RHRD660S9A [ONSEMI]

6A,600V,超快速二极管;
RHRD660S9A
型号: RHRD660S9A
厂家: ONSEMI    ONSEMI
描述:

6A,600V,超快速二极管

软恢复二极管 超快速软恢复二极管 局域网
文件: 总6页 (文件大小:428K)
中文:  中文翻译
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RHRD660, RHRD660S  
Data Sheet  
January 2002  
6A, 600V Hyperfast Diodes  
Features  
The RHRD660 and RHRD660S are hyperfast diodes with  
• Hyperfast with Soft Recovery. . . . . . . . . . . . . . . . . . <30ns  
soft recovery characteristics (t < 30ns). They have half the  
recovery time of ultrafast diodes and are silicon nitride  
passivated ion-implanted epitaxial planar construction.  
o
rr  
• Operating Temperature . . . . . . . . . . . . . . . . . . . . . .175 C  
• Reverse Voltage Up To. . . . . . . . . . . . . . . . . . . . . . . .600V  
• Avalanche Energy Rated  
These devices are intended for use as freewheeling/  
clamping diodes and rectifiers in a variety of switching power  
supplies and other power switching applications. Their low  
stored charge and hyperfast soft recovery minimize ringing  
and electrical noise in many power switching circuits  
reducing power loss in the switching transistors.  
• Planar Construction  
Applications  
• Switching Power Supplies  
• Power Switching Circuits  
• General Purpose  
Formerly developmental type TA49057.  
Packaging  
Ordering Information  
JEDEC STYLE TO-251  
PART NUMBER  
PACKAGE  
TO-251  
TO-252  
BRAND  
ANODE  
RHRD660  
RHR660  
RHR660  
CATHODE  
RHRD660S  
CATHODE  
(FLANGE)  
NOTE: When ordering, use the entire part number. Add the suffix 9A  
to obtain the TO-252 variant in tape and reel, e.g. RHRD660S9A.  
Symbol  
JEDEC STYLE TO-252  
K
CATHODE  
(FLANGE)  
CATHODE  
ANODE  
A
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified  
C
RHRD660, RHRD660S  
UNITS  
Peak Repetitive Reverse Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
600  
600  
600  
6
V
V
V
A
RRM  
RWM  
Working Peak Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
DC Blocking Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V  
R
Average Rectified Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
F(AV)  
o
(T = 152 C)  
C
Repetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
(Square Wave, 20kHz)  
12  
60  
A
A
FRM  
FSM  
Nonrepetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
(Halfwave, 1 Phase, 60Hz)  
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P  
50  
10  
W
D
Avalanche Energy (See Figures 10 and 11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E  
mJ  
AVL  
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Maximum Lead Temperature for Soldering  
, T  
STG  
-65 to 175  
C
J
o
(Leads at 0.063 in. (1.6mm) from case for 10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
300  
260  
C
L
o
Package Body for 10s, see Tech Brief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
C
PKG  
©2002 Fairchild Semiconductor Corporation  
RHRD660, RHRD660S Rev. B  
RHRD660, RHRD660S  
o
Electrical Specifications  
T = 25 C, Unless Otherwise Specified  
C
SYMBOL  
TEST CONDITION  
= 6A  
MIN  
TYP  
MAX  
2.1  
1.7  
100  
500  
30  
35  
-
UNITS  
V
V
I
I
-
-
-
-
-
-
-
-
-
-
-
-
-
F
F
F
o
= 6A, T = 150 C  
V
C
I
V
V
= 600V  
-
µA  
µA  
ns  
R
R
R
o
= 600V, T = 150 C  
-
C
t
I
I
I
I
I
= 1A, dI /dt = 200A/µs  
-
rr  
F
F
F
F
F
F
= 6A, dI /dt = 200A/µs  
-
ns  
F
t
t
= 6A, dI /dt = 200A/µs  
16  
8.5  
45  
20  
-
ns  
a
F
= 6A, dI /dt = 200A/µs  
-
ns  
b
F
Q
= 6A, dI /dt = 200A/µs  
-
nC  
pF  
RR  
F
C
V
= 10V, I = 0A  
-
J
R
F
o
R
3
C/W  
θJC  
DEFINITIONS  
V
= Instantaneous forward voltage (pw = 300µs, D = 2%).  
F
I
= Instantaneous reverse current.  
R
t
= Reverse recovery time (See Figure 9), summation of t + t .  
a b  
rr  
t = Time to reach peak reverse current (See Figure 9).  
a
t = Time from peak I  
to projected zero crossing of I  
based on a straight line from peak I  
through 25% of I (See Figure 9).  
RM  
b
RM  
= Reverse recovery charge.  
RM  
RM  
Q
RR  
C = Junction capacitance.  
J
R
= Thermal resistance junction to case.  
θJC  
pw = Pulse width.  
D = Duty cycle.  
Typical Performance Curves  
30  
1000  
100  
10  
o
175 C  
10  
o
100 C  
1
o
o
o
25 C  
175 C  
100 C  
0.1  
o
1
25 C  
0.5  
0.01  
0
0.5  
1
1.5  
2
2.5  
3
0
100  
200  
V , REVERSE VOLTAGE (V)  
R
300  
400  
500  
600  
V , FORWARD VOLTAGE (V)  
F
FIGURE 1. FORWARD CURRENT vs FORWARD VOLTAGE  
FIGURE 2. REVERSE CURRENT vs REVERSE  
©2002 Fairchild Semiconductor Corporation  
RHRD660, RHRD660S Rev. B  
RHRD660, RHRD660S  
Typical Performance Curves (Continued)  
30  
25  
50  
40  
30  
20  
10  
0
o
o
T
= 25 C, dI /dt = 200A/µs  
F
T
= 100 C, dI /dt = 200A/µs  
C
C
F
t
t
rr  
rr  
20  
15  
t
a
t
a
10  
5
t
b
t
b
0
0.5  
1
6
0.5  
1
6
I , FORWARD CURRENT (A)  
I , FORWARD CURRENT (A)  
F
F
FIGURE 3. t , t AND t CURVES vs FORWARD CURRENT  
rr  
FIGURE 4. t , t AND t CURVES vs FORWARD CURRENT  
a
b
rr  
a
b
75  
60  
45  
30  
15  
0
6
5
4
3
2
1
0
o
T
= 175 C, dI /dt = 200A/µs  
F
C
DC  
t
rr  
SQ. WAVE  
t
a
t
b
140  
145  
150  
155  
160  
165  
o
170  
175  
0.5  
1
6
I , FORWARD CURRENT (A)  
T
, CASE TEMPERATURE ( C)  
F
C
FIGURE 5. t , t AND t CURVES vs FORWARD CURRENT  
rr  
FIGURE 6. CURRENT DERATING CURVE  
a
b
50  
40  
30  
20  
10  
0
0
50  
100  
150  
200  
V
, REVERSE VOLTAGE (V)  
R
FIGURE 7. JUNCTION CAPACITANCE vs REVERSE VOLTAGE  
©2002 Fairchild Semiconductor Corporation  
RHRD660, RHRD660S Rev. B  
RHRD660, RHRD660S  
Test Circuits and Waveforms  
V
AMPLITUDE AND  
GE  
R
CONTROL dI /dt  
F
G
L
t
t CONTROL I  
1 AND  
2 F  
DUT  
CURRENT  
SENSE  
dI  
F
t
rr  
R
I
F
G
dt  
t
t
b
+
a
0
V
V
DD  
GE  
-
IGBT  
t
1
0.25 I  
RM  
t
2
I
RM  
FIGURE 8. t TEST CIRCUIT  
rr  
FIGURE 9. t WAVEFORMS AND DEFINITIONS  
rr  
I
= 1A  
MAX  
L = 20mH  
R < 0.1Ω  
2
E
= 1/2LI [V  
/(V  
- V )]  
DD  
AVL  
= IGBT (BV  
R(AVL) R(AVL)  
V
AVL  
Q
> DUT V )  
R(AVL)  
1
CES  
L
R
+
V
CURRENT  
SENSE  
I
I
L
L
DD  
I
V
Q
1
V
DD  
DUT  
-
t
t
t
2
t
0
1
FIGURE 10. AVALANCHE ENERGY TEST CIRCUIT  
FIGURE 11. AVALANCHE CURRENT ANDVOLTAGE  
WAVEFORMS  
©2002 Fairchild Semiconductor Corporation  
RHRD660, RHRD660S Rev. B  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
â
SMART START™  
STAR*POWER™  
Stealth™  
VCX™  
FAST  
ACEx™  
Bottomless™  
CoolFET™  
OPTOLOGIC™  
OPTOPLANAR™  
PACMAN™  
FASTr™  
FRFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
GlobalOptoisolator™  
GTO™  
HiSeC™  
ISOPLANAR™  
LittleFET™  
MicroFET™  
MicroPak™  
MICROWIRE™  
CROSSVOLT™  
DenseTrench™  
DOME™  
POP™  
Power247™  
PowerTrenchâ  
QFET™  
EcoSPARK™  
E2CMOSTM  
TinyLogic™  
QS™  
EnSignaTM  
TruTranslation™  
UHC™  
QT Optoelectronics™  
Quiet Series™  
SILENTSWITCHERâ  
FACT™  
FACT Quiet Series™  
UltraFETâ  
STAR*POWER is used under license  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD  
DOES NOT ASSUME ANY LIABILITYARISING OUT OF THE APPLICATION OR USE OFANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICESORSYSTEMSWITHOUTTHEEXPRESSWRITTENAPPROVALOFFAIRCHILDSEMICONDUCTORCORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. H4  

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