NZ3F47VT1G [ONSEMI]

Zener Voltage Regulators;


型号：	NZ3F47VT1G
厂家：	ONSEMI
描述：	Zener Voltage Regulators
文件：	总3页 (文件大小：53K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NZ3FxxxT1G Series,

SZNZ3FxxxT1G Series

Zener Voltage Regulators

800 mW SOD−323FL Surface Mount

This series of Zener diodes is packaged in a SOD−323FL surface

mount package that has a power dissipation of 800 mW. They are

designed to provide voltage regulation protection and are especially

attractive in situations where space is at a premium. They are well

suited for applications such as cellular phones, hand held portables,

high density PC boards, and automotive.

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SOD−323FL

CASE 477AC

Specification Features:

• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V

• Steady State Power Rating of 800 mW

• ESD Rating of Class 3 (> 16 kV) per Human Body Model

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

Cathode

Anode

MARKING DIAGRAM

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

XX M

Mechanical Characteristics:

CASE: Void-free, Transfer-Molded Plastic

FINISH: All External Surfaces are Corrosion Resistant

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260°C for 10 Seconds

= Specific Device Code

Date Code

LEADS: Plated with Pb−Sn or Sn Only (Pb−Free)

POLARITY: Cathode Indicated by Polarity Band

FLAMMABILITY RATING: UL 94 V−0

ORDERING INFORMATION

Device

NZ3FxxxT1G

Package

Shipping†

MOUNTING POSITION: Any

SOD−323FL

(Pb−Free)

3,000 /

Tape & Reel

MAXIMUM RATINGS

SZNZ3FxxxT1G SOD−323FL

(Pb−Free)

3,000 /

Tape & Reel

Rating

Symbol

Max

Unit

Total Device Dissipation FR−4 Board,

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

(Note 1) @ T = 25°C

800

6.4

mW/°C

Derate above 25°C

Thermal Resistance, Junction−to−Ambient

156

°C/W

°C

Junction and Storage Temperature Range T , T

−65 to +150

stg

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm .

Publication Order Number:

June, 2016 − Rev. 1

NZ3F2V4T1/D

NZ3FxxxT1G Series, SZNZ3FxxxT1G Series

ELECTRICAL CHARACTERISTICS

Symbol

Parameter

Reverse Zener Voltage @ I

Reverse Current

Maximum Zener Impedance @ I

Reverse Current

Maximum Zener Impedance @ I

Reverse Leakage Current @ V

Reverse Voltage

Forward Current

Forward Voltage @ I

Maximum Temperature Coefficient of V

Max. Capacitance @V = 0 and f = 1 MHz

Zener Voltage Regulator

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 1.3 V Max. @ I = 10 mA for all types)

Zener Voltage (Note 2)

Zener Impedance

Leakage Current

(mV/k)

@ V = 0

@ I

V (Volts)

@ I

@ V

@ I

f = 1 MHz

R R

Device

Marking Min Nom Max

Volts

Min

Max

Device*

NZ3F2V4T1G

NZ3F4V7T1G

NZ3F5V1T1G

NZ3F5V6T1G

NZ3F9V1T1G

NZ3F10VT1G

NZ3F12VT1G

NZ3F15VT1G

NZ3F18VT1G

NZ3F33VT1G

NZ3F47VT1G

NZ3F75VT1G

2.2

4.4

4.8

5.2

8.5

9.4

11.4

14.3

16.8

2.4

4.7

5.1

5.6

9.1

2.6

5.0

5.4

6.0

9.6

10.6

12.7

15.8

19.1

120

100

1000

800

500

200

240

175

220

290

310

500

780

0.5

1.0

2.0

7.0

−3.5

−2.7

−2.0

3.8

4.5

6.0

9.2

12.4

27.4

42.0

73.4

450

260

225

200

130

110

100

0.2

1.2

2.5

7.0

8.0

33.4

51.8

88.6

0.2

0.1

0.05

8.0

100

140

150

155

10.5

12.6

23.2

32.9

52.5

*Includes SZ-prefix devices where applicable.

2. Zener voltage is measured with a pulse test current I at an ambient temperature of 25°C.

TYPICAL CHARACTERISTICS

100

125

150

TEMPERATURE (°C)

Figure 1. Steady State Power Derating

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NZ3FxxxT1G Series, SZNZ3FxxxT1G Series

PACKAGE DIMENSIONS

SOD−323FL

CASE 477AC

ISSUE B

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS INCLUDES LEAD FINISH.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

MILLIMETERS

DIM

MIN

0.90

−−−

0.50

0.10

2.00

1.30

2.40

0.35

MAX

1.08

0.10

0.70

0.25

2.20

1.60

2.80

0.65

TOP VIEW

END VIEW

RECOMMENDED

SOLDERING FOOTPRINT*

SIDE VIEW

H_E

3.00

0.80

DIMENSION: MILLIMETERS

BOTTOM VIEW

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

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USA/Canada

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Phone: 421 33 790 2910

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Phone: 81−3−5817−1050

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For additional information, please contact your local

Sales Representative

NZ3F2V4T1/D

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