STF202-22 [ONSEMI]

USB Filter with ESD Protection; USB过滤器与ESD保护


型号：	STF202-22
厂家：	ONSEMI
描述：	USB Filter with ESD Protection USB过滤器与ESD保护过滤器
文件：	总8页 (文件大小：57K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

STF202-22

USB Filter with ESD

Protection

This device is designed for applications requiring Line

Termination, EMI Filtering and ESD Protection. It is intended for

use in upstream USB ports, Cellular phones, Wireless equipment and

computer applications. This device offers an integrated solution in a

small package (TSOP–6, Case 318G) reducing PCB space and cost.

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CIRCUIT DESCRIPTION

Features:

• Provides USB Line Termination, Filtering and ESD Protection

• Single IC Offers Cost Savings by Replacing 3 Resistors,

2 Capacitors, and 5 TVs diodes

GND

D(OUT)

• Bi–directional EMI Filtering Prevents Noise from Entering/Leaving

the System

• IEC61000–4–2 ESD Protection for USB Port

Rs1

Rs2

• Flexible Pull–down or Pull–up Line Termination to Meet USB 1.1

Low Speed and High Speed Specification

• ESD Ratings: Machine Model = C

D(IN)

ESD Ratings: Human Body Model = 3B

BUS

D(IN)

Benefits:

• TSOP–6 Package Minimizes PCB Space

• Integrated Circuit Increases System Reliability versus Discrete

Component Implementation

• TVs Devices Provide ESD Protection That is Better than a Discrete

Implementation because the Small IC minimizes Parasitic

Inductances

TSOP–6

CASE 318G

STYLE 8

Typical Applications:

• USB Hubs

• Computer Peripherals Using USB

MARKING DIAGRAM

MAXIMUM RATINGS (T = 25°C)

Rating

Symbol

Value

225

Unit

°C

S22 D

Steady State Power

Maximum Junction Temperature

Operating Temperature Range

Storage Temperature Range

125

J(max)

–55 to +125

260

°C

S22

= Specific Device Code

= Date Code

stg

°C

Lead Solder Temperature

(10 second duration)

°C

ORDERING INFORMATION

Device

STF202–22T1

Package

Shipping

3000/Tape & Reel

TSOP–6

Semiconductor Components Industries, LLC, 2002

Publication Order Number:

July, 2002 – Rev. 6

STF202–22T1/D

STF202–22

ELECTRICAL CHARACTERISTICS (T = 25°C)

Max I

@ V

= 5.25 V

1 mA

(Volts)

Max I

RWM

Series Resistor

(W) (Note 1)

Pull–up Resistor

(kW)

@ V

Typical Line

Capacitance

(pF)

RWM

= 3.3 V

I/O Pin

(mA)

BUS

Device

RWM

GND

(mA)

Min Max

Min Nom Max Min Nom Max

20 22 24 1.35 1.5 1.65

Marking (Volts)

Device

(Notes 2, 3)

STF202–22T1

S22 5.25

6.0

8.0

5.0

1.0

1. For other R values (i.e. R = 30 W) contact your local ON Semiconductor sales representative.

2. Measured at 25°C, V = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded.

3. For other capacitance values contact your local ON Semiconductor sales representative.

TYPICAL CHARACTERISTICS

–10

–20

P = –25 dBm

Vdc = 0 V

P = –25 dBm

Vdc = 0 V

–30

–40

–50

–60

–70

–10

–20

–30

–80

–90

–40

–50

0.1

(MHz)

100

1000

0.1

(MHz)

100

1000

Figure 1. Analog Cross–talk (D+ to D–)

Figure 2. Insertion Loss Characteristics

22.2

22.0

21.8

21.6

21.4

1540

1530

1520

1510

1500

1490

1480

1470

TARGET

S–

TARGET

21.2

21.0

1460

1450

–30 –20 –10

10 20 30 40 50 60 70 80

–30 –20 –10

10 20 30 40 50 60 70 80

TEMPERATURE (°C)

Figure 3. R_Sversus Temperature

Figure 4. R_upversus Temperature

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STF202–22

APPLICATIONS BACKGROUND

What Is USB?

The USB is not a serial port, it is a serial bus, a fact that

enables a single port on the computer to be a link for a myriad

of devices, (up to 127 devices in a USB system). We can

easily chain one device to another and use one port as a

connecting point of many devices by using a hub. All these

enables us to look at the USB system as a small network of

devices.

The Universal Serial Bus (USB) makes connecting

devices to your computer faster, easier and virtually

limitless. High–Speed USB devices are capable of

communicating at speeds up to 12 megabits without shutting

down and without having to open your computer.

MONITOR

TELEPHONE

PLOTTER

MOUSE

SCANNER

HUB

COMPUTER PC

CPU

PRINTER

KEYBOARD

Figure 5. Typical USB System

Typically the USB system consists of one host, hubs and

devices.

or more USB functions. Most of the devices provide only

one function but there may be some, which provides more

than one and called compound devices. We refer to two

kinds of devices – self powered or bus powered devices. A

device that gets its power from the bus is called bus powered

and on the other hand a device which supplies its own power

is called self powered. There are two kinds of devices:

The Host in the USB system, is responsible to the whole

complexity of the protocol (simplifies the designing of USB

devices). The host controls the media access, therefore, no

one can access the bus unless it got an approval required

from the host.

The Hub provides an interconnect point, which enables

many devices to connect to a single USB port. The logical

topology of the USB is a star structure, all the devices are

connected (logically) directly to the host. It is totally

transparent to the device what is its hub tier (the number of

hubs the data has to flow through). The hub is connected to

the USB host in the upstream direction (data flows “up” to

the host) and is connected to the USB device in the

downstream direction (data flows “down” from the host to

the device). The hub’s main functionality is the

responsibility of detecting an attachment and detachment of

devices, handling the power management for devices that

are bus–powered (get power from the bus), and

responsibility for bus error detection and recovery. Another

important role of the hub is to manage both full and low

speed devices. When a device is attached to the system the

hub detects the speed, which the device operates in, and

through the whole communication on the bus prevents from

full speed traffic to reach low speed device and vice versa –

prevent from low speed traffic to reach full speed device.

The Device is defined as everything in the USB system,

which is not a host (including hubs). A device provides one

Full–speed devices – operates in 12 Mb/s

Low–speed devices that work in 1.5 Mb/s

STF202 Device Information

The Universal Serial Bus (USB) specification revision 1.1

requires EMI Filtering and line termination for the USB I/O

lines. The STF202 device from ON Semiconductor

provides upstream termination, EMI Filtering and ESD

Protection to IEC6100–4–2 (Level 4) in an integrated

solution placed in a small and single package (TSOP–6,

Case 318G). The equivalent circuit of this device is shown

in the Figure 6.

Rpu

GROUND

Figure 6.

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STF202–22

3.3 V

As previously mentioned, there are two types of

Peripheral

USB

Controller

configurations for the USB port which are upstream and

downstream. If your port connects to the host either in a

direct way or through a hub, you are upstream (data flows

“up” to the host) and in the other hand, if you are the host or

your port provides access to the host then you are

downstream (data flows “down” from the host to the

device). In the case of the STF202 device, it provides

upstream termination. The Figure 7 represents the

termination for an upstream USB port.

STF202

D–

D+

D–

D+

GND

Figure 8.

Low–Speed Devices

The Pull up resistor (Rpu) is connected to the D– Line. The

terminal 1 is connected to the Voltage Supply Line (V

Rpu

)

BUS

while the terminal 6 is connected to ground. The input of the

D– line is connected in the terminal 3 which outputs from the

terminal 4. Finally, the input of the D+ line is connected in

the terminal 2 which outputs from the terminal 5. The Figure

9 shows the connections of the STF202 device for

“Low–Speed devices”.

3.3 V

Peripheral

USB

Controller

Figure 7.

The USB Line termination is reached through the series

resistors placed in the D+ and D– lines. These resistors

insure the proper termination to maintain the integrity of the

signal. The Pull up Resistor of 1.5 kW on either the D+ or D–

data lines is used to identify the equipment as either

full–speed or low–speed device.

STF202

D+

D–

D+

D–

GND

Figure 9.

Connection for Full–Speed

and Low–Speed Devices

As mentioned before, there are two kinds of port devices:

Full–Speed devices – operates in 12 Mb/s

Low–Speed devices that work in 1.5 Mb/s

The STF202 device can be shaped to be used for either

Full–Speed or Low–Speed devices which is achieved as

described below:

Full–Speed Devices

The Pull up resistor (Rpu) is connected to the D+ Line.

The terminal 1 is connected to the Voltage Supply Line

(V ) while the terminal 6 is connected to ground. The

BUS

input of the D+ line is connected in the terminal 3 which

outputs from the terminal 4. Finally, the input of the D– line

is connected in the terminal 2 which outputs from the

terminal 5. The Figure 8 shows the connections of the

STF202 device for “Full–Speed devices”.

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STF202–22

The Figure 10 describes in a simplified way what the USB

addition to the Line termination and EMI Filtering, it is also

needed to protect the USB I/O Lines against ESD

conditions, so TVS devices must be added for these

purposes.

port components are. As shown in this diagram, there are

signals for upstream and downstream ports which must be

provided with Line Termination and EMI Filtering to meet

the requirements of the USB specification revision 1.1. In

REGULATOR

CLK

CRISTAL

XTAL1

XTAL2

GND

DPO

DMO

DP1–DP4

DM1–DM4

D+

Upstream

Ports

D–

USB Data Lines

and Power to

Downstream

Ports

BUS

OC1–OC4

POWER

SWITCHING

PWR1–PWR4

GND

Figure 10.

As mentioned before, the ON Semiconductor STF202

device provides “upstream termination”, EMI Filtering and

ESD Protection to IEC6100–4–2 in an integrated solution

placed in a small and single package (TSOP–6, Case 318G).

The typical application for the STF202 device is shown in

the Figure 11.

BUS

D+

D–

BUS

D1D+

D1D–

DOWNSTREAM

TERMINATION

TVS

D+

D–

GND

STF202

GND

POWER

SWITCH

DOD+

DOD–

PWR

REGULATOR

BUS

D2D+

D2D–

DOWNSTREAM

TERMINATION

TVS

D+

D–

USB CONTROLLER

GND

Figure 11.

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STF202–22

OUTLINE DIMENSIONS

EMI Filter with ESD Protection

TSOP–6

CASE 318G–02

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

2.90

1.30

0.90

0.25

0.85

0.013

0.10

0.20

1.25

3.10 0.1142 0.1220

1.70 0.0512 0.0669

1.10 0.0354 0.0433

0.50 0.0098 0.0197

1.05 0.0335 0.0413

0.100 0.0005 0.0040

0.26 0.0040 0.0102

0.60 0.0079 0.0236

1.55 0.0493 0.0610

0.05 (0.002)

3.00 0.0985 0.1181

2.50

STYLE 8:

PIN 1. Vbus

2. D(in)-

3. D(in)+

4. D(out)+

5. D(out)-

6. GND

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STF202–22

Notes

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STF202–22

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make

changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all

liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be

validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.

SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death

may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.

PUBLICATION ORDERING INFORMATION

Literature Fulfillment:

JAPAN: ON Semiconductor, Japan Customer Focus Center

4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031

Phone: 81–3–5740–2700

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada

Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada

Email: ONlit@hibbertco.com

Email: r14525@onsemi.com

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your local

Sales Representative.

N. American Technical Support: 800–282–9855 Toll Free USA/Canada

STF202–22T1/D

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STF202-22 [ONSEMI]

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