RHRG3060 [ONSEMI]
30A,600V,超快二极管;型号: | RHRG3060 |
厂家: | ONSEMI |
描述: | 30A,600V,超快二极管 二极管 |
文件: | 总6页 (文件大小:388K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Hyperfast Diode
30 A, 400 V − 600 V
RHRG3040, RHRG3060
Description
The RHRG3040, RHRG3060 is a hyperfast diode with soft recovery
characteristics. It has the half recovery time of ultrafast diodes and is
silicon nitride passivated ionimplanted epitaxial planar construction.
These devices are intended to be used as freewheeling/clamping
diodes and diodes in a variety of switching power supplies and other
power switching applications. Their low stored charge and hyperfast
soft recovery minimize ringing and electrical noise in many power
switching circuits reducing power loss in the switching transistors.
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CATHODE
CATHODE
(BOTTOM
Features
SIDE METAL)
ANODE
• Hyperfast Recovery t = 45 ns (@ I = 30 A)
rr
F
TO−247−2LD
CASE 340CL
• Max Forward Voltage, V = 2.1 V (@ T = 25°C)
F
C
• 400 V, 600 V Reverse Voltage and High Reliability
• Avalanche Energy Rated
• These Devices are Pb−Free and are RoHS Compliant
SYMBOL
K
Applications
• Switching Power Supplies
• Power Switching Circuits
• General Purpose
A
MARKING DIAGRAM
$Y&Z&3&K
RHRG30XX
$Y
= ON Semiconductor Logo
&Z
&3
&K
= Assembly Plant Code
= Numeric Date Code
= Lot Code
RHRG30XX
XX
= Specific Device Code
= 40, 60
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
March, 2020 − Rev. 3
RHRG3060/D
RHRG3040, RHRG3060
ABSOLUTE MAXIMUM RATINGS (T = 25°C, unless otherwise specified)
C
Parameter
Peak Repetitive Reverse Voltage
Symbol
RHRG3040
RHRG3060
Unit
V
V
400
400
600
600
RRM
RWM
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
R
400
600
V
Average Rectified Forward Current (T = 120°C)
I
30
30
A
C
F(AV)
Repetitive Peak Surge Current (Square Wave, 20 kHz)
Non−repetitive Peak Surge Current (Halfwave, 1 Phase, 60 Hz)
Maximum Power Dissipation
I
70
70
A
FRM
I
325
325
A
FSM
P
D
125
125
W
mJ
°C
Avalanche Energy (See Figures 10 and 11)
Operating and Storage Temperature
E
20
20
AVL
T
, T
−65 to 175
−65 to 175
STG
J
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
PACKAGE MARKING AND ORDERING INFORMATION
Device
Device Marking
RHRG3040
Package
Shipping
450 / Tube
450 / Tube
RHRG3040
RHRG3060
TO−247−2LD
TO−247−2LD
RHRG3060
ELECTRICAL SPECIFICATION (T = 25°C, unless otherwise specified)
C
RHRG3040
Typ
RHRG3060
Min
−
Max
2.1
1.7
250
−
Min
−
Typ
−
Max
2.1
1.7
−
Characteristics
Symbol
Test Condition
Unit
Instantaneous Forward Voltage
(Pulse Width = 300 ms,
Duty Cycle = 2%)
V
F
I = 30 A
−
−
V
F
I = 30 A, T = 150°C
−
−
−
V
F
C
Instantaneous Reverse Current
I
R
V
R
= 400 V
= 600 V
−
−
−
−
mA
mA
mA
mA
ns
V
R
V
R
V
R
−
−
−
−
250
−
= 400 V, T = 150°C
−
−
1.0
−
−
−
C
= 600 V, T = 150°C
−
−
−
−
1.0
40
45
−
C
Reverse Recovery Time
(See Figure 9)
t
rr
−
−
40
45
−
−
−
I = 1 A, dI /dt = 200 A/ms
F
F
I = 30 A, dI /dt = 200 A/ms
−
−
−
−
ns
Summation of t + t
F
F
a
b
Time to Reach Peak Reverse
Current (See Figure 9)
t
t
I = 30 A, dI /dt = 200 A/ms
−
22
−
22
ns
a
F
F
Time from Peak I
to Projected
RM
I = 30 A, dI /dt = 200 A/ms
−
18
−
−
18
−
ns
RM
b
F
F
Zero Crossing of I
Based
on a Straight Line from Peak I
RM
through 25% of I
(See Figure 9)
RM
Reverse Recovery Charge
Junction Capacitance
Q
I = 30 A, dI /dt = 200 A/ms
−
−
−
100
85
−
−
−
−
100
85
−
−
−
nC
pF
rr
F
F
C
V = 10 V, I = 0 A
R F
J
Thermal Resistance Junction
to Case
R
1.2
1.2
°C/W
q
JC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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2
RHRG3040, RHRG3060
TYPICAL PERFORMANCE CURVES
300
100
2000
175°C
100°C
100
10
100°C
175°C
25°C
10
1
1
0.1
0.01
25°C
4
1
2
3
0
0
200
300
400
500
600
100
V , Reverse Voltage (V)
R
V , Forward Voltage (V)
F
Figure 2. Reverse Current vs. Reverse Voltage
Figure 1. Forward Current vs. Forward Voltage
50
40
30
100
80
T
C
= 25°C, dI /dt = 200 A/ms
T
C
= 100°C, dI /dt = 200 A/ms
F
F
t
rr
t
60
40
rr
t
20
a
t
a
t
b
20
0
10
0
t
b
10
30
1
10
30
1
I , Forward Current (A)
F
I , Forward Current (A)
F
Figure 4. trr, ta and tb Curves vs. Forward Current
Figure 3. trr, ta and tb Curves vs. Forward Current
150
125
100
75
30
25
20
15
10
5
T
C
= 175°C, dI /dt = 200 A/ms
F
DC
t
t
rr
SQ. WAVE
a
50
25
0
t
b
0
75
100
125
150
175
10
30
1
I , Forward Current (A)
F
T , Case Temperature (°C)
C
Figure 6. Current Derating Curve
Figure 5. trr, ta and tb Curves vs. Forward Current
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3
RHRG3040, RHRG3060
TYPICAL PERFORMANCE CURVES (continued)
150
125
100
75
50
25
0
0
50
200
100
150
V , Reverse Voltage (V)
R
Figure 7. Junction Capacitance vs. Reverse Voltage
TEST CIRCUITS AND WAVEFORMS
V
AMPLITUDE AND
GE
G
R
CONTROL dI /dt
F
L
t AND t Control I
1
2
F
dI
dt
t
rr
F
I
F
t
b
DUT CURRENT
SENSE
t
a
R
0
G
+
V
DD
V
GE
0.25 I
RM
−
IGBT
t
1
I
RM
t
2
Figure 9. trr Waveforms and Definitions
Figure 8. trr Test Circuit
I
= 1 A
MAX
L = 40 mH
R < 0.1 W
2
E
= 1/2LI [V
/(V
− V )]
R(AVL
AVL
1
R(AVL)
CES
R(AVL) DD
V
AVL
Q = IGBT (BV
> DUT V
)
R
L
+
V
CURRENT
SENSE
I
L
I
L
DD
I V
Q
1
V
DD
DUT
−
t
t
1
t
2
t
0
Figure 11. Avalanche Current and Voltage
Waveforms
Figure 10. Avalanche Energy Test Circuit
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−247−2LD
CASE 340CL
ISSUE A
DATE 03 DEC 2019
GENERIC
MARKING DIAGRAM*
AYWWZZ
XXXXXXX
XXXXXXX
XXXX = Specific Device Code
A
Y
= Assembly Location
= Year
WW = Work Week
ZZ
= Assembly Lot Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13850G
TO−247−2LD
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
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