S115FP [ONSEMI]

1 A、150 V 表面贴装肖特基势垒整流器;
S115FP
型号: S115FP
厂家: ONSEMI    ONSEMI
描述:

1 A、150 V 表面贴装肖特基势垒整流器

文件: 总6页 (文件大小:247K)
中文:  中文翻译
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Surface Mount Schottky  
Barrier Rectifiers  
1 A, 20 V - 150 V  
SS12FP - S115FP  
Features  
www.onsemi.com  
Larger Cathode Pad for Improved Power Dissipation  
Ultra Thin Profile Package Height < 1.0 mm  
High Surge Current Capability  
2
2
Low Power Loss, High Efficiency  
UL Flammability 94V0 Classification  
MSL 1 per JSTD020  
1
1
Band Indicates Cathode  
AECQ101 Qualified  
SOD123EP  
CASE 425AC  
These Devices are PbFree and are RoHS Compliant  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Value  
SS12  
FP  
SS13  
FP  
SS14  
FP  
SS16  
FP  
S110  
FP  
S115  
FP  
Symbol  
Parameter  
Unit  
1
2
V
RRM  
Repetitive  
20  
30  
40  
60  
100  
150  
V
Peak  
Cathode  
Anode  
Reverse Voltage  
V
RMS  
14  
20  
21  
30  
28  
40  
42  
60  
70  
105  
150  
V
V
A
A
RMS  
Reverse Voltage  
MARKING DIAGRAM  
V
DC  
100  
R
Blocking Voltage  
I
Average Forward  
Rectified Current  
1
F(AV)  
&Y  
&ZXFP&G  
1
2
I
Peak Forward  
Surge Current:  
8.3 ms Single  
Half SineWave  
Superimposed on  
Rated Load  
30  
FSM  
&Y  
&Z  
XFP  
= Binary Calendar Year Coding  
= Assembly Plant Code  
= Specific Device Code  
X = 0, 2, 3, 4, 6, A  
T
Operating  
Junction  
Temperature  
Range  
55 to +125  
55 to +150  
°C  
°C  
J
&G  
= Single Digit Week Code  
T
Storage  
Temperature  
Range  
55 to +150  
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
May, 2021 Rev. 2  
S110FP/D  
SS12FP S115FP  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Note 1)  
A
Symbol  
Parameter  
Value  
Unit  
°C/W  
°C/W  
Y
JL  
Thermal Characteristics, JunctiontoLead (Note 2)  
10  
Thermal Resistance, JunctiontoAmbient  
140  
R
q
JA  
1. Per JESD513 recommended thermal test board. Device mounted on FR4 PCB, board size = 76.2 mm x 114.3 mm.  
2. Thermocouple soldered at cathode lead.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Value  
SS12  
FP  
SS13  
FP  
SS14  
FP  
SS16  
FP  
S110  
FP  
S115  
FP  
Symbol  
Parameter  
Conditions  
IF = 0.5 A  
Unit  
VF  
Maximum Instantaneous  
Forward Voltage (Note 3)  
0.51  
0.55  
0.58  
0.70  
0.70  
0.80  
0.75  
0.90  
V
IF = 1.0 A  
TJ = 25°C  
TJ = 125°C  
0.45  
0.50  
IR  
Maximum Reverse Current  
at Rated VR  
0.40  
0.05  
0.50  
28  
mA  
CJ  
Trr  
Typical Junction Capacitance  
VR = 4 V,  
f = 1 MHz  
54  
6
pF  
ns  
Typical Reverse Recovery Time IF = 0.5 A,  
IR = 1 A,  
14  
IRR = 0.25 A  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Pulse test with PW = 300 ms, 1% duty cycle.  
ORDERING INFORMATION  
Part Number  
SS12FP  
SS13FP  
SS14FP  
SS16FP  
S110FP  
Device Code Marking  
Package  
Packing Method  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
2FP  
3FP  
4FP  
6FP  
0FP  
AFP  
SOD123EP  
SOD123EP  
SOD123EP  
SOD123EP  
SOD123EP  
SOD123EP  
S115FP  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
2
 
SS12FP S115FP  
TYPICAL PERFORMANCE CHARACTERISTICS  
1.4  
1.2  
1
100  
0.8  
0.6  
0.4  
0.2  
0
10  
Resistive or  
Inductive Load  
8.3 ms Single  
Half Sine Wawe  
1
0
25  
50  
75  
100  
125  
150  
1
10  
100  
Case Temperature (5C)  
Number of Cycles at 60 Hz  
Figure 1. Forward Current Derating Curve  
Figure 2. Maximum NonRepetitive  
Forward Surge Current  
1
1
SS16FP  
S110FP  
T
A
= 150°C  
T
A
= 150°C  
T
A
= 125°C  
T
A
= 55°C  
T = 125°C  
A
T
A
= 55°C  
0.1  
0.1  
T
A
= 40°C  
T
A
= 40°C  
T
A
= 25°C  
T
A
= 25°C  
0.01  
0.01  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.0  
0.1  
0.8  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
Forward Voltage, V (V)  
Forward Voltage, V (V)  
F
F
Figure 4. Typical Forward Characteristics  
Figure 3. Typical Forward Characteristics  
10000  
1000  
100  
1
SS12FP SS16FP  
SS15FP  
T
A
= 150°C  
T
A
= 150°C  
T
A
= 125°C  
T
A
= 55°C  
10  
T
= 75°C  
A
1
0.1  
T
A
= 25°C  
0.1  
T
A
= 125°C  
0.01  
0.001  
1E4  
1E5  
T
= 55°C  
A
T
= 25°C  
A
T
= 40°C  
T
A
= 40°C  
A
0.01  
0.0 0.1  
0.2  
0.3  
0.4  
0.5 0.6  
0.7  
0.8  
0.9  
1.0  
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Percent of Rated Peak Reverse Voltage (%)  
Forward Voltage, V (V)  
F
Figure 6. Typical Reverse Characteristics  
Figure 5. Typical Forward Characteristic  
www.onsemi.com  
3
SS12FP S115FP  
TYPICAL PERFORMANCE CHARACTERISTICS  
10000  
1000  
100  
1000  
S110FP S115FP  
T
A
= 150°C  
10  
100  
10  
1
SS12FP SS116FP  
T
= 125°C  
A
T
= 75°C  
A
1
T
= 55°C  
A
0.1  
T
A
= 25°C  
S110FP S115FP  
0.01  
0.001  
1E4  
1E5  
T
= 40°C  
A
0.1  
1
10  
100  
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Percent of Rated Peak Reverse Voltage (%)  
Reverse Voltage, V (V)  
R
Figure 7. Typical Reverse Characteristic  
Figure 8. Typical Junction Capacitance  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOD123EP  
CASE 425AC  
ISSUE O  
DATE 31 AUG 2016  
3.00  
2.60  
0.55  
1.95  
1.65  
1.15  
0.85  
1.40  
2.30  
1.25  
LAND PATTERN RECOMMENDATION  
LONG PAD IS CATHODE  
0.30  
0.10  
1.00  
0.75  
3.90  
3.50  
2.05  
1.65  
2.05  
1.65  
NOTES:  
A. NO INDUSTRY STANDARD APPLIES TO THIS  
PACKAGE.  
B. ALL DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR PROTRUSIONS.  
1.25  
0.85  
0.40  
0.25  
2.30  
1.90  
1.20  
0.55  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13723G  
SOD123EP  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
www.onsemi.com/support/sales  

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