RS7302-33NHFNEG [ORISTER]
600mA Adjustable & Fixed Voltage LDO Linear Regulator with Enable, Fast Discharge & Soft.Start; 600毫安可调及固定电压LDO线性稳压器,带有使能,快速放电和Soft.Start型号: | RS7302-33NHFNEG |
厂家: | ORISTER CORPORATION |
描述: | 600mA Adjustable & Fixed Voltage LDO Linear Regulator with Enable, Fast Discharge & Soft.Start |
文件: | 总11页 (文件大小:696K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Page No. : 1/11
RS7302
600mA Adjustable & Fixed Voltage LDO Linear Regulator with Enable, Fast Discharge & Soft‐Start
General Description
The RS7302 series is a low‐dropout linear regulator with ON/OFF control that operates in the input voltage range from
+2.4V to +7.0V and delivers 600mA output current.
The RS7302 is available fixed output voltage type is preset at an internally trimmed voltage 1.8V, 2.5V, or 3.3V. Other
options 1.0V, 1.2V,1.5V, 2.85V, 3.0V and 3.6V are available by special order only.
The RS7302 series consists of a 0.95V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other
features include soft‐start function, short‐circuit protection and thermal shutdown protection. The RS7302 series devices
are available in SOT‐25, SC‐70‐5 & SOP‐8 packages.
Features
Applications
◎ Operating Voltage Range:+2.4V to +7.0V
◎ Output Voltages:+1.0V to +5.0V (0.1V Step), +1.25V to
+5.0V
◎ Dropout Voltage:500mV@600mA (Fixed)
◎ Fast Response in Power‐on:35uS
◎ Low Current Consumption:60μA (Typ.)
◎ Low ESR Capacitor Compatible
◎ High Ripple Rejection:65dB (Typ.)
◎ Short Circuit Protection:200mA (Typ.)
◎ Thermal Overload Shutdown Protection
◎ SOT‐25, SC‐70‐5 and SOP‐8 packages
◎ RoHS Compliant and 100% Lead (Pb)‐Free and Green
(Halogen Free with Commercial Standard)
◎ Battery‐Powered Equipments
◎ Graphic Card, Peripheral Card
◎ PCMCIA & New Card
◎ Mini PCI & PCI‐Express Cards
◎ Digital Still Camera
◎ CDMA/GSM Cellular Handsets
◎ Laptop, Palmtops, Notebook Computers
◎ Portable Information Application
Application Circuits
Soft‐Start Function
This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DS‐RS7302‐02 September, 2009
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Pin Assignments
SOT‐25
SC‐70‐5
SOP‐8
PACKAGE
PIN
1
2
SYMBOL
VIN
GND
EN
DESCRIPTION
Regulator Input Pin
Ground Pin or ADJ Pin
Enable Pin
SOT‐25
3
4
SS
Soft‐Start Pin
5
VOUT
Regulator Output Pin
PACKAGE
PIN
1
2
SYMBOL
VIN
GND
EN
DESCRIPTION
Regulator Input Pin
Ground Pin or ADJ Pin
Enable Pin
SC‐70‐5
3
4
SS
Soft‐Start Pin
5
VOUT
Regulator Output Pin
PACKAGE
PIN
1
SYMBOL
EN
DESCRIPTION
Enable Pin
2
3
4
VIN
VOUT
SS
Regulator Input Pin
Regulator Output Pin
Soft‐Start Pin
SOP‐8
5, 6, 7, 8
GND
Ground Pin or ADJ Pin
Ordering Information
DEVICE
DEVICE CODE
XX is nominal output voltage (for example, AD=ADJ, 18 = 1.8V, 33 = 3.3V, 285 = 2.85V).
EEE is CE Input Logic & Discharge Function Selection : (see CE & Discharge Function Selection
Table)
YY is package designator :
NE : SOT‐25
SC : SC‐70‐5
RS7302‐XX EEE YY Z
S : SOP‐8
Z is Lead Free designator :
P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package
G: Green (Halogen Free with Commercial Standard)
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CE & Discharge Function Selection Table
EEE
CODE
NHF
NLF
NHN
NLN
UHF
ULF
EN Type
EEE
CODE
UHN
ULN
DHF
DLF
EN Type
Discharge
Discharge
Type 1
None
None
None
None
Type 2
Type 1
Pull High
Pull High
Pull Low
Pull Low
Pull Low
Pull Low
Type 2
High Active
Low Active
High Active
Low Active
High Active
Low Active
Fast
Fast
Normal
Normal
Fast
High Active
Low Active
High Active
Low Active
High Active
Low Active
Normal
Normal
Fast
Fast
Normal
Normal
Pull High
Pull High
DHN
DLN
Fast
Block Diagram
Absolute Maximum Ratings
Parameter
Symbol
Ratings
9.0
1.0
+155
155
333
Units
V
Input Voltage VIN to GND
Output Current Limit, I(LIMIT)
Junction Temperature
VIN
ILIMIT
TJ
A
oC
SOT‐25
SC‐70‐5
SOP‐8
Thermal Resistance
oC/W
θJA
60
SOT‐25
SC‐70‐5
SOP‐8
350
250
1670
‐40 ~ +85
‐55~+150
+260
Power Dissipation
PD
mW
Operating Ambient Temperature
Storage Temperature
Lead Temperature (soldering, 10sec)
NOTES:
TOPR
TSTG
‐
oC
oC
oC
1
The power dissipation values are based on the condition that junction temperature TJ and ambient temperature TA difference is
100°C.
2
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolute‐maximum –rated conditions for extended periods may affect device
reliability.
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Electrical Characteristics (TA=25°C, VIN=5.0V unless otherwise specified)
Symbol
VIN
Parameter
Input Voltage
Conditions
Min. Typ. Max.
Unit
V
‐
2.4
‐
7.0
‐2%
+2%
V
VIN=VOUT+1.0V, IOUT=1mA, VOUT≧1.8V
VIN=VOUT+1.0V, IOUT=1mA, VOUT<1.8V, VIN
>2.4V
VIN=VOUT+1.2V, IOUT=1mA, VOUT≧1.8V
VIN=VOUT+1.2V, IOUT=1mA, VOUT<1.8V, VIN
>2.4V
Fixed
Type
‐35
‐2%
‐50
+35
+2%
+50
mV
V
VOUT
Output Voltage
VOUT
ADJ
Type
mV
mA
mV
%/V
IMAX
Output Current (see NOTE)
Dropout Voltage
600
‐
100
500
0.2
0.01
60
0.7
250
65
40
‐
‐
‐
‐
VOUT+1.0V≦VIN≦7.0V, VOUT≧2.4V
IOUT=100mA, VOUT>3.0V
IOUT=600mA, VOUT>3.0V
‐
‐
‐
‐
‐
VDROP
ΔVLINE
ΔVLOAD
IQ
ISD
ISC
Line Regulation
Load Regulation
Ground Pin Current
Shutdown Current
Short Circuit Current
Ripple Rejection
0.3
VOUT+1.0V≦VIN≦7V, IOUT=1mA
VIN=VOUT+1V, 1mA≦IOUT≦100mA
ILOAD=0mA to 1.0A, VIN=VOUT+1.0V
VIN=VOUT+1V, EN=0V, No Load
‐
IOUT=30mA, F=1KHz, COUT=3.3uF
IOUT=100mA , F=1KHz, COUT=3.3uF
VIN≦5.0V
0.02 %/mA
‐
‐
‐
‐
‐
‐
uA
uA
mA
dB
uV(rms)
V
‐
‐
‐
PSRR
eN
Output Noise
VIH
VIL
RDIS
TDIS
TSS
EN Pin Input Voltage “H”
EN Pin Input Voltage “L”
Discharge Resistor
Discharge Time
1.6
VIN≦5.0V
‐
‐
‐
‐
‐
0.3
100
100
‐
V
Ω
us
ms
VEN=0V, For Fixed Voltage Type
VOUT=3.3V to 0V, COUT=1uF, For Fixed Voltage Type
VOUT=3.3V, CSS=47nF, CIN=COUT=1uF
30
70
10
Soft‐Start Time
Thermal Shutdown
Temperature
Thermal Shutdown Hysteresis
TSD
‐
‐
‐
‐
150
20
‐
‐
oC
oC
THYS
NOTE:Measured using a double sided board with 1” x 2” square inches of copper area connected to the GND pins for “heat spreading”.
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Detail Description
The RS7302 is a low‐dropout linear regulator. The device provides preset 1.8V, 2.5V and 3.3V output voltages for output
current up to 600mA. Other mask options for special output voltages are also available. As illustrated in function block
diagram, it consists of a 0.95V bandgap reference, an error amplifier, a P‐channel pass transistor and an internal feedback
voltage divider.
The 0.95V bandgap reference is connected to the error amplifier, which compares this reference with the feedback voltage
and amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the pass‐transistor gate is
pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is
too high, the pass transistor gate is pulled up to decrease the output voltage.
The output voltage is feedback through an internal resistive divider connected to VOUT pin. Additional blocks include an
output current limiter, thermal sensor, and shutdown logic.
Internal P‐channel Pass Transistor
The RS7302 features a P‐channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P‐channel
MOSFETs require no base drive, which reduces quiescent current. PNP‐based regulators also waste considerable current in
dropout when the pass transistor saturates, and use high base‐drive currents under large loads. The RS7302 does not suffer
from these problems and consumes only 60μA (Typ.) of current consumption under heavy loads as well as in dropout
conditions.
Enable Function
EN pin starts and stops the regulator. When the EN pin is switched to the power off level, the operation of all internal circuit
stops, the build‐in P‐channel MOSFET output transistor between pins VIN and VOUT is switched off, allowing current
consumption to be drastically reduced. The VOUT pin enters the GND level through the internal discharge path between VOUT
and GND pins.
Soft Start Function
The capacitor can be connected between the BYPASS pin and GND. This capacitor can be a low cost Polyester Film variety. A
larger capacitor improves the AC ripple rejection, but also makes the output come up slowly. This "Soft" turn‐on is desirable
in some applications to limit turn‐on surges.
Fast Discharge Function
The RS7302 fixed type has fast discharge Function on EN pin disable. When user turns off the device, its internal pull‐low
resistor will discharge output capacitor charge. It’ll avoid other device to arise wrong motions.
Output Voltage Selection
For fixed voltage type of RS7302, the output voltage is preset at an internally trimmed voltage. The first two digits of part
number suffix identify the output voltage (see Ordering Information). For example, the RS7302‐33 has a preset 3.3V output
voltage.
Current Limit
The RS7302 also includes a fold back current limiter. It monitors and controls the pass transistor’s gate voltage, estimates the
output current, and limits the output current within 1.0A (Typ.)
Thermal Overload Protection
Thermal overload protection limits total power dissipation in the RS7302. When the junction temperature exceeds TJ=+165°C,
a thermal sensor turns off the pass transistor, allowing the IC to cool down. The thermal sensor turns the pass transistor on
again after the junction temperature cools down by 20°C, resulting in a pulsed output during continuous thermal overload
conditions.
Thermal overload protection is designed to protect the RS7302 in the event of fault conditions. For continuous operation, the
absolute maximum operating junction temperature rating of TJ=+125°C should not be exceeded.
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Operating Region and Power Dissipation
Maximum power dissipation of the RS7302 depends on the thermal resistance of the case and circuit board, the temperature
difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is
P=IOUT x (VIN‐VOUT). The resulting maximum power dissipation is:
(TJ −TA) (TJ −TA)
PMAX =
=
θJC + θCA
θJA
Where (TJ‐TA) is the temperature difference between the RS7301 die junction and the surrounding air, θJC is the thermal
resistance of the package chosen, and θCA is the thermal resistance through the printed circuit board, copper traces and
other materials to the surrounding air. For better heat‐sinking, the copper area should be equally shared between the VIN,
VOUT, and GND pins.
Dropout Voltage
A regulator’s minimum input‐output voltage differential, or dropout voltage, determines the lowest usable supply voltage. In
battery‐powered systems, this will determine the useful end‐of‐life battery voltage. The RS7302 use a P‐channel MOSFET
pass transistor, its dropout voltage is a function of drain‐to‐source on‐resistance RDS(ON) multiplied by the load current.
VDROPOUT =VIN −VOUT = RDS (ON ) × IOUT
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SOT‐25 Dimension
NOTES:
A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO‐193 variation AB (5 pin).
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SC‐70‐5 Dimension
NOTES:
A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
D. Falls within JEDEC MO‐203 variation AA.
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SOP‐8 Dimension
NOTES:
A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.006 (0.15) per end.
D. Body width does not include interlead flash. Interlead flash shall not exceed 0.017 (0.43) per side.
E. Falls within JEDEC MS‐012 variation AA.
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Page No. : 10/11
Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface‐mount devices
Figure 1: Temperature profile
t
P
Critical Zone
to T
TP
T
L
P
Ramp-up
TL
t
L
Tsmax
Tsmin
t
S
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp‐up rate (TL to TP)
Preheat
Sn‐Pb Eutectic Assembly
Pb‐Free Assembly
<3oC/sec
<3oC/sec
‐ Temperature Min (Tsmin
)
100oC
150oC
150oC
200oC
‐ Temperature Max (Tsmax
‐ Time (min to max) (ts)
Tsmax to TL
)
60~120 sec
60~180 sec
‐ Ramp‐up Rate
<3oC/sec
<3oC/sec
Time maintained above:
‐ Temperature (TL)
‐ Time (tL)
183oC
217oC
60~150 sec
240oC +0/‐5oC
60~150 sec
260oC +0/‐5oC
Peak Temperature (TP)
Time within 5oC of actual Peak
10~30 sec
20~40 sec
Temperature (tP)
Ramp‐down Rate
Time 25oC to Peak Temperature
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Peak temperature
245oC ±5oC
260oC +0/‐5oC
Dipping time
5sec ±1sec
5sec ±1sec
Pb‐Free devices.
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Important Notice:
© Orister Corporation
Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product.
No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied.
Orister reserves the right to make changes to their products or specifications or to discontinue any product or service
without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and
Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and
operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other
quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of
all parameters of each device is not necessarily performed.
Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this
document are registered trademarks or trademarks of their respective holders.
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