PCA9654EA3MNTWG [ONSEMI]

IC SPECIALTY INTERFACE CIRCUIT, Interface IC:Other;
PCA9654EA3MNTWG
型号: PCA9654EA3MNTWG
厂家: ONSEMI    ONSEMI
描述:

IC SPECIALTY INTERFACE CIRCUIT, Interface IC:Other

接口集成电路
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PCA9654E, PCA9654EA  
8-bit I/O Expander for I2C  
Bus and SMBus with  
Interrupt  
The PCA9654E/PCA9654EA provides 8 bits of General Purpose  
2
parallel Input/Output (GPIO) expansion for I C−bus/SMBus  
applications.  
http://onsemi.com  
MARKING  
The PCA9654E/PCA9654EA consists of 8−bit Configuration  
(Input or Output selection); Input, Output and Polarity Inversion  
(active HIGH or active LOW operation) registers. The system master  
may set the I/Os as either inputs or outputs by writing to the I/O  
configuration bits. The data for each Input or Output is kept in the  
corresponding Input or Output register. The polarity of the read  
register can be inverted with the Polarity Inversion register. All  
registers can be read by the system master.  
DIAGRAMS  
16  
1
1
PCA9654E  
AWLYWWG  
SOIC−16  
D SUFFIX  
CASE 751B  
The PCA9654E/PCA9654EA open−drain interrupt (INT) output is  
activated when any input state differs from its corresponding input  
port register state and is used to indicate to the system master that an  
input state has changed. The power−on reset sets the registers to their  
default values and initializes the device state machine.  
16  
PCA9  
654E  
ALYWG  
G
1
TSSOP−16  
DT SUFFIX  
CASE 948F  
2
1
1
Three hardware pins (AD0, AD1, AD2) vary the fixed I C bus  
2
address and allow up to 64 devices to share the same I C−bus/SMBus.  
16  
The PCA9654EA has a different address map from the PCA9654E.  
Features  
XXMG  
1
V Operating Range: 1.65 V to 5.5 V  
DD  
G
WQFN16  
MT SUFFIX  
CASE 488AP  
SDA Sink Capability: 30 mA  
5.5 V Tolerant I/Os  
Polarity Inversion Register  
16  
Active LOW Interrupt Output  
Low Standby Current  
1
1
XXXX  
XXXX  
ALYWG  
G
1
QFN16 3x3  
MN SUFFIX  
CASE 485G  
Noise Filter on SCL/SDA Inputs  
No Glitch on Power−up  
Internal Power−on Reset  
16  
64 Programmable Slave Addresses Using 3 Address Pins  
8 I/O Pins which Default to 8 Inputs  
XXXXXX  
XXXXXX  
ALYWG  
G
1
2
QFN16 4x4  
MN SUFFIX  
CASE 485AP  
I C SCL Clock Frequencies Supported:  
Standard Mode: 100 kHz  
Fast Mode: 400 kHz  
Fast Mode +: 1 MHz  
XXXX = Specific Device Code  
A
M
= Assembly Location  
ESD Performance: 4000 V Human Body Model,  
400 V Machine Model  
= Date Code / Assembly Location  
WL, L = Wafer Lot  
= Year  
WW, W = Work Week  
Y
These are Pb−Free Devices  
G or G = Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 17 of this data sheet.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
May, 2014 − Rev. 1  
PCA9654E/D  
PCA9654E, PCA9654EA  
BLOCK DIAGRAM  
Remark: All I/Os are set to inputs at reset.  
Figure 1. Block Diagram  
data from  
output port  
shift register  
register data  
configuration  
register  
V
DD  
data from  
shift register  
Q1  
D
Q
100 kW  
FF  
write  
configuration  
pulse  
D
Q
CK  
Q
FF  
I/O pin  
Q2  
write pulse  
CK  
V
input port  
register  
SS  
output port  
register  
D
Q
input port  
register data  
FF  
read pulse  
CK  
to INT  
polarity inversion  
register  
data from  
shift register  
polarity  
inversion  
register data  
D
Q
FF  
write polarity  
pulse  
CK  
At power−on reset, all registers return to default values.  
Figure 2. Simplified Schematic of I/Os  
http://onsemi.com  
2
 
PCA9654E, PCA9654EA  
PIN ASSIGNMENT  
terminal 1  
index area  
1
AD2  
IO0  
IO1  
IO2  
12 SCL  
11  
2
3
4
INT  
10 IO7  
PCA9654E  
PCA9654EA  
16 V  
1
2
3
4
5
6
7
8
AD0  
AD1  
AD2  
IO0  
IO1  
IO2  
IO3  
DD  
15  
14  
13  
12  
11  
SDA  
SCL  
INT  
IO7  
IO6  
9
IO6  
PCA9654E  
PCA9654EA  
10 IO5  
9
IO4  
V
SS  
Transparent top view  
Figure 4. WQFN16 / QFN16  
Figure 3. SOIC16 / TSSOP16  
Table 1. PIN DESCRIPTIONS  
Pin  
SOIC16, TSSOP16  
QFN16, WQFN16  
Symbol  
AD0  
AD1  
AD2  
IO0  
Description  
1
2
15  
16  
1
Address Input 0  
Address Input 1  
Address Input 2  
I/O 0  
3
4
2
IO1  
5
3
I/O 1  
IO2  
6
4
I/O 2  
IO3  
7
5
I/O 3  
V
8
6
Supply Ground  
I/O 4  
SS  
IO4  
IO5  
IO6  
IO7  
INT  
SCL  
SDA  
9
7
10  
11  
12  
13  
14  
15  
16  
8
I/O 5  
9
I/O 6  
10  
11  
12  
13  
14  
I/O 7  
Interrupt Output (active−LOW)  
Serial Clock Line  
Serial Data Line  
Supply Voltage  
V
DD  
http://onsemi.com  
3
PCA9654E, PCA9654EA  
Table 2. MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
−0.5 to +7.0  
−0.5 to +7.0  
$20  
Unit  
V
V
DD  
DC Supply Voltage  
V
Input / Output Pin Voltage  
Input Current  
V
I/O  
I
mA  
mA  
mA  
mA  
mW  
mW  
°C  
I
I
O
Output Current  
$50  
I
DC Supply Current  
$100  
DD  
I
DC Ground Current  
Total Power Dissipation  
Power Dissipation per Output  
Storage Temperature Range  
$200  
GND  
P
400  
TOT  
OUT  
STG  
P
T
100  
−65 to +150  
260  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature Under Bias  
Thermal Resistance  
°C  
L
T
150  
°C  
J
q
SOIC−16 (Note 1)  
TSSOP−16  
82  
124  
79  
°C/W  
JA  
WQFN16  
3 x 3 QFN16  
4 x 4 QFN16  
80  
80  
P
Power Dissipation in Still Air at 85°C  
Moisture Sensitivity  
190  
Level 1  
mW  
D
MSL  
F
R
Flammability Rating  
Oxygen Index: 28 to 34  
UL 94 V−0 @ 0.125 in  
V
ESD  
ESD Withstand Voltage  
Human Body Model (Note 2)  
Machine Model (Note 3)  
Charged Device Model (Note 4)  
> 4000  
> 400  
N/A  
V
I
Latchup Performance Above V and Below GND at 125°C (Note 5)  
$300  
mA  
LATCHUP  
CC  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.  
2. Tested to EIA / JESD22−A114−A.  
3. Tested to EIA / JESD22−A115−A.  
4. Tested to JESD22−C101−A.  
5. Tested to EIA / JESD78.  
Table 3. RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
1.65  
0
Max  
5.5  
Unit  
V
V
DD  
Positive DC Supply Voltage  
V
I/O  
Switch Input / Output Voltage  
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
5.5  
V
T
A
−55  
0
+125  
5
°C  
Dt / DV  
nS/V  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
http://onsemi.com  
4
 
PCA9654E, PCA9654EA  
Table 4. DC ELECTRICAL CHARACTERISTICS V = 1.65 V to 5.5 V, unless otherwise specified.  
DD  
T
= −555C to +1255C  
A
Min  
Typ  
Max  
Symbol  
Parameter  
Conditions  
Unit  
SUPPLIES  
I
Supply Current  
Operating mode; no load;  
mA  
DD  
V = V or 0 V; f  
= 1 MHz  
= 100 kHz  
250  
104  
500  
175  
I
DD  
SCL  
SCL  
V = V or 0 V; f  
I
DD  
I
Standby Current  
Standby mode; no load;  
mA  
STB  
V = 0 V; f  
= 0 Hz; I/O = inputs  
= 0 Hz; I/O = inputs  
DD SCL  
550  
0.25  
700  
1
I
SCL  
V = V ; f  
I
V
POR  
Power−On Reset Voltage (Note 6)  
1.5  
V
INPUT SCL; Input / Output SDA  
V
High−Level Input Voltage  
Low−Level Input Voltage  
Low−Level Output Current  
0.7 x V  
V
V
IH  
DD  
V
I
0.3 x V  
IL  
DD  
mA  
V
V
= 0.4 V; V < 2.3 V  
10  
20  
OL  
OL  
DD  
= 0.4 V; V w 2.3 V  
OL  
DD  
I
Leakage Current  
Input Capacitance  
V = V or GND  
$1  
mA  
L
I
DD  
C
V = GND  
I
6
pF  
I
I/Os  
V
High−Level Input Voltage  
Low−Level Input Voltage  
2.3 V V 5.5 V  
2.0  
0.7 x V  
V
V
IH  
CC  
1.65 V V 2.3 V  
CC  
DD  
V
2.3 V V 5.5 V  
0.8  
0.3 x V  
IL  
CC  
1.65 V V 2.3 V  
CC  
DD  
I
OL  
Low−Level Output Current  
(Note 7)  
V
OL  
V
OL  
V
OL  
V
OL  
= 0.5 V; V = 1.65 V  
8
13  
22  
28  
37  
mA  
DD  
= 0.5 V; V = 2.3 V  
12  
17  
25  
DD  
= 0.5 V; V = 3.0 V  
DD  
= 0.5 V; V = 4.5 V  
DD  
I
Total Low−Level Output Current  
(Note 7)  
V
= 0.5 V; V = 4.5 V  
200  
mA  
V
OL(tot)  
OL  
DD  
V
OH  
High−Level Output Voltage  
I
I
I
I
I
I
I
I
= −3 mA; V = 1.65 V  
1.2  
1.1  
1.8  
1.7  
2.6  
2.5  
4.1  
4.0  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
DD  
= −4 mA; V = 1.65 V  
DD  
= −8 mA; V = 2.3 V  
DD  
= −10 mA; V = 2.3 V  
DD  
= −8 mA; V = 3.0 V  
DD  
= −10 mA; V = 3.0 V  
DD  
= −8 mA; V = 4.5 V  
DD  
= −10 mA; V = 4.5 V  
DD  
I
Input Leakage Current  
Input Leakage Current  
V
V
= 5.5 V; V = V  
DD  
1
mA  
mA  
pF  
LH  
DD  
I
I
= 5.5 V; V = GND  
−100  
5
LL  
DD  
I
C
Input / Output Capacitance  
(Note 8)  
3.7  
2.1  
I/O  
INTERRUPT (INT)  
I
OL  
Low−Level Output Current  
Output Capacitance  
V
OL  
= 0.4 V  
6
mA  
pF  
C
5
O
INPUTS AD0, AD1, AD2  
High−Level Input Voltage  
V
IH  
2.3 V V 5.5 V  
2.0  
0.7 x V  
V
V
CC  
1.65 V V 2.3 V  
CC  
DD  
V
IL  
Low−Level Input Voltage  
2.3 V V 5.5 V  
0.8  
0.3 x V  
CC  
1.65 V V 2.3 V  
CC  
DD  
I
Leakage Current  
Input Capacitance  
V = V or GND  
$1  
mA  
L
I
DD  
C
2.4  
5
pF  
I
2
6. The power−on reset circuit resets the I C bus logic with V < V  
and set all I/Os to logic 1 upon power−up. Thereafter, V must be lower  
DD  
DD  
POR  
than 0.2 V to reset the part.  
7. Each bit must be limited to a maximum of 25 mA and the total package limited to 200 mA due to internal bussing limits.  
8. The value is not tested, but verified on sampling basis.  
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5
 
PCA9654E, PCA9654EA  
Table 5. AC ELECTRICAL CHARACTERISTICS V = 1.65 V to 5.5 V; T = −55°C to +125°C, unless otherwise specified.  
DD  
A
Standard  
Mode  
Fast Mode  
Fast Mode +  
Min  
Max  
Min  
0
Max  
Min  
0
Max  
Symbol  
Parameter  
SCL Clock Frequency  
Unit  
MHz  
ms  
f
0
0.1  
0.4  
1.0  
SCL  
BUF  
t
Bus−Free Time between a STOP and START  
Condition  
4.7  
1.3  
0.5  
t
Hold Time (Repeated) START Condition  
4.0  
4.7  
0.6  
0.6  
0.26  
0.26  
ms  
ms  
HD:STA  
t
Setup Time for a Repeated START Condition  
SU:STA  
t
Setup Time for STOP Condition  
4.0  
0.6  
0.26  
ms  
SU:STO  
t
Data Hold Time  
0
0
0
ns  
ms  
ns  
ns  
ms  
ms  
ns  
HD:DAT  
t
Data Valid Acknowledge Time (Note 9)  
Data Valid Time (Note 10)  
Data Setup Time  
0.3  
300  
250  
4.7  
4.0  
3.45  
0.1  
50  
0.9  
0.05  
50  
0.45  
450  
VD:ACK  
t
t
VD:DAT  
100  
1.3  
0.6  
50  
SU:DAT  
t
LOW Period of SCL  
0.5  
0.26  
LOW  
t
HIGH Period of SCL  
HIGH  
t
f
Fall Time of SDA and SCL (Notes 12 and 13)  
300  
1000  
50  
20 + 0.1C  
(Note 11)  
300  
300  
50  
120  
120  
50  
b
t
r
Rise Time of SDA and SCL  
20 + 0.1C  
(Note 11)  
ns  
ns  
b
t
SP  
Pulse Width of Spikes Suppressed by Input Filter  
(Note 14)  
PORT TIMING: C v 100 pF (See Figures 7 and 10)  
L
t
Data Output Valid Time  
Data Input Setup Time  
Data Input Hold Time  
350  
350  
350  
ns  
ns  
ms  
V(Q)  
t
100  
1
100  
1
100  
1
SU(D)  
t
H(D)  
INTERRUPT TIMING: C v 100 pF (See Figure 10)  
V(INT_N)  
L
t
Data Valid Time  
4
4
4
4
4
4
ms  
ms  
t
Reset Delay Time  
RST(INT_N)  
9. t  
10.t  
= time for Acknowledgment signal from SCL LOW to SDA (out) LOW.  
= minimum time for SDA data out to be valid following SCL LOW.  
VD:ACK  
VD:DAT  
11. C = total capacitance of one bus line in pF.  
b
12.A master device must internally provide a hold time of al least 300 ns for the SDA signal (refer to V of the SCL signal) in order to bridge  
IL  
the undefined region SCL’s falling edge.  
13.The maximum t for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage t is specified at 250 ns.  
f
f
This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding  
the maximum specified t .  
f
14.Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns.  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
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6
 
PCA9654E, PCA9654EA  
slave address  
A3  
Device Address  
Following a START condition, the bus master must send  
the address of the slave it is accessing and the operation it  
wants to perform (read or write). The address of the  
PCA9654E/PCA9654EA is shown in Figure 5. Slave  
address pins AD2, AD1, and AD0 choose 1 of 64 slave  
addresses. To conserve power, no internal pull−up resistors  
are incorporated on AD2, AD1, and AD0. Address values  
can be found on Table 6 “PCA9654E Address Map” and  
Table 7 “PCA9654EA Address Map”.  
A6  
A5  
A4  
A2  
A1  
A0  
R/W  
programmable  
Figure 5. PCA9654E / PCA9654EA Device Address  
A logic 1 on the last bit of the first byte selects a read operation while a logic 0 selects a write operation.  
Table 6. PCA9654E ADDRESS MAP  
Address Input  
AD1  
Slave Address  
A3  
AD2  
GND  
GND  
GND  
GND  
VDD  
VDD  
VDD  
VDD  
GND  
GND  
GND  
GND  
VDD  
VDD  
VDD  
VDD  
GND  
GND  
GND  
GND  
VDD  
VDD  
VDD  
VDD  
GND  
GND  
GND  
GND  
VDD  
VDD  
VDD  
AD0  
GND  
VDD  
GND  
VDD  
GND  
VDD  
GND  
VDD  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
GND  
VDD  
GND  
VDD  
GND  
VDD  
GND  
VDD  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
SCL  
A6  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A5  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
A4  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A2  
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
A1  
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
A0  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
HEX  
20h  
22h  
24h  
26h  
28h  
2Ah  
2Ch  
2Eh  
30h  
32h  
34h  
36h  
38h  
3Ah  
3Ch  
3Eh  
40h  
42h  
44h  
46h  
48h  
4Ah  
4Ch  
4Eh  
50h  
52h  
54h  
56h  
58h  
5Ah  
5Ch  
SCL  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
GND  
GND  
VDD  
VDD  
GND  
GND  
VDD  
VDD  
GND  
GND  
VDD  
VDD  
GND  
GND  
VDD  
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7
 
PCA9654E, PCA9654EA  
Table 6. PCA9654E ADDRESS MAP  
Address Input  
Slave Address  
AD2  
VDD  
SCL  
SCL  
SCL  
SCL  
SDA  
SDA  
SDA  
SDA  
SCL  
SCL  
SCL  
SCL  
SDA  
SDA  
SDA  
SDA  
SCL  
SCL  
SCL  
SCL  
SDA  
SDA  
SDA  
SDA  
SCL  
SCL  
SCL  
SCL  
SDA  
SDA  
SDA  
SDA  
AD1  
VDD  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
GND  
GND  
VDD  
VDD  
GND  
GND  
VDD  
VDD  
GND  
GND  
VDD  
VDD  
GND  
GND  
VDD  
VDD  
AD0  
SDA  
GND  
VDD  
GND  
VDD  
GND  
VDD  
GND  
VDD  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
GND  
VDD  
GND  
VDD  
GND  
VDD  
GND  
VDD  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
A6  
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
A5  
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
A4  
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
A3  
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A2  
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A1  
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A0  
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
HEX  
5Eh  
A0h  
A2h  
A4h  
A6h  
A8h  
AAh  
ACh  
AEh  
B0h  
B2h  
B4h  
B6h  
B8h  
BAh  
BCh  
BEh  
C0h  
C2h  
C4h  
C6h  
C8h  
CAh  
CCh  
CEh  
E0h  
E2h  
E4h  
E6h  
E8h  
EAh  
ECh  
EEh  
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8
PCA9654E, PCA9654EA  
Table 7. PCA9654EA ADDRESS MAP  
Address Input  
Slave Address  
AD2  
VSS  
VSS  
VSS  
VSS  
VDD  
VDD  
VDD  
VDD  
VSS  
VSS  
VSS  
VSS  
VDD  
VDD  
VDD  
VDD  
VSS  
VSS  
VSS  
VSS  
VDD  
VDD  
VDD  
VDD  
VSS  
VSS  
VSS  
VSS  
VDD  
VDD  
VDD  
VDD  
SCL  
SCL  
SCL  
SCL  
SDA  
SDA  
SDA  
SDA  
SCL  
AD1  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
VSS  
VSS  
VDD  
VDD  
VSS  
VSS  
VDD  
VDD  
VSS  
VSS  
VDD  
VDD  
VSS  
VSS  
VDD  
VDD  
SCL  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
SCL  
AD0  
VSS  
VDD  
VSS  
VDD  
VSS  
VDD  
VSS  
VDD  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
VSS  
VDD  
VSS  
VDD  
VSS  
VDD  
VSS  
VDD  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
VSS  
VDD  
VSS  
VDD  
VSS  
VDD  
VSS  
VDD  
SCL  
A6  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
A5  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
A4  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A3  
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
A2  
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
A1  
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
A0  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
HEX  
10h  
12h  
14h  
16h  
18h  
1Ah  
1Ch  
1Eh  
60h  
62h  
64h  
66h  
68h  
6Ah  
6Ch  
6Eh  
70h  
72h  
74h  
76h  
78h  
7Ah  
7Ch  
7Eh  
80h  
82h  
84h  
86h  
88h  
8Ah  
8Ch  
8Eh  
90h  
92h  
94h  
96h  
98h  
9Ah  
9Ch  
9Eh  
D0h  
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9
 
PCA9654E, PCA9654EA  
Table 7. PCA9654EA ADDRESS MAP  
Address Input  
Slave Address  
AD2  
SCL  
SCL  
SCL  
SDA  
SDA  
SDA  
SDA  
SCL  
SCL  
SCL  
SCL  
SDA  
SDA  
SDA  
SDA  
SCL  
SCL  
SCL  
SCL  
SDA  
SDA  
SDA  
SDA  
AD1  
SCL  
SDA  
SDA  
SCL  
SCL  
SDA  
SDA  
VSS  
VSS  
VDD  
VDD  
VSS  
VSS  
VDD  
VDD  
VSS  
VSS  
VDD  
VDD  
VSS  
VSS  
VDD  
VDD  
AD0  
SDA  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
VSS  
VDD  
VSS  
VDD  
VSS  
VDD  
VSS  
VDD  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
SCL  
SDA  
A6  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
A5  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
A4  
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
A3  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
A2  
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A1  
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A0  
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
HEX  
D2h  
D4h  
D6h  
D8h  
DAh  
DCh  
DEh  
F0h  
F2h  
F4h  
F6h  
− (Note 15)  
FAh  
FCh  
FEh  
− (Note 15)  
02h  
04h  
06h  
08h  
0Ah  
0Ch  
0Eh  
15.The PCA9654EA does not acknowledge this AD2, AD1 and AD0 configuration.  
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10  
 
PCA9654E, PCA9654EA  
REGISTERS  
Command Byte  
Table 8. COMMAND BYTE  
COMMAND  
PROTOCOL  
REGISTER  
0
1
2
3
Read byte  
Input Port  
Read / Write byte  
Read / Write byte  
Read / Write byte  
Output Port  
Polarity Inversion  
Configuration  
The command byte is the first byte to follow the address  
byte during a write transmission. It is used as a pointer to  
determine which of the following registers will be written or  
read.  
Register 0 − Input Port Register  
This register is a read−only port. It reflects the incoming  
logic levels of the pins, regardless of whether the pin is  
defined as an input or an output by Register 3. Writes to this  
register have no effect.  
The default ‘X’ is determined by the externally applied  
logic level, normally ‘1’ when no external signal externally  
applied because of the internal pull−up resistors.  
Table 9. INPUT PORT REGISTER  
Bit  
7
I7  
R
X
6
I6  
R
X
5
I5  
R
X
4
I4  
R
X
3
I3  
R
X
2
I2  
R
X
1
I1  
R
X
0
I0  
R
X
Symbol  
Access  
Default  
Register 1 − Output Port Register  
This register reflects the outgoing logic levels of the pins  
defined as outputs by Register 3. Bit values in this register  
have no effect on pins defined as inputs. Reads from this  
register return the value that is in the flip−flop controlling the  
output selection, not the actual pin value.  
Table 10. OUTPUT PORT REGISTER  
Bit  
7
O7  
R/W  
1
6
O6  
R/W  
1
5
O5  
R/W  
1
4
O4  
R/W  
1
3
O3  
R/W  
1
2
O2  
R/W  
1
1
O1  
R/W  
1
0
O0  
R/W  
1
Symbol  
Access  
Default  
Register 2 − Polarity Inversion Register  
This register allows the user to invert the polarity of the  
Input Port register data. If a bit in this register is set (written  
with ‘1’), the corresponding Input Port data is inverted. If a  
bit in this register is cleared (written with a ‘0’), the Input  
Port data polarity is retained.  
Table 11. POLARITY INVERSION REGISTER  
Bit  
7
N7  
R/W  
0
6
N6  
R/W  
0
5
N5  
R/W  
0
4
N4  
R/W  
0
3
N3  
R/W  
0
2
N2  
R/W  
0
1
N1  
R/W  
0
0
N0  
R/W  
0
Symbol  
Access  
Default  
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11  
PCA9654E, PCA9654EA  
Register 3 − Configuration Register  
This register configures the directions of the I/O pins. If  
a bit in this register is set, the corresponding port pin is  
enabled as an input with high−impedance output driver. If a  
bit in this register is cleared, the corresponding port pin is  
enabled as an output. At reset, the I/Os are configured as  
inputs with a weak pull−up to V  
.
DD  
Table 12. CONFIGURATION REGISTER  
Bit  
7
C7  
R/W  
1
6
C6  
R/W  
1
5
C5  
R/W  
1
4
C4  
R/W  
1
3
C3  
R/W  
1
2
C2  
R/W  
1
1
C1  
R/W  
1
0
C0  
R/W  
1
Symbol  
Access  
Default  
Power−on Reset  
I/O Port (Figure 2)  
When power is applied to V , an internal Power−On  
Reset (POR) holds the PCA9654E/PCA9654EA in a reset  
When an I/O is configured as an input, FETs Q1 and Q2  
are off, creating a high−impedance input with a weak  
DD  
condition until V has reached V  
. At that point, the  
POR  
pull−up (100 kW typ.) to V . The input voltage may be  
DD  
DD  
reset condition is released and the PCA9654E/ PCA9654EA  
registers and state machine will initialize to their default  
raised above V to a maximum of 5.5 V.  
DD  
If the I/O is configured as an output, then either Q1 or Q2  
is enabled, depending on the state of the Output Port register.  
Care should be exercised if an external voltage is applied to  
an I/O configured as an output because of the  
low−impedance paths that exist between the pin and either  
states. Thereafter, V must be lowered below 0.2 V to reset  
DD  
the device.  
For a power reset cycle, V must be lowered below  
DD  
0.2 V and then restored to the operating voltage. Please refer  
to application note AN# TBD for recommended power−on  
sequence and power−reset cycle profile.  
V
DD  
or V .  
SS  
Interrupt Output  
The open−drain interrupt output is activated when one of  
the port pins changes state and the pin is configured as an  
input. The interrupt is deactivated when the input returns to  
its previous state or the Input Port register is read.  
Note that changing an I/O from an output to an input may  
cause a false interrupt to occur if the state of the pin does not  
match the contents of the Input Port register.  
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12  
PCA9654E, PCA9654EA  
BUS TRANSACTIONS  
Data is transmitted to the PCA9654E/PCA9654EA  
Figure 9. These devices do not implement an  
auto−increment function, so once a command byte has been  
sent, the register which was addressed will continue to be  
accessed by reads until a new command byte has been sent.  
registers using the Write mode as shown in Figure 6 and  
Figure 7. Data is read from the PCA9654E/PCA9654EA  
registers using the Read mode as shown in Figure 8 and  
Figure 6. Write to Output Port Registers  
Figure 7. Write to Configuration or Polarity Inversion Register  
Figure 8. Read from Register  
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13  
 
PCA9654E, PCA9654EA  
Figure 9. Read Input Port Register  
APPLICATION INFORMATION  
Figure 10. Typical Application  
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14  
PCA9654E, PCA9654EA  
Characteristics of the I2C−Bus  
Bit Transfer  
2
The I C−bus is for 2−way, 2−line communication between  
different ICs or modules. The two lines are a serial data line  
(SDA) and a serial clock line (SCL). Both lines must be  
connected to a positive supply via a pull−up resistor when  
connected to the output stages of a device. Data transfer may  
be initiated only when the bus is not busy.  
One data bit is transferred during each clock pulse. The  
data on the SDA line must remain stable during the HIGH  
period of the clock pulse as changes in the data line at this  
time will be interpreted as control signals (see Figure 11).  
SDA  
SCL  
data line  
stable;  
change  
of data  
data valid  
allowed  
Figure 11. Bit Transfer  
START and STOP Conditions  
Both data and clock lines remain HIGH when the bus is  
not busy. A HIGH−to−LOW transition of the data line while  
the clock is HIGH is defined as the START condition (S). A  
LOW−to−HIGH transition of the data line while the clock is  
HIGH is defined as the STOP condition (P) (see Figure 12).  
SDA  
SDA  
SCL  
SCL  
S
P
STOP condition  
START condition  
Figure 12. Definition of START and STOP Conditions  
System Configuration  
A device generating a message is a ‘transmitter’; a device  
receiving is the ‘receiver’. The device that controls the  
message is the ‘master’ and the devices which are controlled  
by the master are the ‘slaves’ (see Figure 13).  
SDA  
SCL  
SLAVE  
TRANSMITTER/  
RECEIVER  
MASTER  
2
MASTER  
TRANSMITTER/  
RECEIVER  
SLAVE  
RECEIVER  
MASTER  
TRANSMITTER  
I C−BUS  
TRANSMITTER/  
RECEIVER  
MULTIPLEXER  
SLAVE  
Figure 13. System Configuration  
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15  
 
PCA9654E, PCA9654EA  
Acknowledge  
The number of data bytes transferred between the START  
and the STOP conditions from transmitter to receiver is not  
limited. Each byte of eight bits is followed by one  
acknowledge bit. The acknowledge bit is a HIGH level put  
on the bus by the transmitter, whereas the master generates  
an extra acknowledge related clock pulse.  
A slave receiver which is addressed must generate an  
acknowledge after the reception of each byte. Also a master  
must generate an acknowledge after the reception of each  
byte that has been clocked out of the slave transmitter. The  
device that acknowledges has to pull down the SDA line  
during the acknowledge clock pulse, so that the SDA line is  
stable LOW during the HIGH period of the acknowledge  
related clock pulse; set−up time and hold time must be taken  
into account.  
A master receiver must signal an end of data to the  
transmitter by not generating an acknowledge on the last  
byte that has been clocked out of the slave. In this event, the  
transmitter must leave the data line HIGH to enable the  
master to generate a STOP condition.  
data output  
by transmitter  
not acknowledge  
acknowledge  
data output  
by receiver  
SCL from master  
1
2
8
9
S
clock pulse for  
START  
acknowledgement  
condition  
Figure 14. Acknowledgement of the I2C Bus  
TIMING AND TEST SETUP  
SDA  
SCL  
t
t
t
t
SP  
t
r
f
HD;STA  
BUF  
t
LOW  
t
t
t
SU;STO  
HD;STA  
SU;STA  
t
t
t
SU;DAT  
HD;DAT  
HIGH  
P
S
Sr  
P
Figure 15. Definition of Timing on the I2C Bus  
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16  
PCA9654E, PCA9654EA  
V
DD  
open  
GND  
V
R
500 W  
DD  
L
V
I
V
O
PULSE  
DUT  
GENERATOR  
C
50 pF  
L
R
T
R = load resistor.  
L
C = load capacitance includes jig and probe capacitance.  
L
R = termination resistance should be equal to the output impedance of Z of the pulse generators.  
T
o
Figure 16. Test Circuitry for Switching Times  
R
L
2V  
DD  
S1  
from output under test  
open  
GND  
500 W  
C
50 pF  
R
L
500 W  
L
Figure 17. Load Circuit  
Package  
ORDERING INFORMATION  
Device  
Shipping  
PCA9654EDR2G  
SOIC−16  
(Pb−Free)  
2500 / Tape & Reel  
2500 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
2000 / Tape & Reel  
2500 / Tape & Reel  
2500 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
2000 / Tape & Reel  
PCA9654EDTR2G  
TSSOP−16  
(Pb−Free)  
PCA9654EMTTBG  
(In Development)  
WQFN16  
(Pb−Free)  
PCA9654E3MNTWG  
(In Development)  
QFN16 (3x3)  
(Pb−Free)  
PCA9654E4MNTWG  
(In Development)  
QFN16 (4x4)  
(Pb−Free)  
PCA9654EADR2G  
(In Development)  
SOIC−16  
(Pb−Free)  
PCA9654EADTR2G  
(In Development)  
TSSOP−16  
(Pb−Free)  
PCA9654EAMTTBG  
(In Development)  
WQFN16  
(Pb−Free)  
PCA9654EA3MNTWG  
(In Development)  
QFN16 (3x3)  
(Pb−Free)  
PCA9654EA4MNTWG  
(In Development)  
QFN16 (4x4)  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
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17  
PCA9654E, PCA9654EA  
PACKAGE DIMENSIONS  
SOIC−16  
CASE 751B−05  
ISSUE K  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
−A−  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
16  
9
8
−B−  
P 8 PL  
M
S
B
0.25 (0.010)  
1
MILLIMETERS  
INCHES  
MIN  
0.386  
DIM MIN  
MAX  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
10.00  
G
4.00 0.150  
1.75 0.054  
0.49 0.014  
1.25 0.016  
F
R X 45  
K
_
G
J
1.27 BSC  
0.050 BSC  
0.19  
0.10  
0
0.25 0.008  
0.25 0.004  
0.009  
0.009  
7
K
M
P
R
C
7
0
_
_
_
_
−T−  
SEATING  
PLANE  
5.80  
0.25  
6.20 0.229  
0.50 0.010  
0.244  
0.019  
J
M
D
16 PL  
M
S
S
0.25 (0.010)  
T B  
A
SOLDERING FOOTPRINT  
8X  
6.40  
16X  
1.12  
1
16  
16X  
0.58  
1.27  
PITCH  
8
9
DIMENSIONS: MILLIMETERS  
http://onsemi.com  
18  
PCA9654E, PCA9654EA  
PACKAGE DIMENSIONS  
TSSOP−16  
CASE 948F  
ISSUE B  
16X KREF  
NOTES:  
M
S
S
0.10 (0.004)  
T U  
V
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
S
0.15 (0.006) T U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH. PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL  
IN EXCESS OF THE K DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
K
K1  
16  
9
2X L/2  
J1  
SECTION N−N  
B
−U−  
L
J
PIN 1  
IDENT.  
N
8
0.25 (0.010)  
1
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
M
S
0.15 (0.006) T U  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
N
−V−  
A
B
4.90  
4.30  
−−−  
5.10 0.193 0.200  
4.50 0.169 0.177  
F
C
1.20  
−−− 0.047  
D
F
0.05  
0.50  
0.15 0.002 0.006  
0.75 0.020 0.030  
DETAIL E  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28 0.007 0.011  
−W−  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
C
0.10 (0.004)  
6.40 BSC  
0.252 BSC  
DETAIL E  
H
SEATING  
PLANE  
−T−  
M
0
8
0
8
_
_
_
_
D
G
SOLDERING FOOTPRINT  
7.06  
1
0.65  
PITCH  
16X  
0.36  
16X  
1.26  
DIMENSIONS: MILLIMETERS  
http://onsemi.com  
19  
PCA9654E, PCA9654EA  
PACKAGE DIMENSIONS  
WQFN16, 1.8x2.6, 0.4P  
CASE 488AP  
ISSUE B  
L
L
D
A
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
L1  
2. CONTROLLING DIMENSION: MILLIMETERS  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM  
FROM TERMINAL.  
4. COPLANARITY APPLIES TO THE EXPOSED PAD  
AS WELL AS THE TERMINALS.  
DETAIL A  
ALTERNATE TERMINAL  
CONSTRUCTIONS  
PIN 1 REFERENCE  
E
5. EXPOSED PADS CONNECTED TO DIE FLAG.  
USED AS TEST CONTACTS.  
MILLIMETERS  
A3  
EXPOSED Cu  
MOLD CMPD  
DIM MIN  
MAX  
0.80  
0.15  
0.15  
C
2X  
A
A1  
A3  
b
0.70  
0.00  
0.050  
0.20 REF  
C
2X  
0.15  
0.25  
B
A1  
D
1.80 BSC  
2.60 BSC  
0.40 BSC  
E
DETAIL B  
e
A
ALTERNATE  
DETAIL B  
L
0.30  
0.00  
0.40  
0.50  
0.15  
0.60  
0.10  
0.08  
C
CONSTRUCTIONS  
L1  
L2  
C
SEATING  
PLANE  
A1  
DETAIL A  
C
A3  
MOUNTING FOOTPRINT  
5
8
0.562  
0.0221  
15 X L  
0.400  
0.0157  
4
1
9
0.225  
1
e
0.0089  
12  
2.900  
0.1142  
16  
L2  
16 X  
0.10 C A B  
0.05 C  
0.463  
0.0182  
b
NOTE 3  
1.200  
0.0472  
2.100  
0.0827  
mm  
inches  
ǒ
Ǔ
SCALE 20:1  
http://onsemi.com  
20  
PCA9654E, PCA9654EA  
PACKAGE DIMENSIONS  
QFN16 3x3, 0.5P  
CASE 485G  
ISSUE F  
NOTES:  
D
A
B
L
L
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.25 AND 0.30 MM FROM TERMINAL.  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
L1  
PIN 1  
LOCATION  
DETAIL A  
ALTERNATE TERMINAL  
CONSTRUCTIONS  
E
MILLIMETERS  
DIM MIN  
0.80  
A1 0.00  
NOM MAX  
A
0.90  
0.03  
1.00  
0.05  
2X  
A3  
0.10  
C
EXPOSED Cu  
MOLD CMPD  
A3  
b
D
0.20 REF  
0.24  
3.00 BSC  
1.75  
0.18  
0.30  
1.85  
1.85  
2X  
0.10  
C
TOP VIEW  
D2 1.65  
E
3.00 BSC  
1.75  
0.50 BSC  
0.18 TYP  
0.40  
DETAIL B  
A1  
(A3)  
E2 1.65  
e
K
L
0.05  
0.05  
C
DETAIL B  
ALTERNATE  
A
C
0.30  
0.50  
0.15  
CONSTRUCTIONS  
L1 0.00  
0.08  
NOTE 4  
A1  
SEATING  
PLANE  
C
SIDE VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT*  
0.10 C A  
B
16X  
0.58  
DETAIL A  
D2  
PACKAGE  
OUTLINE  
16X  
L
8
4
1
9
1
2X  
1.84  
2X  
3.30  
E2  
16X  
K
16X  
0.30  
16  
16X b  
e
0.10 C A  
B
0.50  
e/2  
BOTTOM VIEW  
0.05  
C
PITCH  
NOTE 3  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
21  
PCA9654E, PCA9654EA  
PACKAGE DIMENSIONS  
QFN16 4x4, 0.65P  
CASE 485AP  
ISSUE A  
NOTES:  
L
L
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
D
A
B
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.30 MM FROM TERMINAL TIP.  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
L1  
PIN 1  
REFERENCE  
DETAIL A  
OPTIONAL LEAD  
CONSTRUCTIONS  
E
MILLIMETERS  
DIM MIN  
MAX  
1.00  
0.05  
A
A1  
A3  
b
0.80  
0.00  
0.20 REF  
A3  
EXPOSED Cu  
MOLD CMPD  
2X  
0.15  
C
TOP VIEW  
0.25  
0.35  
2X  
0.15  
C
D
4.00 BSC  
D2  
E
E2  
e
K
L
2.00  
4.00 BSC  
2.00  
0.65 BSC  
0.20  
0.45  
−−−  
2.20  
A
L
(A3)  
A1  
DETAIL B  
2.20  
0.10  
C
DETAIL B  
OPTIONAL LEAD  
CONSTRUCTIONS  
−−−  
0.65  
0.15  
16X  
L1  
0.08  
C
SIDE VIEW  
D2  
A1  
NOTE 4  
SEATING  
PLANE  
C
DETAIL A  
MOUNTING FOOTPRINT*  
16X  
4.30  
2.25  
5
8
4
9
PKG  
OUTLINE  
E2  
1
1
12  
16X b  
16  
13  
16X  
K
e
0.10 C A  
B
0.05  
C
NOTE 3  
0.65  
BOTTOM VIEW  
4.30  
2.25  
PITCH  
16X  
16X  
0.35  
0.78  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,  
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC  
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any  
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without  
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications  
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC  
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for  
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where  
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and  
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,  
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture  
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
PCA9654E/D  

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