QED123 [ONSEMI]

AlGaAs红外线发光二极管;
QED123
型号: QED123
厂家: ONSEMI    ONSEMI
描述:

AlGaAs红外线发光二极管

光电 二极管
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August 2008  
QED121, QED122, QED123  
Plastic Infrared Light Emitting Diode  
Features  
PACKAGE DIMENSIONS  
Description  
λ = 880nm  
The QED121, QED122 and QED123 are 880nm  
AlGaAs LEDs encapsulated in a clear peach tinted,  
plastic T-1 3/4 package.  
Chip material = AlGaAs  
Package type: T-1 3/4 (5mm lens diameter)  
Matched photosensor: QSD122/QSD123/QSD124  
Narrow emission angle, 16°  
High output power  
Package material and color: clear, peach tinted, plastic  
Package Dimensions  
0.195 (4.95)  
REFERENCE  
SURFACE  
0.305 (7.75)  
0.040 (1.02)  
NOM  
0.800 (20.3)  
MIN  
CATHODE  
Schematic  
0.050  
(1.25)  
0.100 (2.54)  
NOM  
ANODE  
CATHODE  
0.240 (6.10)  
0.215 (5.45)  
0.020 (0.51)  
SQ. (2X)  
Notes:  
1. Dimensions of all drawings are in inches (mm).  
2. Tolerance is 0.010 (0.25) on all non-nominal dimensions  
unless otherwise specified.  
©2001 Fairchild Semiconductor Corporation  
QED121, QED122, QED123 Rev. 1.0.1  
www.fairchildsemi.com  
Absolute Maximum Ratings (T = 25°C unless otherwise specified)  
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Rating  
-40 to +100  
-40 to +100  
240 for 5 sec  
260 for 10 sec  
100  
Units  
°C  
T
Operating Temperature  
Storage Temperature  
OPR  
T
°C  
STG  
(2)(3)(4)  
T
Soldering Temperature (Iron)  
Soldering Temperature (Flow)  
Continuous Forward Current  
Reverse Voltage  
°C  
SOL-I  
(2)(3)  
T
°C  
SOL-F  
I
mA  
V
F
V
P
5
R
(1)  
Power Dissipation  
200  
mW  
D
Notes:  
1. Derate power dissipation linearly 2.67mW/°C above 25°C.  
2. RMA flux is recommended.  
3. Methanol or isopropyl alcohols are recommended as cleaning agents.  
4. Soldering iron 1/16" (1.6mm) minimum from housing.  
Electrical / Optical Characteristics (T = 25°C)  
A
Symbol  
Parameter  
Peak Emission Wavelength  
Temperature Coefficient  
Emission Angle  
Test Conditions  
Min.  
Typ.  
890  
0.2  
Max.  
Units  
λ
I = 20mA  
nm  
nm / °C  
°
PE  
F
TC  
λ
1
2Θ /2  
I = 100mA  
16  
F
V
Forward Voltage  
I = 100mA, tp = 20ms  
1.7  
V
F
F
TC  
Temperature Coefficient  
Reverse Current  
-6  
mV / °C  
µA  
VF  
I
V = 5V  
10  
40  
R
R
I
I
I
Radiant Intensity QED121  
Radiant Intensity QED122  
Radiant Intensity QED123  
Temperature Coefficient  
Rise Time  
I = 100mA, tp = 20ms  
16  
32  
50  
mW/sr  
mW/sr  
mW/sr  
% / °C  
ns  
E
F
I = 100mA, tp = 20ms  
100  
E
E
F
I = 100mA, tp = 20ms  
70  
-0.3  
900  
800  
11  
F
TC  
IE  
t
I = 100mA  
F
r
t
Fall Time  
ns  
f
C
Junction Capacitance  
V = 0V  
pF  
j
R
©2001 Fairchild Semiconductor Corporation  
QED121, QED122, QED123 Rev. 1.0.1  
www.fairchildsemi.com  
2
Typical Performance Curves  
Figure 1. Normalized Intensity vs. Wavelength  
Figure 2. Peak Wavelength vs. Ambient Temperature  
1.0  
910  
908  
906  
904  
902  
900  
898  
896  
894  
I
= 20mA DC  
F
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
700  
750  
800  
850  
900  
(nm)  
950  
1,000  
1,050  
80  
TA – AMBIENT TEMPERTURE (°C)  
90  
100  
0
10  
20  
30  
40  
50  
60  
70  
λ
Figure 4. Normalized Radient Intensity vs. Ambient Temperature  
Figure 3. Normalized Radiant Intensity vs. Forward Current  
10  
1.3  
Normalized to:  
Normalized to:  
I
t
= 20mA Pulsed  
= 20mS  
F
PW  
I
t
= 100mA Pulsed  
F
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
= 20mS  
PW  
Duty Cycle = 4%  
= 25°C  
Duty Cycle = 4%  
= 25°C  
T
A
T
A
1
0.1  
10  
105  
-15  
0
15  
30  
45  
60  
75  
90  
100  
1000  
TA – AMBIENT TEMPERTURE (°C)  
IF – FORWARD CURRENT (mA)  
Figure 6. Forward Voltage vs. Ambient Temperature  
Figure 5. Forward Voltage vs. Forward Current  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
2.1  
2.0  
1.9  
1.8  
1.7  
1.6  
1.5  
I
t
= 20mA Pulsed  
F
I
Pulsed  
= 20mS  
F
= 20mS  
PW  
t
PW  
Duty Cycle = 4%  
= 25°C  
Duty Cycle = 4%  
T
A
105  
-15  
0
15  
30  
45  
60  
75  
90  
10  
100  
1000  
TA – AMBIENT TEMPERTURE (°C)  
IF – FORWARD CURRENT (mA)  
©2001 Fairchild Semiconductor Corporation  
QED121, QED122, QED123 Rev. 1.0.1  
www.fairchildsemi.com  
3
Typical Performance Curves (Continued)  
Figure 8. Coupling Characteristics of QED12X and QSD12X  
Figure 7. Radiation Diagram  
1.0  
90°  
Normalized to:  
d = 0 inch  
100°  
80°  
110°  
70°  
Pulse Width = 100µs  
Duty Cycle = 0.1%  
120°  
60°  
0.8  
0.6  
0.4  
0.2  
0.0  
130°  
50°  
V
R
= 5V  
= 100Ω  
= 25°C  
CC  
L
140°  
150°  
160°  
40°  
T
A
30°  
20°  
I
= 100mA  
F
170°  
10°  
I
= 20mA  
F
180°  
1.0  
0°  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.2  
0.4  
0.6  
0.8  
0
1
2
3
4
5
6
LENS TIP SEPARATION (inches)  
©2001 Fairchild Semiconductor Corporation  
QED121, QED122, QED123 Rev. 1.0.1  
www.fairchildsemi.com  
4
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The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
PowerTrench®  
Programmable Active Droop  
QFET®  
QS™  
Quiet Series™  
RapidConfigure™  
The Power Franchise®  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
F-PFS™  
FRFET®  
Global Power ResourceSM  
Green FPS™  
Green FPSe-Series™  
GTO™  
TinyBoost™  
TinyBuck™  
TinyLogic®  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
µSerDes™  
Current Transfer Logic™  
EcoSPARK®  
IntelliMAX™  
EfficentMax™  
EZSWITCH™ *  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Saving our world, 1mW/W/kW at a time™  
SmartMax™  
SMART START™  
®
SPM®  
MicroPak™  
MillerDrive™  
MotionMax™  
Motion-SPM™  
OPTOLOGIC®  
STEALTH™  
SuperFET™  
SuperSOT-3  
SuperSOT-6  
SuperSOT-8  
SupreMOS™  
Fairchild®  
UHC®  
Ultra FRFET™  
UniFET™  
VCX™  
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FACT Quiet Series™  
FACT®  
OPTOPLANAR®  
FAST®  
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FlashWriter® *  
FPS™  
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VisualMax™  
SyncFET™  
®
PDP SPM™  
Power-SPM™  
* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR  
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE  
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WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
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As used herein:  
1. Life support devices or systems are devices or systems which, (a) are  
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and (c) whose failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be reasonably  
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2. A critical component in any component of a life support, device, or  
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cause the failure of the life support device or system, or to affect its  
safety or effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,  
under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.  
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,  
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of  
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are  
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full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.  
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide  
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our  
customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications may change in  
any manner without notice.  
Advance Information  
Preliminary  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild  
Semiconductor reserves the right to make changes at any time without notice to improve design.  
First Production  
Full Production  
Not In Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes  
at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The  
datasheet is for reference information only.  
Rev. I36  
©2001 Fairchild Semiconductor Corporation  
QED121, QED122, QED123 Rev. 1.0.1  
www.fairchildsemi.com  
5
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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