SI4542DY [ONSEMI]

30V,互补,PowerTrench® MOSFET;
SI4542DY
型号: SI4542DY
厂家: ONSEMI    ONSEMI
描述:

30V,互补,PowerTrench® MOSFET

开关 脉冲 光电二极管 晶体管
文件: 总5页 (文件大小:242K)
中文:  中文翻译
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Si4542DY  
30V Complementary PowerTrench MOSFET  
Features  
General Description  
Q1: N-Channel  
This complementary MOSFET device is produced using  
6 A, 30 V  
RDS(on) = 28 m@ VGS = 10V  
ON  
process that has been especially tailored to  
minimize the on-state resistance and yet  
Semiconductor’s  
advanced  
PowerTrench  
RDS(on) = 35 m@ VGS = 4.5V  
maintain low gate charge for superior switching  
performance.  
Q2: P-Channel  
–6 A, –30 V  
RDS(on) = 32 m@ VGS = –10V  
Applications  
RDS(on) = 45 m@ VGS = –4.5V  
DC/DC converter  
Power management  
Q2  
D2  
5
6
7
8
4
3
2
1
D2  
D1  
D1  
Q1  
G2  
SO-8  
S2  
G1  
S1  
Pin 1  
Absolute Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Q1  
Q2  
Units  
VDSS  
VGSS  
ID  
Drain-Source Voltage  
30  
±20  
6
–30  
±20  
–6  
V
V
A
Gate-Source Voltage  
Drain Current - Continuous  
- Pulsed  
(Note 1a)  
20  
–20  
PD  
Power Dissipation for Dual Operation  
Power Dissipation for Single Operation  
2
W
(Note 1a)  
(Note 1b)  
1.6  
1.2  
1
(Note 1c)  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +175  
°C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Case  
(Note 1a)  
(Note 1)  
78  
40  
RθJA  
°C/W  
°C/W  
RθJC  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
2500 units  
4542  
Si4542DY  
13”  
12mm  
2001 Semiconductor Components Industries, LLC.  
Publication Order Number:  
October-2017, Rev 1  
Si4542DY/D  
Electrical Characteristics  
TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Type Min Typ Max Units  
Off Characteristics  
BVDSS  
Drain-Source Breakdown  
VGS = 0 V, ID = 250 µA  
GS = 0 V, ID = –250 µA  
ID = 250 µA, Referenced to 25°C  
ID = –250 µA, Referenced to 25°C  
VDS = 24 V, VGS = 0 V  
Q1  
Q2  
Q1  
Q2  
30  
–30  
V
Voltage  
V
Breakdown Voltage  
Temperature Coefficient  
23  
–21  
BVDSS  
TJ  
mV/°C  
IDSS  
Zero Gate Voltage Drain  
Current  
Q1  
Q2  
1
–1  
µA  
V
DS = –24 V, VGS = 0 V  
IGSS  
Gate-Body Leakage  
VGS = +20 V, VDS = 0 V  
VGS = +20 V, VDS = 0 V  
Q1  
Q2  
+100  
+100  
nA  
On Characteristics  
(Note 2)  
VGS(th)  
Gate Threshold Voltage  
VDS = VGS, ID = 250 µA  
Q1  
Q2  
Q1  
Q2  
1
–1  
1.5  
–1.7  
–4  
3
–3  
V
V
DS = VGS, ID = –250 µA  
Gate Threshold Voltage  
Temperature Coefficient  
VGS(th)  
TJ  
ID = 250 µA, Referenced to 25°C  
ID = –250 µA, Referenced to 25°C  
VGS = 10 V, ID = 6 A  
mV/°C  
mΩ  
4
RDS(on)  
Static Drain-Source  
On-Resistance  
Q1  
19  
32  
25  
28  
48  
35  
VGS = 10 V, ID = 6 A, TJ = 125°C  
V
GS = 4.5 V, ID = 5 A  
Q2  
VGS = –10 V, ID = –6 A  
VGS = –10 V, ID = –6 A, TJ = 125°C  
21  
29  
30  
32  
51  
45  
V
GS = –4.5 V, ID = –5 A  
VGS = 10 V, VDS = 5 V  
GS = –10 V, VDS = –5 V  
Forward Transconductance VDS = 15 V, ID = 6 A  
DS = –10 V, ID = –6 A  
ID(on)  
gFS  
On-State Drain Current  
Q1  
Q2  
Q1  
Q2  
20  
–20  
A
S
V
18  
16  
V
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
Q1  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
830  
1540  
185  
400  
80  
pF  
pF  
pF  
V
DS = 15 V, VGS = 0 V,  
f = 1.0 MHz  
Q2  
Output Capacitance  
V
DS = –15 V, VGS = 0 V,  
Reverse Transfer  
Capacitance  
f = 1.0 MHz  
170  
Electrical Characteristics (continued)  
Symbol Parameter  
TA = 25°C unless otherwise noted  
Test Conditions  
Type Min Typ Max Units  
Switching Characteristics (Note 2)  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Q1  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
6
13  
10  
22  
18  
47  
5
18  
9
15  
2.8  
4
3.1  
5
12  
24  
18  
35  
29  
75  
12  
30  
13  
20  
ns  
ns  
VDS = 15 V, ID = 1 A,  
VGS = 10V, RGEN = 6 Ω  
Q2  
ns  
VDS = –15 V, ID = –1 A,  
VGS = –10 V, RGEN = 6 Ω  
ns  
Qg  
Qgs  
Qgd  
Q1  
V
nC  
nC  
nC  
DS = 15 V, ID = 7.5 A, VGS = 5 V  
Q2  
VDS = –10 V, ID = –6 A, VGS = –5V  
www.onsemi.com  
2
Drain-Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Q1  
Q2  
Q1  
Q2  
1.3  
–1.3  
1.2  
A
V
VSD  
Drain-Source Diode Forward VGS = 0 V, IS = 1.3 A (Note 2)  
0.7  
–0.7  
Voltage  
VGS = 0 V, IS = –1.3 A (Note 2)  
–1.2  
Notes:  
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of  
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.  
a) 78°C/W when  
mounted on a  
0.5 in2 pad of 2 oz  
copper  
b) 125°C/W when  
mounted on a .02 in2  
pad of 2 oz copper  
c) 135°C/W when mounted on a  
minimum pad.  
Scale 1 : 1 on letter size paper  
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%  
www.onsemi.com  
3
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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