  
1
50% Duty Cycle  
20%  
10%  
5%  
2%  
1%  
0.1  
Single Pulse  
0.01  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 13. Thermal Characteristics  
DEVICE ORDERING INFORMATION  
Device  
Marking  
Package  
Shipping  
NVTYS003N04CLTWG  
003N  
04CL  
LFPAK33  
(PbFree)  
3000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
5
NVTYS003N04CL  
PACKAGE DIMENSIONS  
LFPAK8 3.3x3.3, 0.65P  
CASE 760AD  
ISSUE A  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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