STF202-22T1G [ONSEMI]
USB Filter with ESD Protection; USB过滤器与ESD保护
| 型号： | STF202-22T1G |
| 厂家： | 
ONSEMI |
| 描述： | USB Filter with ESD Protection |
| 文件： | 总6页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STF202-22T1G
USB Filter with ESD
Protection
This device is designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. It is intended for
use in upstream USB ports, Cellular phones, Wireless equipment and
computer applications. This device offers an integrated solution in a
small package (TSOP−6, Case 318G) reducing PCB space and cost.
http://onsemi.com
CIRCUIT DESCRIPTION
Features:
• Provides USB Line Termination, Filtering and ESD Protection
GND
D(OUT)
5
D(OUT)
4
• Single IC Offers Cost Savings by Replacing 3 Resistors,
6
2 Capacitors, and 5 TVs diodes
• Bi−directional EMI Filtering Prevents Noise from Entering/Leaving
the System
• IEC61000−4−2 ESD Protection for USB Port
C
C
Rs1
Rs2
• Flexible Pull−down or Pull−up Line Termination to Meet USB 1.1
Low Speed and High Speed Specification
R
• ESD Ratings: Machine Model = C
up
1
2
3
D(IN)
ESD Ratings: Human Body Model = 3B
• This is a Pb−Free Device
V
BUS
D(IN)
Benefits:
• TSOP−6 Package Minimizes PCB Space
4
5
6
• Integrated Circuit Increases System Reliability versus Discrete
3
Component Implementation
2
1
• TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
TSOP−6
CASE 318G
STYLE 8
Typical Applications:
• USB Hubs
• Computer Peripherals Using USB
MARKING DIAGRAM
6
5
4
S22 MG
MAXIMUM RATINGS (T = 25°C)
A
G
Rating
Symbol
Value
225
Unit
mW
°C
1
2
3
Steady State Power
P
D
S22
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
T
125
J(max)
T
J
−55 to +125
−55 to +125
260
°C
(Note: Microdot may be in either location)
T
stg
°C
Lead Solder Temperature
(10 second duration)
T
L
°C
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†
Device
Package
Shipping
STF202−22T1G
TSOP−6
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
September, 2012 − Rev. 9
STF202−22T1/D
STF202−22T1G
ELECTRICAL CHARACTERISTICS (T = 25°C)
A
Max I
R
V
1 mA
(Volts)
@
BR
Max I
@ V
= 3.3 V
@ V
R
RWM
Series Resistor
(W) (Note 1)
Pull−up Resistor
(kW)
= 5.25 V
to
Typical Line
Capacitance
(pF)
RWM
R
R
up
S
V
BUS
Device
V
RWM
I/O Pin
GND
Min Max
Min Nom Max Min Nom Max
20 22 24 1.35 1.5 1.65
Marking (Volts)
(mA)
Device
(mA)
(Notes 2, 3)
STF202−22T1G
S22 5.25
6.0
8.0
5.0
1.0
68
1. For other R values (i.e. R = 30 W) contact your local ON Semiconductor sales representative.
S
S
2. Measured at 25°C, V = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded.
R
3. For other capacitance values contact your local ON Semiconductor sales representative.
TYPICAL CHARACTERISTICS
10
0
50
40
30
20
−10
−20
P = −25 dBm
Vdc = 0 V
P = −25 dBm
Vdc = 0 V
−30
−40
10
0
−50
−60
−70
−10
−20
−30
−80
−90
−40
−50
0.1
1
10
(MHz)
100
1000
0.1
1
10
(MHz)
100
1000
Figure 1. Analog Cross−talk (D+ to D−)
Figure 2. Insertion Loss Characteristics
22.2
22.0
21.8
21.6
21.4
1540
1530
1520
1510
1500
1490
1480
1470
R
TARGET
S−
TARGET
21.2
21.0
1460
1450
−30 −20 −10
0
10 20 30 40 50 60 70 80
−30 −20 −10
0
10 20 30 40 50 60 70 80
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. RS versus Temperature
Figure 4. Rup versus Temperature
http://onsemi.com
2
STF202−22T1G
APPLICATIONS BACKGROUND
What Is USB?
The USB is not a serial port, it is a serial bus, a fact that
enables a single port on the computer to be a link for a myriad
of devices, (up to 127 devices in a USB system). We can
easily chain one device to another and use one port as a
connecting point of many devices by using a hub. All these
enables us to look at the USB system as a small network of
devices.
The Universal Serial Bus (USB) makes connecting
devices to your computer faster, easier and virtually
limitless. High−Speed USB devices are capable of
communicating at speeds up to 12 megabits without shutting
down and without having to open your computer.
MONITOR
TELEPHONE
PLOTTER
MOUSE
SCANNER
HUB
COMPUTER PC
CPU
PRINTER
KEYBOARD
Figure 5. Typical USB System
Typically the USB system consists of one host, hubs and
devices.
or more USB functions. Most of the devices provide only
one function but there may be some, which provides more
than one and called compound devices. We refer to two
kinds of devices − self powered or bus powered devices. A
device that gets its power from the bus is called bus powered
and on the other hand a device which supplies its own power
is called self powered. There are two kinds of devices:
The Host in the USB system, is responsible to the whole
complexity of the protocol (simplifies the designing of USB
devices). The host controls the media access, therefore, no
one can access the bus unless it got an approval required
from the host.
The Hub provides an interconnect point, which enables
many devices to connect to a single USB port. The logical
topology of the USB is a star structure, all the devices are
connected (logically) directly to the host. It is totally
transparent to the device what is its hub tier (the number of
hubs the data has to flow through). The hub is connected to
the USB host in the upstream direction (data flows “up” to
the host) and is connected to the USB device in the
downstream direction (data flows “down” from the host to
the device). The hub’s main functionality is the
responsibility of detecting an attachment and detachment of
devices, handling the power management for devices that
are bus−powered (get power from the bus), and
responsibility for bus error detection and recovery. Another
important role of the hub is to manage both full and low
speed devices. When a device is attached to the system the
hub detects the speed, which the device operates in, and
through the whole communication on the bus prevents from
full speed traffic to reach low speed device and vice versa −
prevent from low speed traffic to reach full speed device.
The Device is defined as everything in the USB system,
which is not a host (including hubs). A device provides one
Full−speed devices − operates in 12 Mb/s
Low−speed devices that work in 1.5 Mb/s
STF202 Device Information
The Universal Serial Bus (USB) specification revision 1.1
requires EMI Filtering and line termination for the USB I/O
lines. The STF202 device from ON Semiconductor
provides upstream termination, EMI Filtering and ESD
Protection to IEC61000−4−2 (Level 4) in an integrated
solution placed in a small and single package (TSOP−6,
Case 318G). The equivalent circuit of this device is shown
in the Figure 6.
D
R
S1
Rpu
C
C
GROUND
R
S2
D
Figure 6.
http://onsemi.com
3
STF202−22T1G
5 V
As previously mentioned, there are two types of
Peripheral
USB
configurations for the USB port which are upstream and
downstream. If your port connects to the host either in a
direct way or through a hub, you are upstream (data flows
“up” to the host) and in the other hand, if you are the host or
your port provides access to the host then you are
downstream (data flows “down” from the host to the
device). In the case of the STF202 device, it provides
upstream termination. The Figure 7 represents the
termination for an upstream USB port.
Controller
1
2
3
6
5
4
STF202
D−
D−
D+
D+
GND
Figure 8.
V
CC
Low−Speed Devices
The Pull up resistor (Rpu) is connected to the D− Line. The
terminal 1 is connected to the Voltage Supply Line (V
Rpu
)
BUS
while the terminal 6 is connected to ground. The input of the
D− line is connected in the terminal 3 which outputs from the
terminal 4. Finally, the input of the D+ line is connected in
the terminal 2 which outputs from the terminal 5. The Figure
9 shows the connections of the STF202 device for
“Low−Speed devices”.
R
R
S
S
C
C
5 V
Peripheral
USB
Controller
1
2
3
6
5
4
Figure 7.
The USB Line termination is reached through the series
resistors placed in the D+ and D− lines. These resistors
insure the proper termination to maintain the integrity of the
signal. The Pull up Resistor of 1.5 kW on either the D+ or D−
data lines is used to identify the equipment as either
full−speed or low−speed device.
STF202
D+
D+
D−
D−
GND
Figure 9.
Connection for Full−Speed
and Low−Speed Devices
As mentioned before, there are two kinds of port devices:
Full−Speed devices − operates in 12 Mb/s
Low−Speed devices that work in 1.5 Mb/s
The STF202 device can be shaped to be used for either
Full−Speed or Low−Speed devices which is achieved as
described below:
Full−Speed Devices
The Pull up resistor (Rpu) is connected to the D+ Line.
The terminal 1 is connected to the Voltage Supply Line
(V ) while the terminal 6 is connected to ground. The
BUS
input of the D+ line is connected in the terminal 3 which
outputs from the terminal 4. Finally, the input of the D− line
is connected in the terminal 2 which outputs from the
terminal 5. The Figure 8 shows the connections of the
STF202 device for “Full−Speed devices”.
http://onsemi.com
4
STF202−22T1G
The Figure 10 describes in a simplified way what the USB
addition to the Line termination and EMI Filtering, it is also
needed to protect the USB I/O Lines against ESD
conditions, so TVS devices must be added for these
purposes.
port components are. As shown in this diagram, there are
signals for upstream and downstream ports which must be
provided with Line Termination and EMI Filtering to meet
the requirements of the USB specification revision 1.1. In
REGULATOR
CLK
CRISTAL
XTAL1
XTAL2
V
CC
GND
DPO
DMO
DP1−DP4
DM1−DM4
D+
To
Upstream
Ports
D−
USB Data Lines
and Power to
Downstream
Ports
V
BUS
OC1−OC4
POWER
SWITCHING
PWR1−PWR4
GND
Figure 10.
As mentioned before, the ON Semiconductor STF202
device provides “upstream termination”, EMI Filtering and
ESD Protection to IEC61000−4−2 in an integrated solution
placed in a small and single package (TSOP−6, Case 318G).
The typical application for the STF202 device is shown in
the Figure 11.
V
BUS
D+
V
D−
BUS
D1D+
DOWNSTREAM
TERMINATION
TVS
D+
GND
D1D−
6
1
5
4
3
D−
STF202
GND
2
POWER
SWITCH
OC
DOD+
OC
PWR
PWR
DOD−
REGULATOR
V
BUS
D2D+
DOWNSTREAM
TERMINATION
TVS
D+
D2D−
D−
USB CONTROLLER
GND
Figure 11.
http://onsemi.com
5
STF202−22T1G
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
H
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
6
1
5
4
L2
GAUGE
PLANE
E1
E
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
2
3
L
MILLIMETERS
SEATING
PLANE
M
C
NOTE 5
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
NOM
1.00
MAX
1.10
0.10
0.50
0.26
3.10
3.00
1.70
1.05
0.60
b
DETAIL Z
e
0.06
0.38
0.18
3.00
c
STYLE 8:
PIN 1. Vbus
2.75
A
0.05
1.50
2. D(in)-
3. D(in)+
4. D(out)+
5. D(out)-
6. GND
0.95
L
0.40
A1
L2
M
0.25 BSC
−
DETAIL Z
0°
10°
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
0.95
3.20
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
STF202−22T1/D
相关型号：
©2020 ICPDF网 联系我们和版权申明