SZNZL7V5AXV3T1G [ONSEMI]
ESD Protection Common Anode Diodes;
| 型号： | SZNZL7V5AXV3T1G |
| 厂家： | 
ONSEMI |
| 描述： | ESD Protection Common Anode Diodes 局域网 测试 光电二极管 瞬态抑制器 |
| 文件： | 总6页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NZL5V6AXV3T1 Series
Preferred Devices
Dual Common Anode
ESD Protection Diodes
SC−89 Package
These dual monolithic silicon ESD protection diodes are intended for
use in voltage− and ESD−sensitive equipment such as computers,
printers, business machines, communication systems, medical
equipment and other applications. Their dual junction common anode
design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
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1
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
3
MARKING
DIAGRAM
Specification Features:
• SC−89 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
• ESD Rating of Class N (exceeding 16 kV) per the
Human Body Model
3
Lx
G
SC−89
CASE 463C
STYLE 4
G
• Meets IEC61000−4−2 Level 4
1
2
• Low Leakage < 5.0 mA
L
x
M
G
= Device Code
= Specific Device
= Date Code
• These are Pb−Free Devices
Mechanical Characteristics:
= Pb−Free Package
CASE: Void-free, Transfer-molded, Thermosetting Plastic
(Note: Microdot may be in either location)
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
ORDERING INFORMATION
†
Device
Package
Shipping
QUALIFIED MAX REFLOW TEMPERATURE:
260°C Device Meets MSL 1 Requirements
NZL5V6AXV3T1
SC−89*
3000/Tape & Reel
3000/Tape & Reel
NZL5V6AXV3T1G SC−89*
NZL6V8AXV3T1
NZL6V8AXV3T1G SC−89*
NZL6V8AXV3T3G SC−89* 10000/Tape & Reel
NZL7V5AXV3T1 SC−89* 3000/Tape & Reel
NZL7V5AXV3T1G SC−89* 3000/Tape & Reel
SC−89* 3000/Tape & Reel
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
February, 2007 − Rev. 5
NZL5V6AXV3T1/D
NZL5V6AXV3T1 Series
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Total Power Dissipation on FR−5 Board (Note 1) @ T = 25°C
°P °
D
240
1.9
°mW°
mW/°C
A
Derate above 25°C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum (10 Second Duration)
IEC61000−4−2 (Contact)
R
525
−55 to +150
260
°C/W
°C
q
JA
T , T
J
stg
T
°C
L
10
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. FR−5 board with minimum recommended mounting pad.
*Other voltages may be available upon request.
ELECTRICAL CHARACTERISTICS
I
(T = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
A
I
F
Symbol
Parameter
V
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
RWM
I
R
RWM
V
V
V
BR RWM
C
V
I
V
V
Breakdown Voltage @ I
R
T
F
BR
T
I
I
Test Current
T
F
I
Forward Current
V
Forward Voltage @ I
F
F
I
PP
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 0.9 V Max @ I = 10 mA for all types)
A
F
F
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
Breakdown Voltage
Surge
(V) @ Max I
V
I
(V) @
= 1.0
A
C
V
P
pk
(W)
I
V
@
RWM
mA
C
PP
†
PP
R
†
†
†
Max I
(A)
V
Min
(Note 2) (V)
@ Iz
T
V
PP
BR
RWM
Device
V
Nom
5.6
Max
mA
5.0
5.0
5.0
5.0
Typ
7.0
7.9
7.9
8.8
Max
10.1
11.9
11.9
13.5
Typ
50
Marking
Device
NZL5V6AXV3T1
NZL6V8AXV3T1
NZL6V8AXV3T3
NZL7V5AXV3T1
L0
L2
L2
L3
3.0
4.5
4.5
5.0
5.0
1.0
1.0
1.0
5.32
6.46
6.46
7.12
5.88
7.14
7.14
7.88
4.8
6.7
6.7
5.7
6.8
73
6.8
73
7.5
75
2. V measured at pulse test current I at an ambient temperature of 25°C.
BR
T
†
Surge current waveform per Figure 5.
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2
NZL5V6AXV3T1 Series
TYPICAL CHARACTERISTICS
9.0
8.0
7.0
6.0
5.0
250
200
150
100
7V5
6V8
5V6
6V8
5V6
50
0
7V5
−55
−5
+45
TEMPERATURE (°C)
+95
+145
−55
−5
+45
TEMPERATURE (°C)
+95
+145
Figure 1. Typical Breakdown Voltage
versus Temperature
Figure 2. Typical Leakage Current
versus Temperature
50
300
250
200
45
40
35
30
25
20
15
10
5
5V6
6V8
7V5
150
100
50
FR−5 BOARD
0
0
0
0.4
0.8
1.2
1.6
2.0
0
25
50
75
100
125
150
175
VOLTAGE (V)
TEMPERATURE (°C)
Figure 3. Typical Capacitance versus Bias Voltage
(Upper curve for each part is unidirectional mode,
lower curve is bidirectional mode)
Figure 4. Steady State Power Derating Curve
100
t
r
PEAK VALUE I
@ 8 ms
RSM
90
80
70
60
50
40
30
20
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
HALF VALUE I /2 @ 20 ms
RSM
t
P
10
0
0
20
40
t, TIME (ms)
60
80
Figure 5. 8 X 20 ms Pulse Waveform
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3
NZL5V6AXV3T1 Series
Figure 6. Positive 8 kV contact per IEC 6100−4−2
− NZL6V8AXV3T1G
Figure 7. Negative 8 kV contact per IEC 6100−4−2
− NZL6V8AXV3T1G
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4
NZL5V6AXV3T1 Series
TYPICAL COMMON ANODE APPLICATIONS
A dual junction common anode design in an SC−89
package protects two separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of TVS applications are illustrated below.
A
B
KEYBOARD
TERMINAL
PRINTER
ETC.
FUNCTIONAL
DECODER
C
I/O
D
GND
NZLxxxAXV3T1
Figure 8. Computer Interface Protection
V
V
DD
GG
ADDRESS BUS
RAM
ROM
DATA BUS
CPU
NZLxxxAXV3T1
I/O
CLOCK
CONTROL BUS
GND
NZLxxxAXV3T1
Figure 9. Microprocessor Protection
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5
NZL5V6AXV3T1 Series
PACKAGE DIMENSIONS
SC−89, 3−LEAD
CASE 463C−03
ISSUE C
NOTES:
A
−X−
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
3
S
B
−Y−
1
2
4. 463C−01 OBSOLETE, NEW STANDARD 463C−02.
K
MILLIMETERS
DIM MIN NOM MAX
INCHES
MIN NOM MAX
G
2 PL
A
B
C
D
G
H
J
K
L
M
N
S
1.50
0.75
0.60
0.23
1.60
0.85
0.70
1.70 0.059 0.063 0.067
0.95 0.030 0.034 0.040
0.80 0.024 0.028 0.031
0.33 0.009 0.011 0.013
0.020 BSC
3 PL
D
0.28
M
0.08 (0.003)
X Y
0.50 BSC
0.53 REF
0.15
0.40
1.10 REF
−−−
0.021 REF
0.10
0.30
0.20 0.004 0.006 0.008
0.50 0.012 0.016 0.020
0.043 REF
−−−
−−−
1.50
10
10
−−−
−−−
−−−
−−−
10
10
_
_
_
_
−−−
N
1.60
1.70 0.059 0.063 0.067
M
J
C
STYLE 4:
SEATING
PLANE
PIN 1. CATHODE
2. CATHODE
3. ANODE
−T−
SOLDERING FOOTPRINT
H
H
L
G
RECOMMENDED PATTERN
OF SOLDER PADS
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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NZL5V6AXV3T1/D
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