SFH4685 [OSRAM]
Engwinklige LED im MIDLED-Gehäuse (880 nm); Engwinklige LED IM MIDLED - Gehäuse （ 880纳米）
| 型号： | SFH4685 |
| 厂家： | 
OSRAM GMBH |
| 描述： | Engwinklige LED im MIDLED-Gehäuse (880 nm) |
| 文件： | 总8页 (文件大小：173K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Engwinklige LED im MIDLED-Gehäuse (880 nm)
Narrow beam LED in MIDLED package (880 nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4680
SFH 4685
SFH 4680
SFH 4685
Wesentliche Merkmale
Features
• AlGaAs-LED
• AlGaAs-LED
• Enger Abstrahlwinkel (± 20°)
• Geringe Bauhöhe
• Narrow halfangle (± 20°)
• Low profile component
• Als Toplooker und Sidelooker einsetzbar
• SFH 4680: Gurtung als Toplooker
SFH 4685: Gurtung als Sidelooker
• Usable as top-looking and side-looking device
• SFH 4680: Taping as Toplooker
SFH 4685: Taping as Sidelooker
Anwendungen
Applications
• Sensorik in der Automobiltechnik
• Datenübertragung
• Fernsteuerrung
• Automotive sensors
• Data transmission
• Remote controls
Sicherheitshinweise
Safety Advices
Je nach Betriebsart emittieren diese Bauteile Depending on the mode of operation, these
hochkonzentrierte, nicht sichtbare Infrarot- devices emit highly concentrated non visible
Strahlung, die gefährlich für das menschliche infrared light which can be hazardous to the
Auge sein kann. Produkte, die diese Bauteile human eye. Products which incorporate these
enthalten, müssen gemäß den Sicherheits- devices have to follow the safety precautions
richtlinien der IEC-Normen 60825-1 und 62471 given in IEC 60825-1 and IEC 62471.
behandelt werden.
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4680
SFH 4685
Q65110A1570
Q65110A1571
≥ 10 (typ. 20)
≥ 10 (typ. 20)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
2009-03-19
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SFH 4680, SFH 4685
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Top , Tstg
– 40 … + 100
°C
Operating and storage temperature range
Sperrspannung
Reverse voltage
VR
5
V
Vorwärtsgleichstrom, TA ≤ 60 °C
Forward current
IF
100
1
mA
A
Stoßstrom, tp = 300 μs, D = 0, TA ≤ 60 °C
Surge current
IFSM
Ptot
Verlustleistung TA = 25 °C
Power dissipation
180
340
mW
K/W
Wärmewiderstand Sperrschicht - Umgebung bei RthJA
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
RthJS
180
K/W
Thermal resistance junction - soldering point,
mounted on metal block
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak
880
nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA
Δλ
80
nm
Abstrahlwinkel
Half angle
ϕ
± 20
Grad
deg.
Aktive Chipfläche
Active chip area
0.09
mm2
A
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.3 × 0.3
mm²
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SFH 4680, SFH 4685
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Schaltzeiten, Ie von 10% auf 90% und von 90% tr, tf
auf 10%, bei IF = 100 mA, RL = 50 Ω
0.5
µs
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
VF
1.5 (< 1.8)
3.0 (< 3.8)
V
V
Sperrstrom
Reverse current
VR = 5 V
IR
not designed for μA
reverse
operation
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe typ
TCI
23
mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
– 0.5
%/K
Temperature coefficient of Ie or Φe, IF = 100 mA
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV
TCλ
– 2
mV/K
nm/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
+ 0.25
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SFH 4680, SFH 4685
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Werte
Values
Einheit
Unit
-R
-S
-T
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
10
20
16
32
25
50
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 μs
1)
Ie typ
130
160
240
mW/sr
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one group in one packing unit (variation lower 2:1)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
40˚
30˚
20˚
10˚
0˚
OHF02432
1.0
50˚
0.8
0.6
0.4
60˚
70˚
0.2
0
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
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SFH 4680, SFH 4685
Ie
= f (IF)
Relative Spectral Emission
Irel = f (λ)
Radiant Intensity
Max. Permissible Forward Current
Ie 100 mA
IF = f (TA), RthJA = 340 K/W
OHF02533
Single pulse, tp = 20 μs
110
OHR00878
OHR00877
10 2
100
%
mA
Ι e
IF
Ι e (100mA)
90
Ι rel
80
10 1
80
70
60
50
40
30
20
10
0
60
40
20
0
10 0
10 -1
10 -2
10 -3
0
20
40
60
80 ˚C 100
10 0
10 1
10 2
10 3 mA 10 4
750
800
850
900
950 nm 1000
TA
λ
Ι F
Forward Current IF = f (VF)
Single pulse, tp = 20 μs
Permissible Pulse Handling
Capability IF = f (τ), TA ≤ 60 °C,
duty cycle D = parameter
OHF02532
1.2
A
OHR00881
10 1
tP
tP
IF
IF
D
= T
A
Ι F
T
1.0
0.8
0.6
0.4
0.2
0
10 0
10 -1
10 -2
10 -3
D
=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
0
1
2
3
4
5
6
V
8
10-5 10-4 10-3 10-2 10-1 100 101 s 102
VF
tp
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SFH 4680, SFH 4685
Maßzeichnung
Package Outlines
3.3
2.9
0.75
0.75
Silicone area1)
Isolating area
0.55
0.42
0.55
0.42
(1.2)
1.7
1.5
(0.8)
Pad 1
Pad 2
Backside
metallisation
metallisation
metallisation
1) Device casted with silicone.
Avoid mechanical stress on silicone surface.
OHF02956
Maße in mm / Dimensions in mm.
Gehäuse / Package
MID mit klarem Silikonverguss / MID casted with clear Silicone
Anschlussbelegung
Pin configuration
Pad 1 = Anode / anode
Pad 2 = Kathode / cathode
Gurtung / Polarität und Lage
Verpackungseinheit 2000/Rolle, ø180 mm
oder 9000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation
Packing unit 2000/reel, ø180 mm
or 9000/reel, ø330 mm
Pad 1 Orientation
1.5 (0.059) +0.1 (0.004)
4 (0.157) 2 (0.079)
0.3 (0.012)
±0.05 (0.002)
±0.02 (0.001)
±0.05 (0.002)
1.7 (0.067)
3.3 (0.130)
Optical axis/viewing direction
±0.05 (0.002)
2.45 (0.096)
±0.15 (0.006)
OHAY2430
Maße in mm (inch) / Dimensions in mm (inch).
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SFH 4680, SFH 4685
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
SFH 4680
2.4
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for improved
heat dissipation
Cu-Fläche > 16 mm2
Cu-area
Lötstopplack
Solder resist
OHF02422
SFH 4685
1.7
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for improved
heat dissipation
Cu-Fläche > 16 mm2
Cu-area
Lötstopplack
Solder resist
OHF02421
Maße in mm / Dimensions in mm.
Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der
Bauteiloberfläche sollte so gering wie möglich gehalten werden.
Handling indication:
The package is casted with silicone. Mechanical stress at the surface of
the unit should be as low as possible.
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SFH 4680, SFH 4685
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020C)
(acc. to J-STD-020C)
OHLA0687
300
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
+0 ˚C
-5 ˚C
260 ˚C
245 ˚C
235 ˚C
255 ˚C
240 ˚C
250
T
±5 ˚C
+5 ˚C
-0 ˚C
217 ˚C
10 s min
200
150
100
50
30 s max
Ramp Down
6 K/s (max)
100 s max
120 s max
Ramp Up
3 K/s (max)
25 ˚C
0
0
50
100
150
200
250
s
300
t
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
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