SFH-4052 [OSRAM]

High Power Infrared Emitter;
SFH-4052
型号: SFH-4052
厂家: OSRAM GMBH    OSRAM GMBH
描述:

High Power Infrared Emitter

文件: 总13页 (文件大小:422K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2016-01-27  
High Power Infrared Emitter (850 nm)  
Version 1.2  
SFH 4052  
Features:  
High optical power  
Small package (LxWxH): 3.2 mm x 1.6 mm x 1.1 mm  
CHIPLED with +/-40° halfangle  
Applications  
Miniature photointerrupters  
Industrial electronics  
For control and drive circuits  
Sensor technology  
Notes  
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which  
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety  
precautions given in IEC 60825-1 and IEC 62471.  
Ordering Information  
Type:  
Radiant Intensity  
Ie [mW/sr]  
Ordering Code  
IF=70 mA, tp = 20 ms  
20 (≥ 10)  
SFH 4052  
Q65111A5376  
Note:  
Measured at a solid angle of Ω = 0.01 sr  
2016-01-27  
1
Version 1.2  
SFH 4052  
Maximum Ratings (TA = 25 °C)  
Parameter  
Symbol  
Top; Tstg  
VR  
Values  
Unit  
°C  
V
Operation and storage temperature range  
Reverse voltage  
-40 ... 85  
5
70  
1
Forward current  
IF  
mA  
A
Surge current  
(tp ≤ 10 µs, D = 0)  
IFSM  
Power consumption  
Ptot  
125  
2
mW  
kV  
ESD withstand voltage  
VESD  
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)  
Thermal resistance junction - ambient 1) page 12  
RthJA  
RthJS  
540  
360  
K / W  
K / W  
Thermal resistance junction - soldering point  
2) page 12  
Characteristics (TA = 25 °C)  
Parameter  
Symbol  
Values  
Unit  
Peak wavelength  
(typ)  
(typ)  
(typ)  
λpeak  
860  
850  
30  
nm  
(IF = 70 mA, tp = 20 ms)  
Centroid wavelength  
(IF = 70 mA, tp = 20 ms)  
λcentroid  
∆λ  
nm  
nm  
°
Spectral bandwidth at 50% of Imax  
(IF = 70 mA, tp = 20 ms)  
Half angle  
(typ)  
(typ)  
ϕ
± 40  
Dimensions of active chip area  
L x W  
0.3 x 0.3  
mm x  
mm  
Rise and fall time of Ie ( 10% and 90% of Ie max  
)
(typ)  
tr, tf  
12  
1.45 (≤ 1.75)  
2.4  
ns  
(IF = 70 mA, RL = 50 Ω)  
Forward voltage  
(IF = 70 mA, tp = 20 ms)  
(typ (max)) VF  
(typ (max)) VF  
IR  
V
Forward voltage  
(IF = 1 A, tp = 100 µs)  
V
Reverse current  
(VR = 5 V)  
not designed for ꢀA  
reverse operation  
Total radiant flux  
(IF= 70 mA, tp=20 ms)  
(typ)  
Φe  
40  
mW  
2016-01-27  
2
Version 1.2  
SFH 4052  
Parameter  
Symbol  
Values  
Unit  
Temperature coefficient of Ie or Φe  
(IF = 70 mA, tp = 20 ms)  
(typ)  
(typ)  
(typ)  
TCI  
-0.5  
% / K  
Temperature coefficient of VF  
(IF = 70 mA, tp = 20 ms)  
TCV  
TCλ  
-0.7  
0.3  
mV / K  
nm / K  
Temperature coefficient of wavelength  
(IF = 70 mA, tp = 20 ms)  
Grouping (TA = 25 °C)  
Group  
Min Radiant Intensity  
Max Radiant Intensity Typ Radiant Intensity  
IF=70 mA, tp = 20 ms  
IF=70 mA, tp = 20 ms  
IF = 1 A, tp = 25 µs  
Ie, min [mW / sr]  
Ie, max [mW / sr]  
Ie, typ [mW / sr]  
SFH 4052 - R  
SFH 4052 - S  
SFH 4052 - T  
10  
16  
25  
20  
32  
50  
165  
265  
375  
Note:  
measured at a solid angle of Ω = 0.01 sr  
Only one group in one packing unit (variation lower 2:1).  
Relative Spectral Emission 3) page 12  
Radiant Intensity 3) page 12  
Irel = f(λ), TA = 25°C  
Ie / Ie(70 mA) = f(IF), single pulse, tp = 25 µs,  
TA= 25°C  
OHF04132  
100  
%
OHF05631  
102  
Irel  
Ιe  
Ιe (70 mA)  
80  
60  
40  
20  
0
101  
100  
10-1  
10-2  
10-3  
700  
750  
800  
850  
nm 950  
λ
100  
101  
102 mA 103  
IF  
2016-01-27  
3
Version 1.2  
SFH 4052  
Forward Current 3) page 12  
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C  
Max. Permissible Forward Current  
IF, max = f(TA), RthJA = 540 K / W  
OHF05632  
OHL01713  
100  
A
80  
mA  
IF  
IF  
70  
60  
50  
40  
30  
20  
10  
0
10-1  
5
10-2  
5
10-3  
5
10-4  
0
20  
40  
60  
80 ˚C 100  
0
0.5  
1
1.5  
2
2.5 V 3  
TA  
VF  
Permissible Pulse Handling Capability  
IF = f(tp), TA = 25 °C, duty cycle D = parameter  
Permissible Pulse Handling Capability  
IF = f(tp), TA = 85 °C, duty cycle D = parameter  
OHF05633  
OHF05634  
1.1  
A
1.0  
A
tP  
tP  
tP  
tP  
IF  
IF  
IF  
IF  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
D
= T  
D
= T  
T
T
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
D
=
0.005  
0.01  
0.02  
0.05  
0.1  
D
=
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
0.2  
0.5  
1
1
10-5 10-4 10-3 10-2 10-1 100 101 s 102  
10-5 10-4 10-3 10-2 10-1 100 101 s 102  
tp  
tp  
2016-01-27  
4
Version 1.2  
SFH 4052  
Radiation Characteristics 3) page 12  
Irel = f(ϕ), TA= 25°C  
40˚  
30˚  
20˚  
10˚  
0˚  
OHF04263  
1.0  
50˚  
0.8  
0.6  
0.4  
60˚  
70˚  
0.2  
0
80˚  
90˚  
100˚  
1.0  
0.8  
0.6  
0.4  
0˚  
20˚  
40˚  
60˚  
80˚  
100˚  
120˚  
Package Outline  
Dimensions in mm.  
Package  
Chipled  
2016-01-27  
5
Version 1.2  
SFH 4052  
Approximate Weight:  
5.4 mg  
Note:  
Colour: colourless clear  
Recommended Solder Pad  
Dimensions in mm.  
2016-01-27  
6
Version 1.2  
SFH 4052  
Reflow Soldering Profile  
Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01  
OHA04525  
300  
˚C  
T
250  
T
245 ˚C  
p
240 ˚C  
tP  
tL  
217 ˚C  
200  
150  
tS  
100  
50  
25 ˚C  
0
0
50  
100  
150  
200  
250  
s
300  
t
OHA04612  
Pb-Free (SnAgCu) Assembly  
Profile Feature  
Profil-Charakteristik  
Symbol  
Symbol  
Unit  
Einheit  
Minimum  
Recommendation  
Maximum  
Ramp-up rate to preheat*)  
25 °C to 150 °C  
2
3
K/s  
Time tS  
TSmin to TSmax  
tS  
60  
100  
2
120  
3
s
Ramp-up rate to peak*)  
K/s  
TSmax to TP  
TL  
tL  
Liquidus temperature  
217  
80  
°C  
s
Time above liquidus temperature  
Peak temperature  
100  
TP  
tP  
245  
20  
260  
30  
°C  
s
Time within 5 °C of the specified peak  
temperature TP - 5 K  
10  
3
6
K/s  
s
Ramp-down rate*  
TP to 100 °C  
480  
Time  
25 °C to TP  
All temperatures refer to the center of the package, measured on the top of the component  
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range  
2016-01-27  
7
Version 1.2  
SFH 4052  
Taping  
Dimensions in mm [inch].  
Tape and Reel  
8 mm tape with 2000 pcs. on ∅ 180 mm reel  
W1  
D0  
P0  
P2  
Label  
P1  
Direction of unreeling  
Direction of unreeling  
W2  
Leader: min0 4±± mm *  
Trailer: min0 16± mm *  
*) Dimensions acc0 to IEC 6±.86-3; EIA 481-D  
OHAY0324  
2016-01-27  
8
Version 1.2  
SFH 4052  
Tape dimensions [mm]  
Tape dimensions in mm  
W
E
F
P0  
P1  
P2  
D0  
8 + 0.3 / -0.1 4 ± 0.1  
2 ± 0.05  
or  
4 ± 0.1  
2 ± 0.05  
1.5 ± 0.1  
1.75 ± 0.1  
3.5 ± 0.05  
Reel dimensions [mm]  
Reel dimensions in mm  
A
W
Nmin  
60  
W1  
W2max  
14.4  
180  
8
8.4 + 2  
Barcode-Product-Label (BPL)  
OSRAM Opto  
BIN1: XX-XX-X-XXX-X  
LX XXXX  
Semiconductors  
RoHS Compliant  
(6P) BATCH NO: 1234567890  
(1T) LOT NO: 1234567890  
ML Temp ST  
XXX °C X  
X
(9D) D/C: 1234  
Pack: RXX  
DEMY XXX  
X_X123_1234.1234 X  
(X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X  
OHA04563  
Dry Packing Process and Materials  
Moisture-sensitive label or print  
Barcode label  
OSRAM  
Humidity indicator  
Barcode label  
D o n o t e a t .  
A v o i d m e t a l c o n t a c t .  
D i s c a r d i f c i r c l e s o v e r r u n .  
b a g o p e n i n g .  
P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e r  
c h e c k d o t  
C o m p a r a t o r  
W E T  
b a k e u n i t s  
e x a m i n e u n i t s , i f n e c e s s a r y  
1 5 %  
I f w e t ,  
b a k e u n i t s  
e x a m i n e u n i t s , i f n e c e s s a r y  
1 0 %  
I f w e t ,  
c h a n g e d e s i c c a n t  
p a r t s s t i l l a d e q a t e l y d r y .  
I f w e t ,  
u
5 %  
M I L - I - 8 8 3 5  
H u m i d i t y I n d i c a t o r  
OSRAM  
Desiccant  
OHA00539  
Note:  
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.  
Regarding dry pack you will find further information in the internet. Here you will also find the normative  
references like JEDEC.  
2016-01-27  
9
Version 1.2  
SFH 4052  
Transportation Packing and Materials  
Barcode label  
Barcode label  
Bin1: P-1-20  
Bin2: Q-1-20  
Bin3:  
Temp ST  
220  
240 C R  
260  
C
R
DEMY  
R18  
ML  
2
C
RT  
LSY T676  
Multi T
2a  
3
Additional TEXT  
R077  
PACKVAR:  
P-1+Q-1  
(G) GROUP:  
0144  
(9D) D/C:  
210021998  
2000  
OSRAM Opto  
Semiconductors  
(Q)QTY:  
123GH1234  
(6P) BATCH NO:  
5
2
4
1
0
0
1
(1T) LOT NO:  
1
(X) PROD NO:  
Bin1: P-1-20  
Bin2: Q-1-20  
Bin3:  
Temp ST  
220  
240  
260  
C
R
C
DEMY  
R18  
ML  
R
C RT  
2
LSY T676  
2a  
3
Additional TEXT  
R077  
PACKVAR:  
Multi TOP
P-1+Q-1  
(G) GROUP:  
0144  
(9D) D/C:  
210021998  
2000  
OSRAM Opto  
Semiconductors  
(Q)QTY:  
123GH1234  
(6P) BATCH NO:  
5
2
4
1
0
0
1
(1T) LOT NO:  
1
OSRAM  
(X) PROD NO:  
Packing  
Sealing label  
OHA02044  
Dimensions of transportation box in mm  
Width  
Length  
Height  
200 ± 5  
195 ± 5  
30 ± 5  
2016-01-27  
10  
Version 1.2  
SFH 4052  
Disclaimer  
Language english will prevail in case of any discrepancies or deviations between the two language wordings.  
Attention please!  
The information describes the type of component and shall not be considered as assured characteristics.  
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain  
dangerous substances.  
For information on the types in question please contact our Sales Organization.  
If printed or downloaded, please find the latest version in the Internet.  
Packing  
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.  
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing  
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any  
costs incurred.  
Components used in life-support devices or systems must be expressly authorized for such purpose!  
Critical components* may only be used in life-support devices** or systems with the express written approval of  
OSRAM OS.  
*) A critical component is a component used in a life-support device or system whose failure can reasonably be  
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that  
device or system.  
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or  
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be  
endangered.  
2016-01-27  
11  
Version 1.2  
SFH 4052  
Glossary  
1)  
Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 5 mm2 each  
2)  
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)  
3)  
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or  
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily  
correspond to the actual parameters of each single product, which could differ from the typical data and calculated  
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data  
will be changed without any further notice.  
2016-01-27  
12  
Version 1.2  
SFH 4052  
Published by OSRAM Opto Semiconductors GmbH  
Leibnizstraße 4, D-93055 Regensburg  
www.osram-os.com © All Rights Reserved.  
2016-01-27  
13  

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