SFH4235 [OSRAM]
IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung; IR- Lumineszenzdiode （ 850纳米），麻省理工学院达赫Ausgangsleistung
| 型号： | SFH4235 |
| 厂家： | 
OSRAM GMBH |
| 描述： | IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung |
| 文件： | 总9页 (文件大小：159K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4235
Wesentliche Merkmale
Features
• IR-Lichtquelle mit hohem Wirkungsgrad
• Chipgröße (emittierende Fläche) 1 x 1 mm2
• max. Gleichstrom 1 A
• IR lightsource with high efficiency
• die-size (emitting area) 1 x 1 mm2
• max. DC-current 1 A
• niedriger Wärmewiderstand (9 K/W)
• Schwerpunktswellenlänge 850 nm
• ESD-sicher bis 2 kV nach JESD22-A114-E
• Erweiterte Korrosionsfestigkeit
• Low thermal resistance (9 K/W)
• Center of spectral emission at 850 nm
• ESD safe up to 2 kV acc. to JESD22-A114-E
• Superior Corrosion Robustness
(see chapter package outlines)
(s.a. Abschnitt Maßzeichnung)
Anwendungen
Applications
• Infrarotbeleuchtung für Kameras
• Überwachungssysteme
• Infrared Illumination for cameras
• Surveillance systems
• Fahrer-Assistenz Systeme
• Beleuchtung für Bilderkennungssysteme
• Driver assistance systems
• Machine vision systems
Sicherheitshinweise
Safety Advices
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare Infrarot-
Strahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheits-
richtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
Typ
Type
Bestellnummer
Ordering Code
Gesamtstrahlungsfluss1) (IF = 1A, tp = 10 ms)
Total Radiant Flux1)
Φe (mW)
SFH 4235
Q65110A8900
≥ 630 (typ. 950)
1) gemessen mit Ulbrichtkugel / measured with integrating sphere
2011-03-30
1
SFH 4235
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Top , Tstg
– 40 … + 125
°C
Operating and storage temperature range
Sperrschichttemperatur
Junction temperature
TJ
+ 145
°C
V
Sperrspannung
Reverse voltage
VR
1
Vorwärtsgleichstrom
Forward current
IF
1
A
Stoßstrom, tp = 200 µs, D = 0
Surge current
IFSM
Ptot
5
A
Leistungsaufnahme
Power consumption
3.4
9
W
K/W
Wärmewiderstand Sperrschicht - Lötstelle
Thermal resistance junction - soldering point
RthJS
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 1 A, tp = 10 ms
λpeak
λcentroid
Δλ
860
850
30
nm
nm
nm
Centroid-Wellenlänge der Strahlung
Centroid wavelength
IF = 1 A, tp = 10 ms
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 1 A, tp = 10 ms
Abstrahlwinkel
Half angle
ϕ
± 60
1
Grad
deg.
mm2
Aktive Chipfläche
Active chip area
A
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
1 × 1
mm²
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SFH 4235
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Schaltzeiten, Ie von 10% auf 90% und von 90% tr / tf
auf 10%, IF = 5 A, RL = 50 Ω
7 / 14
ns
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 5 A, RL = 50 Ω
Durchlassspannung
Forward voltage
IF = 1 A, tp = 100 µs
IF = 5 A, tp = 100 µs
VF
VF
3.0 (< 3.4)
3.5 (< 4.5)
V
V
Strahlstärke
Ie typ
320
mW/sr
Radiant intensity
IF = 1 A, tp = 100 μs
Temperaturkoeffizient von Ie bzw. Φe
Temperature coefficient of Ie or Φe
IF = 1 A, tp = 10 ms
TCI
– 0.3
– 2
%/K
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 1 A, tp = 10 ms
TCV
mV/K
nm/K
Temperaturkoeffizient von λ
Temperature coefficient of λ
IF = 1 A, tp = 10 ms
TCλ,centroid
+ 0.3
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SFH 4235
Gesamtstrahlungsfluss1) Φe
Total Radiant Flux1) Φe
Bezeichnung
Parameter
Symbol
Werte
Values
Einheit
Unit
-EA
-EB
Gesamtstrahlungsfluss
Total Radiant Flux
Φe min
Φe max
630
1000
800
1250
mW
mW
IF = 1 A, tp = 10 ms
1)
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 1.6:1) /
Only one group in one packing unit (variation lower 1.6:1)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
OHL01660
40˚
30˚
20˚
10˚
0˚
ϕ
1.0
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
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SFH 4235
Relative spektrale Emission
Relative Spectral Emission
Durchlassstrom
Forward Current
IF = f (VF)
Relativer Gesamtstrahlungsfluss
Relative Total Radiant Flux
Φe/Φe(1A) = f (IF)
Irel = f (λ)
Single pulse, tp = 100 μs
Single pulse, tp = 100 μs
OHF04188
OHF04187
101
OHF04132
101
100
A
Φe
Φe (1 A)
%
IF
Irel
80
60
40
20
100
5
100
5
10-1
5
10-1
5
10-2
5
10-2
10-3
0
10-2
5
10-1
5
100
101
2
2.5
3
3.5
V
VF
4
700
750
800
850
nm 950
λ
A
IF
Max. zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (TA), RthJS = 9 K/W
Zulässige Impulsbelastbarkeit
Permissible Pulse Handling
Capability IF = f (tp), TS = 85 °C,
Duty cycle D = parameter
OHF04189
OHF04190
5.5
A
1.1
tP
A
tP
IF
IF
IF
D
= T
T
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
D
=
0.005
0.01
0.02
0.05
0.1
0.2
0.33
0.5
1
0
20 40 60 80 100 ˚C 130
10-5 10-4 10-3 10-2 10-1 100 101 s 102
TS
tp
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SFH 4235
Maßzeichnung1)
Package Outlines
0...0.1 (0.004)
6.2 (0.244)
5.8 (0.228)
4.25 (0.167)
4.15 (0.163)
0.65 (0.026)
0.45 (0.018)
ø0.81 (0.031)
ø0.73 (0.028)
(R0.85 (0.033))
Cathode
1.9 (0.075)
1.7 (0.067)
1.1 (0.043)
0.9 (0.035)
2.0 (0.079)
1.6 (0.063)
GPLY7072
Korrosionsfestigkeit besser als EN 60068-2-60 (method 4):
mit erweitertem Korrosionstest: 40°C / 90%rh / 15ppm H2S / 336h
Corrosion robustness better than EN 60068-2-60 (method 4):
with enhanced corrosion test: 40°C / 90%rh / 15ppm H2S / 336h
Kathodenkennung:
Cathode mark:
Markierung
mark
Gewicht / Approx. weight:
0.2 g
Gurtung / Polarität und Lage
Method of Taping / Polarity and Orientation
Verpackungseinheit 800/Rolle, ø180 mm
Packing unit 800/reel, ø180 mm
Cathode/Collector Side
4 (0.157)
0.3 (0.012)
0.3 (0.012)
1.55 (0.061)
2 (0.079)
6.35 (0.250)
8 (0.315)
1.9 (0.075)
OHAY0508
1)
Maße in mm (inch) / Dimensions in mm (inch)
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SFH 4235
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
12.0 (0.472)
11.6 (0.457)
11.6 (0.457)
1.6 (0.063)
3 Lötstellen
ø2.5 (0.098)
3 solder points
ø4.0 (0.157)
Heatsink attach
ø4.0 (0.157)
1.6 (0.063)
Kupfer
Copper
Thermisch optimiertes PCB
Thermal enhanced PCB
Lötstopplack
Solder resist
Footprint
Lötpasten Schablone
Solder paste stencil
Bare Copper
Freies Kupfer
OHAY0681
Achtung:
Anode und Heatsink sind elektrisch verbunden
Attention:
Anode and Heatsink are electrically connected
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SFH 4235
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions
Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
(nach J-STD-020C)
(acc. to J-STD-020C)
OHLA0687
300
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
+0 ˚C
-5 ˚C
260 ˚C
245 ˚C
235 ˚C
255 ˚C
240 ˚C
250
T
5 ˚C
+5 ˚C
-0 ˚C
217 ˚C
10 s min
200
150
100
50
30 s max
Ramp Down
6 K/s (max)
100 s max
120 s max
Ramp Up
3 K/s (max)
25 ˚C
0
0
50
100
150
200
250
s
300
t
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2011-03-30
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Mouser Electronics
Related Product Links
720-SFH4235 - Osram Opto Semiconductor SFH 4235
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