SZEMI8141MUTAG [ONSEMI]
带 ESD 保护的共模滤波器;
| 型号： | SZEMI8141MUTAG |
| 厂家： | 
ONSEMI |
| 描述： | 带 ESD 保护的共模滤波器 |
| 文件： | 总10页 (文件大小：587K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EMI8141, EMI8142,
EMI8143
Common Mode Filter with
ESD Protection
Functional Description
http://onsemi.com
The EMI814x is a family of Common Mode Filters (CMF) with
integrated ESD protection, a first in the industry. Differential signaling
I/Os can now have both common mode filtering and ESD protection in
one package. The EMI814x protects against ESD pulses up to 15 kV
contact per the IEC61000−4−2 standard.
XDFN6
XDFN10
XDFN16
The EMI814x is well−suited for protecting systems using
high−speed differential ports such as USB 3.0, MIPI D−PHY;
corresponding ports in removable storage, and other applications
where ESD protection are required in a small footprint package.
The EMI814x is available in a RoHS−compliant, XDFN6 for 1
Differential Pair, XDFN−10 for 2 Differential Pair and XDFN−16
package for 3 Differential Pair.
CASE 711AV CASE 711AU
CASE 711AW
MARKING DIAGRAMS
4A M
42 M
43 M
G
G
G
1
1
1
XX = Specific Device Code
M
= Date Code
Features
G
= Pb−Free Package
• Total Insertion Loss DM
• Large Differential Mode Cutoff Frequency f
< 2.5 dB at 2.5 GHz
LOSS
ELECTRICAL SCHEMATICS
> 5 GHz
3dB
• High Common Mode Stop Band Attenuation:
> 10 dB at 500 MHz , 15 dB at 700 MHz
• Low Channel Resistance 6.0 W
• Provides ESD Protection to IEC61000−4−2 Level 4, 15 kV Contact
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
EMI8142
Applications
• USB 3.0
• MHL 2.0
• mSD Card
• eSATA
• HDMI/DVI Display in Mobile Phones
• MIPI D−PHY (CSI−2, DSI, etc) in Mobile Phones and Digital Still
Cameras
EMI8143
ORDERING INFORMATION
†
Device
Package
Shipping
EMI8141MUTAG
XDFN6
3000 / Tape & Reel
EMI8142MUTAG XDFN10 3000 / Tape & Reel
EMI8143MUTAG XDFN16 3000 / Tape & Reel
Figure 1. EMI8141 Electrical Schematic
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
June, 2014 − Rev. 0
EMI8141/D
EMI8141, EMI8142, EMI8143
PIN FUNCTION DESCRIPTION
Device Pin
EMI8141
1
EMI8142
EMI8143
Pin Name
In_1+
Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
Description
CMF Channel 1+ to Connector (External)
CMF Channel 1− to Connector (External)
CMF Channel 1+ to ASIC (Internal)
CMF Channel 1− to ASIC (Internal)
CMF Channel 2+ to Connector (External)
CMF Channel 2− to Connector (External)
CMF Channel 2+ to ASIC (Internal)
CMF Channel 2− to ASIC (Internal)
CMF Channel 3+ to Connector (External)
CMF Channel 3− to Connector (External)
CMF Channel 3+ to ASIC (Internal)
CMF Channel 3− to ASIC (Internal)
Ground
1
2
1
In_1−
2
2
Out_1+
Out_1−
In_2+
6
10
9
16
5
15
NA
NA
NA
NA
NA
NA
NA
NA
3,4
4
4
In_2−
5
5
Out_2+
Out_2−
In_3+
7
13
6
12
NA
NA
NA
NA
3, 8
7
In_3−
8
Out_3+
Out_3−
VN
10
9
3,6,14,11
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Parameter
Operating Temperature Range
Symbol
Value
−40 to +85
−65 to +150
260
Unit
°C
T
OP
Storage Temperature Range
T
STG
°C
Maximum Lead Temperature for Soldering Purposes
(1/8” from Case for 10 seconds)
T
L
°C
DC Current per Line
I
100
mA
LINE
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
http://onsemi.com
2
EMI8141, EMI8142, EMI8143
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
V
V
RWM
Reverse Working Voltage
(Note 3)
3.3
V
Breakdown Voltage
I = 1 mA; (Note 4)
4.0
9.0
1.0
V
BR
T
I
Channel Leakage Current
T = 25°C, V = 3.3 V, GND = 0 V
mA
W
LEAK
A
IN
R
Channel Resistance
6.0
CH
(Pins 1−6, 2−5) − EMI8141
(Pins 1−10, 2−9, 4−7 and 5−6) − EMI8142
(Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8143
DM
Differential Mode Insertion Loss
@ 2.5 GHz
2.5
5.0
dB
LOSS
f
Differential Mode Cut-off Frequency
50 W Source and Load
GHz
3dB
Termination
F
Common Mode Stop Band Attenuation
@ 700 MHz
15
dB
kV
atten
V
In-system ESD Withstand Voltage
a) Contact discharge per IEC 61000-4-2 standard, Level 4
(External Pins)
b) Contact discharge per IEC 61000-4-2 standard, Level 1
(Internal Pins)
(Notes 1 and 2)
ESD
15
2
V
CL
TLP Clamping Voltage
Forward I = 8 A
7.26
11.8
−3.5
−6.7
V
PP
Forward I = 16 A
PP
Forward I = −8 A
PP
Forward I = −16 A
PP
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Standard IEC61000−4−2 with C
= 150 pF, R
= 330, GND grounded.
Discharge
Discharge
2. These measurements performed with no external capacitor.
3. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
), which should be equal to or greater than the DC
RWM
4. V is measured at pulse test current I .
BR
T
http://onsemi.com
3
EMI8141, EMI8142, EMI8143
TYPICAL CHARACTERISTICS
0
−1
−2
−3
−4
−5
−6
−7
−8
−9
−10
0
−5
−10
−15
−20
−25
−30
−35
−40
m1
−45
−50
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 2. Typical Differential Mode Attenuation
vs. Frequency
Figure 3. Typical Common Mode Attenuation
vs. Frequency
Interface
Data Rate (Gb/s)
Fundamental Frequency (GHz)
ESD814x Insertion Loss (dB)
USB 3.0
5
2.5 (m1)
m1 = 2.13
http://onsemi.com
4
EMI8141, EMI8142, EMI8143
TRANSMISSION LINE PULSE (TLP) MEASUREMENTS
Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a
100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in
Figure 4. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s
of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV
IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at
which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I−V curves
for the EMI814x are shown in Figure 4.
Attenuator
L
50 W Coax Cable
SW
÷
50 W Coax Cable
VM
IM
10 MQ
VC
DUT
Oscilloscope
Figure 4. Simplified Schematic of a Typical TLP System
Figure 5. Comparison Between 8 kV IEC61000- 4- 2 and 8 A and 16 A TLP Waveforms
18
16
14
12
10
8
−18
−16
−14
−12
−10
−8
6
−6
−4
4
−2
2
0
0
0
2
4
6
8
10
12
14
16
18
0
−2
−4
−6
−8 −10 −12 −14 −16 −18
V (V)
clamp
V
clamp
(V)
Figure 6. Positive and Negative TLP Waveforms
http://onsemi.com
5
EMI8141, EMI8142, EMI8143
Pattern Generator
(5 Gbps, PRBS31 Pattern)
50 GHz Sampling Oscilloscope
ONsemi high speed test board
(Rogers 4003 Material, Southwest
Microwave 2.4mm Connectors)
Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate
Figure 8. Eye Diagram 5Gbps with and without EMI814x
Eye Height (mVppd)
Rise Time (ps)
Fall Time (ps)
29.6
Jrms (ps)
1.997
Jpp (ps)
9.6
Reference (No Device)-Left Figure
EMI814x Right Figure
724
405
30.4
60
60.8
3.484
16
http://onsemi.com
6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN10 2.2x1.35, 0.4P
CASE 711AU
ISSUE B
DATE 17 JUN 2014
SCALE 4:1
NOTES:
A
B
E
D
L
L
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM THE TERMINAL TIP.
PIN ONE
REFERENCE
L1
2X
0.10
C
MILLIMETERS
DETAIL A
DIM MIN
MAX
0.50
0.05
ALTERNATE
A
A1
A3
b
0.40
0.00
CONSTRUCTIONS
2X
0.10 C
TOP VIEW
0.15 REF
0.15
0.25
D
2.20 BSC
1.35 BSC
0.40 BSC
0.40 0.60
--- 0.15
EXPOSED Cu
MOLD CMPD
A
C
DETAIL B
E
(A3)
0.10
0.08
C
e
L
L1
C
DETAIL B
ALTERNATE
GENERIC
MARKING DIAGRAM*
A1
SEATING
PLANE
CONSTRUCTION
SIDE VIEW
XX M
G
DETAIL A
8X L
e
5
1
XX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
10
6
b
10X
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
M
M
C A B
0.10
NOTE 3
C
0.05
BOTTOM VIEW
RECOMMENDED
MOUNTING FOOTPRINT
9X
PACKAGE
OUTLINE
8X
0.25
0.65
1.55
1
0.50
0.40 PITCH
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON83517F
XDFN10 2.2X1.35, 0.4P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN6 1.40x1.35, 0.4P
CASE 711AV
ISSUE A
SCALE 4:1
DATE 04 JUN 2014
NOTES:
L
L
A
B
E
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
PIN 1
REFERENCE
2X
0.10
C
L1
MILLIMETERS
DETAIL A
DIM MIN
MAX
0.50
0.05
ALTERNATE TERMINAL
CONSTRUCTIONS
A
A1
A3
b
0.40
0.00
2X
6X
0.10 C
TOP VIEW
0.15 REF
0.15
0.25
EXPOSED Cu
MOLD CMPD
D
1.40 BSC
1.35 BSC
0.40 BSC
0.40 0.60
--- 0.15
A
DETAIL B
E
(A3)
0.10
0.08
C
C
e
A1
L
L1
DETAIL B
ALTERNATE
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
CONSTRUCTION
C
SIDE VIEW
e
XXMG
6X
L
G
1
3
DETAIL A
XX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
4
6
6X b
(Note: Microdot may be in either location)
M
C A B
0.10
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
NOTE 3
C
M
0.05
BOTTOM VIEW
RECOMMENDED
MOUNTING FOOTPRINT
6X
0.65
0.40
PITCH
1.55
1
0.50
5X
0.25
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON83554F
XDFN6 1.40X1.35, 0.4P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN16 3.5x1.35, 0.4P
CASE 711AW
16
ISSUE A
DATE 17 JUN 2014
1
SCALE 4:1
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2X
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
0.10
C
L1
DETAIL A
PIN ONE
E
REFERENCE
ALTERNATE TERMINAL
CONSTRUCTIONS
MILLIMETERS
DIM MIN
MAX
0.50
0.05
2X
A
A1
A3
b
0.40
0.00
0.15 REF
0.15
3.50 BSC
0.10
C
TOP VIEW
EXPOSED Cu
MOLD CMPD
0.25
DETAIL B
A
D
(A3)
E
e
1.35 BSC
0.40 BSC
0.10
C
C
L
L1
0.40
−−−
0.60
0.15
DETAIL B
ALTERNATE
16X
0.08
CONSTRUCTION
SEATING
PLANE
A1
NOTE 4
C
SIDE VIEW
GENERIC
MARKING DIAGRAM*
e/2
DETAIL A
e
XXXM
G
12X L
8
1
1
XXX = Specific Device Code
16
9
M
= Month Code
16X b
G
= Pb−Free Package
0.10
0.05
C
C
A B
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
12X
0.65
0.40
PITCH
1.55
1
15X
0.25
0.55
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON83555F
XDFN16 3.5X1.35, 0.4P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
www.onsemi.com/support/sales
相关型号：
SZEMI8142MUTAG
带 ESD 保护的共模滤波器Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZEMI8143MUTAG
带 ESD 保护的共模滤波器Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZEMI9404MUTAG
EMI Array, 4-Channel, with ESD ProtectionWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZEMI9406MUTAG
EMI Filter Array, L-C with ESD Protection, for LCD and CameraWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZEMI9408MUTAG
带 ESD 保护的 L-C EMI 滤波器阵列Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZESD1014MUTAG
ESD Protection Array, Low Capacitance, for High Speed Data LinesWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZESD11A5.0DT5G
ESD / 浪涌保护器Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZESD1L001W1T2G
低电容 ESD 保护二极管，用于高速数据线Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZESD5B5.0ST1G
ESD 保护二极管，双向Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZESD5B5.0ST5G
ESD 保护二极管，双向Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZESD5Z12T1G
ESD 保护二极管，SOD-523Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
SZESD5Z12T5G
ESD 保护二极管，SOD-523Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ONSEMI
©2020 ICPDF网 联系我们和版权申明