NVXK2TR40WXT [ONSEMI]

EliteSiC Power Module for OBC, 40mΩ, 1200V, 27 A, Dual Half-Bridge, in APM32 Series;
NVXK2TR40WXT
型号: NVXK2TR40WXT
厂家: ONSEMI    ONSEMI
描述:

EliteSiC Power Module for OBC, 40mΩ, 1200V, 27 A, Dual Half-Bridge, in APM32 Series

文件: 总8页 (文件大小:790K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
Module – EliteSiC Power  
Module for OBC,  
V
R
Max  
I Max  
D
(BR)DSS  
DS(on)  
1200 V  
59 mW @ 20 V  
27 A  
40ꢀmohm, 1200ꢀV, 27 A,  
Dual Half-Bridge,  
in APM32 Series  
NVXK2TR40WXT  
Features  
SiC MOSFET HBridge Module  
DIP Silicon Carbide HBridge Power Module for Onboard Charger  
(OBC) for xEV Applications  
Creepage and Clearance per IEC 606641, IEC 609501  
Compact Design for Low Total Module Resistance  
Module Serialization for Full Traceability  
Lead Free, ROHS and UL94V0 Compliant  
Automotive Qualified per AECQ101 and AQG324  
Typical Applications  
DCDC and OnBoard Charger in xEV Applications  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
APM32  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
1200  
Unit  
V
V
DSS  
ORDERING INFORMATION  
GatetoSource Voltage  
V
+25/15  
+20/5  
V
GS  
Device  
Package  
Shipping  
Recommended Operation Values of  
V
GSop  
V
GatetoSource Voltage, T 175°C  
NVXK2TR40WXT  
APM32  
(PbFree)  
10 ea / Tube  
J
Continuous Drain  
T
= 25°C  
I
27  
A
W
A
C
D
Current (Notes 1, 2)  
Power Dissipation  
(Note 1)  
P
319  
240  
495  
D
Pulsed Drain Current  
(Note 3)  
T
T
p
R
= 25°C  
= 25°C,  
I
DM  
C
Single Pulse Surge  
Drain Current Capability  
I
A
C
DSC  
t = 10 ms,  
= 4.7 W  
G
Operating Junction and Storage  
Temperature  
T , T  
55 to  
175  
°C  
J
stg  
Source Current (Body Diode) (Note 2)  
I
S
27  
A
Single Pulse Drain–toSource  
Avalanche Energy (Note 4)  
E
AS  
338  
mJ  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Particular conditions specified determine thermal resistance values shown.  
Infinite heatsink with T = 100°C for R . For R  
assembled to 3 mm thick  
θ
Ψ
JS  
C
JC  
aluminum heatsink with infinite cooling bottom surface at 85°C, through 38 mm  
thick TIM with 6.5 W/mK thermal conductivity.  
2. Qualified per ECPE Guideline AQG 324.  
3. Repetitive rating limited by maximum junction temperature and  
transconductance.  
4. E based on initial T = 25°C, L = 1 mH, I = 26 A, V = 120 V, V = 18 V.  
AS  
J
AS  
DD  
GS  
© Semiconductor Components Industries, LLC, 2022  
1
Publication Order Number:  
February, 2023 Rev. 2  
NVXK2TR40WXT/D  
 
NVXK2TR40WXT  
THERMAL CHARACTERISTICS (Note 1)  
Parameter  
Thermal Resistance JunctiontoCase (Note 1)  
Thermal Resistance JunctiontoSink (Note 1)  
Symbol  
Typ  
0.37  
0.84  
Max  
0.47  
0.95  
Unit  
°C/W  
°C/W  
R
θ
JC  
R
Ψ
JS  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise stated)  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 1 mA  
1200  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/ T  
J
I = 1 mA, referenced to 25°C  
D
450  
mV/°C  
(BR)DSS  
Zero Gate Voltage Drain Current  
I
V
V
= 0 V  
= 1200 V  
T = 25°C  
100  
1
mA  
mA  
mA  
DSS  
GS  
J
DS  
T = 175°C  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 5)  
Gate Threshold Voltage  
I
V
GS  
= +25/15 V, V = 0 V  
1
GSS  
DS  
V
V
GS  
= V , I = 10 mA  
1.8  
3
4.3  
+20  
59  
V
V
GS(TH)  
DS  
D
Recommended Gate Voltage  
DraintoSource On Resistance  
DraintoSource On Resistance  
Forward Transconductance  
V
5  
GOP  
R
R
V
GS  
V
GS  
V
DS  
= 20 V, I = 35 A, T = 25°C  
40  
71  
20  
mW  
mW  
S
DS(on)  
DS(on)  
D
J
= 20 V, I = 35 A, T = 175°C  
D
J
g
= 20 V, I = 35 A  
FS  
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
V
= 0 V, f = 1 MHz,  
= 800 V  
1789  
139  
12.5  
106  
18  
pF  
nC  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
C
RSS  
Reverse Transfer Capacitance  
Total Gate Charge  
Q
V
D
= 5/20 V, V = 600 V,  
= 47 A  
G(TOT)  
GS DS  
I
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
GateResistance  
Q
G(TH)  
Q
34  
GS  
GD  
Q
26  
R
V
V
= 0 V, f = 1 MHz  
2
W
G
GS  
INDUCTIVE SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
= 5 / 20 V, V = 800 V,  
17  
20  
ns  
d(ON)  
GS  
DS  
I
= 47 A, R = 4.7 W,  
D
G
Rise Time  
t
r
Inductive load  
TurnOff Delay Time  
t
30  
d(OFF)  
Fall Time  
t
f
9
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
366  
200  
566  
mJ  
mJ  
mJ  
ON  
E
OFF  
E
tot  
DRAINSOURCE DIODE CHARACTERISTICS  
Continuous DrainSource Diode Forward  
I
V
V
V
= 5 V, T = 25°C  
27  
A
A
V
SD  
GS  
GS  
GS  
J
Current (Note 1)  
Pulsed DrainSource Diode Forward  
Current (Note 3)  
I
= 5 V, T = 25°C  
240  
SDM  
J
Forward Diode Voltage  
V
= 5 V, I = 17.5 A,  
3.7  
SD  
SD  
T = 25°C  
J
www.onsemi.com  
2
NVXK2TR40WXT  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise stated) (continued)  
J
Parameter  
DRAINSOURCE DIODE CHARACTERISTICS  
Reverse Recovery Time  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
t
V
SD  
= 5 V, dI /dt = 1000 A/ms,  
24  
ns  
A
RR  
GS  
S
I
= 17.5 A  
Peak Reverse Recovery Current  
Charge Time  
I
10.4  
12.4  
11.6  
125  
RRM  
t
a
t
b
ns  
ns  
nC  
Discharge Time  
Reverse Recovery Charge  
Q
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
5. Pulse test: pulse width 300 ms, duty ratio 2%.  
www.onsemi.com  
3
NVXK2TR40WXT  
TYPICAL CHARACTERISTICS  
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs.  
Drain Current and Gate Voltage  
Figure 3. OnResistance Variation with  
Figure 4. OnResistance vs. GatetoSource  
Temperature  
Voltage  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
www.onsemi.com  
4
NVXK2TR40WXT  
TYPICAL CHARACTERISTICS (CONTINUED)  
Figure 7. GatetoSource Voltage vs. Total Charge  
Figure 8. Capacitance vs. DraintoSource  
Voltage  
Figure 9. Unclamped Inductive Switching Capability  
Figure 10. Maximum Continuous Drain Current  
vs. Case Temperature  
Figure 11. Single Pulse Maximum Power Dissipation  
www.onsemi.com  
5
NVXK2TR40WXT  
TYPICAL CHARACTERISTICS (CONTINUED)  
Figure 12. Thermal Response  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
APM32 AUTOMOTIVE MODULE  
CASE MODHL  
ISSUE B  
DATE 05 APR 2022  
GENERIC  
MARKING DIAGRAM*  
XXXX = Specific Device Code  
ZZZ = Lot ID  
*This information is generic. Please refer to  
AT  
Y
W
= Assembly & Test Location  
= Year  
= Work Week  
XXXXXXXXXXXXXXXX  
ZZZ ATYWW  
NNNNNNN  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
NNN = Serial Number  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON29478H  
APM32 AUTOMOTIVE MODULE  
PAGE 1 OF 1  
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TECHNICAL PUBLICATIONS:  
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