QEB373ZR [ONSEMI]

亚微型塑料红外发光二极管;
QEB373ZR
型号: QEB373ZR
厂家: ONSEMI    ONSEMI
描述:

亚微型塑料红外发光二极管

光电 二极管 半导体
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Is Now Part of  
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email any questions regarding the system integration to Fairchild_questions@onsemi.com.  
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to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s  
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA  
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended  
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out  
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor  
is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
November 2009  
QEB373  
Subminiature Plastic Infrared Emitting Diode  
Features  
T-3/4 (2mm) Surface Mount Package  
Tape & Reel Option (See Tape & Reel Specifications)  
Lead Form Options: Gullwing, Yoke, Z-Bend  
Narrow Emission Angle, 24°  
Wavelength = 875nm, AlGaAs  
Clear Lens  
Matched Photosensor: QSB363  
High Radiant Intensity  
Package Dimensions  
CATHODE  
0.276 (7.0)  
MIN  
0.087 (2.2)  
0.071 (1.8)  
0.024 (0.6)  
0.016 (0.4)  
0.019 (0.5)  
0.012 (0.3)  
0.074 (1.9)  
Schematic  
.059 (1.5)  
.051 (1.3)  
.118 (3.0)  
.102 (2.6)  
0.055 (1.4)  
0.008 (0.21)  
0.004 (0.11)  
CATHODE  
0.024 (0.6)  
0.106 (2.7)  
0.091 (2.3)  
Notes:  
1. Dimensions are in inches (mm).  
2. Tolerance of .010 (.25) on all non nominal dimensions unless otherwise specified.  
©2009 Fairchild Semiconductor Corporation  
QEB373 Rev. 1.0.1  
www.fairchildsemi.com  
Absolute Maximum Ratings (T = 25°C unless otherwise specified)  
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Rating  
-40 to +100  
-40 to +100  
240 for 5 sec  
260 for 10 sec  
50  
Unit  
°C  
T
Operating Temperature  
Storage Temperature  
OPR  
T
°C  
STG  
(2,3,4)  
T
Soldering Temperature (Iron)  
Soldering Temperature (Flow)  
Continuous Forward Current  
Reverse Voltage  
°C  
SOL-I  
(2,3)  
T
°C  
SOL-F  
I
mA  
V
F
V
P
5
R
D
(1)  
Power Dissipation  
100  
mW  
Notes:  
1. Derate power dissipation linearly 1.33mW/°C above 25°C.  
2. RMA flux is recommended.  
3. Methanol or isopropyl alcohols are recommended as cleaning agents.  
4. Soldering iron 1/16" (1.6mm) minimum from housing.  
Electrical/Optical Characteristics (T = 25°C)  
A
Symbol  
Parameter  
Peak Emission Wavelength  
Emission Angle  
Forward Voltage  
Reverse Current  
Radiant Intensity  
Rise Time  
Test Conditions  
Min.  
Typ.  
875  
12  
Max.  
Units  
λ
I = 100mA  
nm  
°
P
F
Θ
I = 100mA  
F
V
I = 100mA, t = 20ms  
1.7  
V
F
F
p
I
V = 5V  
100  
µA  
R
R
I
I = 100mA, tp = 20ms  
16  
mW/sr  
ns  
e
F
t
I = 100mA  
800  
800  
r
F
t
Fall Time  
t = 20ms  
ns  
f
p
©2009 Fairchild Semiconductor Corporation  
QEB373 Rev. 1.0.1  
www.fairchildsemi.com  
2
Typical Performance Curves  
Fig. 1 Maximum Forward Current vs.  
Temperature  
Fig. 2 Relative Radiant Intensity vs.  
Wavelength  
200  
160  
120  
80  
100  
I
T
F
= 20 mA  
A = 25˚C  
80  
60  
40  
20  
40  
0
-25  
0
25  
50  
75 85 100  
0
810 835 855 875 905 925 945 965 985  
Ambient Temperature TA (˚C)  
Wavelength λ (nm)  
Fig. 3 Peak Emission Wavelength vs.  
Fig. 4 Forward Current vs.  
Forward Voltage  
Ambient Temperature  
500  
920  
200  
100  
900  
875  
860  
50  
20  
10  
5
840  
2
1
-25  
0
25  
50  
75  
100  
Ambient Temperature TA (˚C)  
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5  
Forward Voltage VF (V)  
Fig. 5 Relative Radiant Flux vs.  
Ambient Temperature  
20  
Fig. 6 Relative Radiant Intensity vs.  
Angular Displacement  
10  
30  
20  
10  
0
10  
20  
30  
5
40  
50  
40  
50  
2
1
0.5  
60  
70  
60  
70  
0.2  
0.1  
80  
90  
80  
90  
0.6  
0.4  
0.2  
0
0.2  
0.4  
0.6  
-25  
0
25  
50  
75  
100  
Ambient Temperature TA (˚C)  
Ambient Temperature TA (˚C)  
©2009 Fairchild Semiconductor Corporation  
QEB373 Rev. 1.0.1  
www.fairchildsemi.com  
3
Surface Mount Options for T-3/4 Package  
Features  
Three lead forming options: Gull Wing, Yoke and Z-Bend  
Compatible with automatic placement equipment  
Supplied on tape and reel or in bulk packaging  
Compatible with vapor phase reflow solder processes  
Gull Wing Lead Configuration  
Yoke Lead Configuration  
0.283 (7.2)  
0.098 (2.5)  
0.166 (4.2)  
0.016 (0.4)  
0.016 (0.4)  
CATHODE  
CATHODE  
0.020 (0.51)  
0.020 (0.5)  
0.074 (1.9)  
0.087 (2.2)  
0.071 (1.8)  
0.087 (2.2)  
0.071 (1.8)  
0.074 (1.9)  
0.024 (0.6)  
0.118 (3.0)  
0.102 (2.6)  
0.031 (0.8)  
0.078 (2.0)  
0.043 (1.1)  
.118 (3.0)  
.102 (2.6)  
0.055 (1.4)  
0.055 (1.4)  
0.051 (1.3)  
0.043 (1.1)  
0.008 (0.2)  
0.005 (0.13)  
0.106 (2.7)  
0.091 (2.3)  
0.141 (3.6)  
Z-Bend Lead Configuration  
0.236 (6.0)  
0.220 (5.6)  
0.177 (4.5)  
0.161 (4.1)  
0.127 (3.25)  
0.112 (2.85)  
0.016 (0.4)  
CATHODE  
0.020 (0.5)  
0.087 (2.2)  
0.071 (1.8)  
0.074 (1.9)  
0.024 (0.6)  
0.031 (0.8)  
0.080 (2.0)  
0.043 (1.1)  
.118 (3.0)  
.102 (2.6)  
0.055 (1.4)  
0.106 (2.7)  
0.091 (2.3)  
Notes: (Applies to all package drawings)  
1. Dimensions are in inches (mm).  
2. Tolerance of .010 (.25) on all non nominal dimensions unless otherwise specified.  
©2009 Fairchild Semiconductor Corporation  
QEB373 Rev. 1.0.1  
www.fairchildsemi.com  
4
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
PowerTrench®  
PowerXS™  
The Power Franchise®  
Auto-SPM  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
Current Transfer Logic™  
EcoSPARK®  
EfficentMax™  
EZSWITCH™*  
™*  
F-PFS™  
FRFET®  
Global Power ResourceSM  
Green FPS™  
Green FPSe-Series™  
Gmax™  
GTO™  
IntelliMAX™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Programmable Active Droop™  
QFET®  
TinyBoost™  
TinyBuck™  
QS™  
Quiet Series™  
RapidConfigure™  
TinyLogic®  
TINYOPTO™  
TinyPower™  
TinyPWM™  
Saving our world, 1mW/W/kW at a time™  
SmartMax™  
TinyWire™  
TriFault Detect™  
TRUECURRENT*  
µSerDes™  
SMART START™  
SPM®  
®
MicroPak™  
MillerDrive™  
MotionMax™  
Motion-SPM™  
OPTOLOGIC®  
STEALTH™  
SuperFET™  
SuperSOT-3  
SuperSOT-6  
SuperSOT-8  
SupreMOS™  
SyncFET™  
Fairchild®  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
UHC®  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
XS™  
OPTOPLANAR®  
FAST®  
®
FastvCore™  
FETBench™  
PDP SPM™  
Power-SPM™  
Sync-Lock™  
FlashWriter®  
®
*
*
FPS™  
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR  
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE  
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,  
WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain life,  
and (c) whose failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to  
cause the failure of the life support device or system, or to affect its  
safety or effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,  
under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.  
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,  
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of  
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are  
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have  
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.  
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide  
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our  
customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications may change in  
any manner without notice.  
Advance Information  
Preliminary  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild  
Semiconductor reserves the right to make changes at any time without notice to improve design.  
First Production  
Full Production  
Not In Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes  
at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.  
The datasheet is for reference information only.  
Rev. I40  
©2009 Fairchild Semiconductor Corporation  
QEB373 Rev. 1.0.1  
www.fairchildsemi.com  
5
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
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