NZ9F13VST5G [ONSEMI]
Zener Voltage Regulators 200 mW SOD−923 Surface Mount; 齐纳稳压器为200 mW SOD- 923表面贴装
| 型号： | NZ9F13VST5G |
| 厂家： | 
ONSEMI |
| 描述： | Zener Voltage Regulators 200 mW SOD−923 Surface Mount |
| 文件： | 总4页 (文件大小：95K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NZ9F2V4ST5G SERIES
Zener Voltage Regulators
200 mW SOD−923 Surface Mount
This series of Zener diodes is packaged in a SOD−923 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
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Specification Features
1
2
• Standard Zener Breakdown Voltage Range −2.4 V to 18 V
• Steady State Power Rating of 200 mW
Cathode
Anode
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.40 mm)
MARKING
DIAGRAM
2
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Tight Tolerance V
1
Z
X MG
• These are Pb−Free Devices
SOD−923
CASE 514AB
G
1
2
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
X
M
G
= Specific Device Code
= Month Code
= Pb−Free Package
(Note: Microdot may be in either location)
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
MAXIMUM RATINGS
Device
Package
Shipping†
Rating
Symbol
Max
Unit
NZ9FxxxST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
Total Device Dissipation FR−5 Board,
P
D
(Note 1) @ T = 25°C
200
1.5
mW
A
Derate above 25°C
mW/°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Thermal Resistance from
Junction−to−Ambient
R
635
°C/W
q
JA
Junction and Storage Temperature Range
T , T
−65 to
+150
°C
J
stg
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
May, 2008 − Rev. 0
NZ9F2V4S/D
NZ9F2V4ST5G SERIES
ELECTRICAL CHARACTERISTICS
(T = 25°C unless otherwise noted,
A
I
V = 0.9 V Max. @ I = 10 mA for all types)
F
F
I
F
Symbol
Parameter
V
Reverse Zener Voltage @ I
Reverse Current
Z
ZT
I
ZT
Z
Maximum Zener Impedance @ I
Reverse Current
ZT
ZK
ZT
V
Z
V
R
V
I
V
F
R
ZT
I
ZK
I
Z
Maximum Zener Impedance @ I
ZK
I
Reverse Leakage Current @ V
Reverse Voltage
R
R
V
R
I
F
Forward Current
V
Forward Voltage @ I
F
F
Figure 1. Zener Voltage Regulator
QV
Maximum Temperature Coefficient of V
Z
Z
C
Max. Capacitance @V = 0 and f = 1 MHz
R
100
80
60
40
20
0
0
25
50
75
100
125
150
TEMPERATURE (°C)
Figure 2. Steady State Power Derating
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2
NZ9F2V4ST5G SERIES
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
Z
ZT
Zener Voltage
VZ
Max
IR @ VR
d
@ I
/dt (mV/k)
VZ
I = IZT
Z
I
Z
Z
ZK
= 5 mA
Max
ZT1
@ 10%
Mod W
Max
Test
Current
Izt mA
CpF Max @
= 0
f = 1 MHz
= 1.0
mA W
Max
Device
Marking
I
ZK
mA
V
R
Min
Max
mA
V
Min
Device
NZ9F2V4ST5G
NZ9F2V7ST5G
NZ9F3V0ST5G
NZ9F3V3ST5G
NZ9F3V6ST5G
NZ9F3V9ST5G
NZ9F4V3ST5G
NZ9F4V7ST5G
NZ9F5V1ST5G
NZ9F5V6ST5G
NZ9F6V2ST5G
NZ9F6V8ST5G
NZ9F7V5ST5G
NZ9F8V2ST5G
NZ9F9V1ST5G
NZ9F10VST5G
NZ9F11VST5G
NZ9F12VST5G
NZ9F13VST5G
NZ9F15VST5G
NZ9F16VST5G
NZ9F18VST5G
2*
3*
2.43
2.67
2.94
3.32
3.6
2.63
2.91
3.26
3.53
3.85
4.16
4.43
4.75
5.2
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
100
100
100
100
100
100
100
100
80
1000
1000
1000
1000
1000
1000
1000
800
500
200
100
60
1
50
20
10
10
10
5
1
1
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−2.7
−2.0
0.4
0
0
210
210
210
210
210
210
210
150
130
115
110
105
100
90
1
4*
1
1
0
5*
1
1
0
6*
1
1
0
A**
D**
E**
F**
J**
K**
L**
P**
Q**
R**
T**
V**
Y**
2**
3**
4**
5**
3.89
4.17
4.55
4.989
5.49
6.06
6.65
7.28
8.02
8.85
9.77
10.76
11.74
12.91
14.34
15.85
17.56
1
1
−2.5
0
1
5
1
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
2
1
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7
2
1.5
2.5
3
5.73
6.33
6.93
7.6
60
1
60
1
40
0.5
0.5
0.5
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.5
4
1.2
30
60
2.5
8.36
9.23
10.21
11.22
12.24
13.49
14.98
16.51
18.35
30
60
5
3.2
30
60
6
3.8
80
30
60
7
4.5
8
80
30
60
8
5.4
9
80
30
80
9
6
10
11
13
14
16
80
37
80
10
11
12
14
7
75
42
80
9.2
70
50
80
10.4
12.4
65
50
80
60
*Rotated 90°.
**Rotated 180°.
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3
NZ9F2V4ST5G SERIES
PACKAGE DIMENSIONS
SOD−923
CASE 514AB−01
ISSUE B
−X−
D
NOTES:
−Y−
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
E
1
2
b 2X
0.08 (0.0032) X Y
MILLIMETERS
DIM MIN NOM MAX
INCHES
NOM MAX
MIN
A
A
b
c
0.34
0.15
0.07
0.75
0.55
0.95
0.05
0.37
0.20
0.12
0.80
0.60
1.00
0.10
0.40
0.25
0.17
0.85
0.65
1.05
0.15
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.002 0.004 0.006
D
E
H
E
L
c
L
H
E
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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NZ9F2V4S/D
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